LD173C104MAB2A [KYOCERA AVX]
Low Inductance Cap;型号: | LD173C104MAB2A |
厂家: | KYOCERA AVX |
描述: | Low Inductance Cap |
文件: | 总144页 (文件大小:2512K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Version 17.11
Ceramic Chip Capacitors
Table of Contents
MLCC Low Profile
General Specifications / Capacitance Range............................54
How to Order - AVX Part Number Explanation...........2-3
C0G (NP0) Dielectric
Automotive MLCC
General Specifications.........................................................55-56
Capacitance Range..............................................................57-59
General Specifications .................................................................4
Specifications and Test Methods.................................................5
Capacitance Range..................................................................6-7
U Dielectric
APS for COTS+ Applications
RF/Microwave C0G (NP0) Capaciators (RoHS)
General Information and Capacitance Range ....................8-10
RF/Microwave C0G (NP0) Capaciators (Sn/Pb)
General Information and Capacitance Range ..................11-12
RF/Microwave C0G (NP0) Capaciators (RoHS)
AEC-Q200 Qualified..........................................................13-14
Designer Kits ..............................................................................15
General Specifications ...............................................................60
Capacitance Range..............................................................61-63
MLCC with FLEXITERM®
General Description....................................................................64
Specifications and Test Methods.........................................65-66
Capacitance Range..............................................................67-68
FLEXISAFE MLC Chips
General Specifications and Capacitance Range.......................69
X8R/X8L Dielectric
General Specifications.........................................................16-17
Specifications and Test Methods...............................................18
Capacitor Array
Capacitor Array (IPC) ...........................................................70-73
Automotive Capacitor Array (IPC)..............................................74
Part and Pad Layout Dimensions ..............................................75
X7R Dielectric
General Specifications ...............................................................19
Specifications and Test Methods...............................................20
Capacitance Range..............................................................21-22
Low Inductance Capacitors
Introduction ...................................................................76-77
LICC (Low Inductance Chip Capacitors) ..........................78-81
IDC (InterDigitated Capacitors)............................................82-85
LGA (Low Inductance Capacitors) ...................................86-88
X7S Dielectric
General Specifications ...............................................................23
Specifications and Test Methods...............................................24
Capacitance Range....................................................................25
High Temperature MLCCs
AT Series 200ºC & 250ºC Rated MLCCs ..........................89-94
X5R Dielectric
General Specifications ...............................................................26
Specifications and Test Methods...............................................27
Capacitance Range..............................................................28-29
High Voltage MLC Chips
600V to 5000V Applications ............................................95-99
Tin/Lead Termination “B” - 600V to 5000V Applications...100-101
FLEXITERM® - 600V to 5000V Applications..................102-106
600V to 3000V Automotive Applications – AEC-Q200...107-108
Y5V Dielectric
General Specifications ...............................................................30
Specifications and Test Methods...............................................31
Capacitance Range....................................................................32
MIL-PRF-55681/Chips
CDR01 thru CDR06 .........................................................109-110
CDR31 thru CDR35 .........................................................111-114
MLCC Gold Termination (AU Series)
General Specifications ...............................................................33
Capacitance Range..............................................................34-39
MLCC Medical
MQ Series ........................................................................115-123
MM Series........................................................................124-128
MLCC Tin/Lead Termination (LD Series)
C0G (NP0) General Specifications.............................................40
Specifications and Test Methods ............................41
Capacitance Range ...........................................42-43
Packaging of Chip Components.....................................129
Embossed Carrier Configuration - 8 & 12mm Tape...130
Paper Carrier Configuration - 8 & 12mm Tape............131
X8R
X7R
X5R
General Specifications.............................................44
Specifications and Test Methods ............................45
Capacitance Range .................................................46
General Specifications.............................................47
Specifications and Test Methods ............................48
Capacitance Range ...........................................49-50
General Specifications.............................................51
Specifications and Test Methods ............................52
Capacitance Range .................................................53
Basic Capacitor Formulas................................................132
General Description...................................................133-137
Surface Mounting Guide...........................................138-142
How to Order
Part Number Explanation
Commercial Surface Mount Chips
EXAMPLE: 08055A101JAT2A
0805
5
A
101
J*
A
T
2
A**
Size
Voltage
Dielectric Capacitance Tolerance
Failure
Rate
A = N/A
Terminations
T = Plated Ni
and Sn
7 = Gold Plated
U = Conductive
Expoxy for
Packaging
Available
2 = 7" Reel
4 = 13" Reel
U = 4mm TR
(01005)
Special
Code
(L" x W") 4 = 4V
A = NP0(C0G)
C = X7R
2 Sig. Fig +
No. of Zeros
Examples:
B = .10 pF
C = .25 pF
D = .50 pF
F = 1ꢀ
0101*
0201
0402
0603
0805
1206
1210
1812
1825
2220
2225
6 = 6.3V
Z = 10V
Y = 16V
3 = 25V
D = 35V
5 = 50V
1 = 100V
2 = 200V
7 = 500V
A = Std
D = X5R
F = X8R
G = Y5V
4 = Automotive
K = 30K (0603 2mm pitch)
22K (0805/1206
<0.030"/ 0.76mm)
H = 18K (0603/0805/1206
<0.037” / 0.94mm)
J = 15K (0805/1206
<0.050” / 1.27mm)
1 = 12K (0805/1206
<0.055 / 1.4mm)
**Non std options upon
approval from the factory
100 = 10 pF
101 = 100 pF
(≥ 10 pF)
U = U Series 102 = 1000 pF
G = 2ꢀ
Hybrid
W = X6S
Z = X7S
223 = 22000 pF
224 = 220000 pF J = 5ꢀ
(≥ 10 pF)
Applications
Z = FLEXITERM®
*X = FLEXITERM®
with 5ꢀ min
lead (X7R &
Contact
Factory For
Multiples
105 = 1μF
106 = 10μF
107 = 100μF
For values below
10 pF, use “R”
in place of
K = 10ꢀ
M = 20ꢀ
Z = +80ꢀ,
-20ꢀ
P = +100ꢀ,
-0ꢀ
Contact Factory for
Special Voltages
F = 63V
* = 75V
E = 150V 8 = 400V
V = 250V
X8R only)
*EIA 01005
Contact
Factory For
1 = Pd/Ag Term
9 = 300V
X = 350V
Decimal point, e.g.,
9.1 pF = 9R1.
* B, C & D tolerance for ≤10 pF values.
Standard Tape and Reel material (Paper/Embossed) depends upon chip size and thickness.
See individual part tables for tape material type for each capacitance value.
NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.
For Tin/Lead Terminations, please refer to LD Series
High Voltage MLC Chips
EXAMPLE: 1808AA271KA11A
1808
A
A
271
K
A
T
2
A
AVX
Style
0805
1206
1210
1808
1812
1825
2220
2225
3640
Voltage
Temperature Capacitance Capacitance
Failure
Rate
Packaging/
Marking
2 = 7" Reel
4 = 13" Reel
Special
Code
A = Standard
Termination
1= Pd/Ag
T = Plated Ni
and Sn
B = 5ꢀ Min Pb
Z = FLEXITERM®
*X = FLEXITERM®
with 5ꢀ min
C = 600V/630V Coefficient
Code
(2 significant digits
+ no. of zeros)
Examples:
10 pF = 100
100 pF = 101
Tolerance
C0G: J = 5ꢀ
K = 10ꢀ
M = 20ꢀ
X7R: K = 10ꢀ
M = 20ꢀ
A = 1000V
S = 1500V
G = 2000V
W = 2500V
H = 3000V
J = 4000V
K = 5000V
A = C0G
C = X7R
A=Not
Applicable
1,000 pF = 102
22,000 pF = 223
220,000 pF = 224
1 μF = 105
Z = +80ꢀ,
-20ꢀ
lead (X7R only)
NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.
For Tin/Lead Terminations, please refer to LD Series
*
Not RoHS Compliant
For RoHS compliant products,
please select correct termination style.
REV 1
2
How to Order
Part Number Explanation
Capacitor Array
EXAMPLE: W2A43C103MAT2A
W
2
A
4
3
C
103
M
A
T
2A
Style
W = RoHS
L = SnPb
Case Array Number Voltage Dielectric Capacitance Capacitance
Failure
Termination
Packaging &
Quantity
Code
J = 5ꢀ A = Commercial T = Plated Ni and Sn
Size
of Caps
Code (In pF)
2 Sig Digits +
Number of
Zeros
Tolerance
Rate
Code
Z = 10V
Y = 16V
3 = 25V
5 = 50V
1 = 100V
A = NP0
C = X7R
D = X5R
1 = 0405
2 = 0508
3 = 0612
Z = FLEXITERM®
*B = 5ꢀ min lead
*X = FLEXITERM®
with 5ꢀ min lead
2A = 7" Reel
(4000)
K = 10ꢀ 4 = Automotive
M = 20ꢀ
4A = 13" Reel
(10000)
2F = 7" Reel
(1000)
NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.
Low Inductance Capacitors (LICC)
EXAMPLE: 0612ZD105MAT2A
0612
Z
D
105
M
A
T
2
A
Size
0306
0508
0612
Voltage
6 = 6.3V
Z = 10V
Y = 16V
3 = 25V
5 = 50V
Dielectric
C = X7R
D = X5R
Capacitance
Code (In pF)
2 Sig. Digits +
Number of Zeros
Capacitance
Tolerance
K = 10ꢀ
Failure Rate Terminations
Packaging
Available
2 = 7" Reel
4 = 13" Reel
Thickness
See Page 81
for Codes
A = N/A
T = Plated Ni
and Sn
M = 20ꢀ
*
B = 5ꢀ min
*LD16
*LD17
*LD18
lead
NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.
Interdigitated Capacitors (IDC)
EXAMPLE: W3L16D225MAT3A
225
M
W
3
L
1
6
D
A
T
3
A
Capacitance Capacitance
Style
W = RoHS
L = SnPb
Case
Size
Low
Number
of
Terminals
1 = 8 Terminals
Voltage Dielectric
Failure
Rate
A = N/A
Termination Packaging
Thickness
Max. Thickness
mm (in.)
Code (In pF)
2 Sig. Digits +
Number of
Zeros
Tolerance
Inductance
4 = 4V
C = X7R
D = X5R
T = Plated Ni
and Sn
Available
M = 20
2 = 0508 ESL = 50pH
3 = 0612 ESL = 60pH
6 = 6.3V
Z = 10V
Y = 16V
1=7" Reel
3=13" Reel A=0.95 (0.037)
S=0.55 (0.022)
*
B = 5ꢀ min
Lead
NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.
Low Inductance Decoupling Capacitor Arrays (LICA)
EXAMPLE: LICA3T183M3FC4AA
4
A
A
LICA
3
T
102
M
3
F
C
# of
Inspection
Code
Code
Face
Style Voltage Dielectric Cap/Section Capacitance Height
Termination
Reel Packaging
Caps/Part
&
5V = 9 D = X5R
(EIA Code)
Tolerance
Code
*F = C4 Solder
M = 7" Reel
1 = one A = Standard
2 = two B = Established B = No Bar
4 = four
A = Bar
Size
10V = Z T = T55T 102 = 1000 pF M = 20ꢀ 6 = 0.500mm
25V = 3 S = High K 103 = 10 nF
T55T 104 = 100 nF
Balls- 97Pb/3Sn R = 13" Reel
P = GMV 3 = 0.650mm H = C4 Solder
1 = 0.875mm
6 = 2"x2" Waffle Pack
Reliability
Testing
C = Dot, S55S
Dielectrics
D = Triangle
Balls–Low ESR 8 = 2"x2" Black Waffle
5 = 1.100mm P = Cr-Cu-Au
7 = 1.600mm N = Cr-Ni-Au
X = None
Pack
*
Not RoHS Compliant
7 = 2"x2" Waffle Pack
w/ termination
facing up
A = 2"x2" Black Waffle
Pack
w/ termination
facing up
C = 4"x4" Waffle Pack
w/ clear lid
NOTE: Contact factory for
availability of Termination and
Tolerance Options for Specific
Part Numbers.
REV 1
3
C0G (NP0) Dielectric
General Specifications
C0G (NP0) is the most popular formulation of the
“temperature-compensating,” EIA Class I ceramic
materials. Modern C0G (NP0) formulations contain
neodymium, samarium and other rare earth oxides.
C0G (NP0) ceramics offer one of the most stable
capacitor dielectrics available. Capacitance change with
temperature is 0 ±±0ppmꢀ/C which is less than ±0.±ꢁ ⌬C
from -55/C to +125/C. Capacitance drift or hysteresis for
C0G (NP0) ceramics is negligible at less than ±0.05ꢁ
versus up to ±2ꢁ for films. Typical capacitance change
with life is less than ±0.1ꢁ for C0G (NP0), one-fifth that
shown by most other dielectrics. C0G (NP0) formulations
show no aging characteristics.
PART NUMBER (see page 2 for complete part number explanation)
0805
A
101
J
A
T
2
A
5
Size
Dielectric
Capacitance
Code (In pF)
2 Sig. Digits +
Capacitance
Tolerance
Failure
Rate
Terminations
T = Plated Ni
and Sn
Packaging
2 = 7" Reel
Special
Code
Voltage
6.3V = 6
10V = Z
16V = Y
25V = 3
50V = 5
100V = 1
200V = 2
500V = 7
(L" x W")
C0G (NP0) = A
B
=
.10 ꢀp (ꢁ10ꢀp)
A = Not
4 = 13" Reel
U = 4mm TR
(01005)
A = Std.
Product
C = .25 ꢀp (ꢁ10ꢀp)
D = .50 ꢀp (ꢁ10ꢀp)
Aꢀꢀlicable
Number of Zeros
Contact
Factory For
p
=
1ꢂ (ꢃ 10 ꢀp)
G = 2ꢂ (ꢃ 10 ꢀp)
1 = Pd/Ag Term
7 = Gold Plated
NOT RoHS
J
=
=
5ꢂ
K
10ꢂ
Contact Factory
For Multiples
COMPLIANT
NOTE: Contact factory for availability of Termination and Tolerance Oꢀtions for Sꢀecific Part Numbers.
Contact factory for non-sꢀecified caꢀacitance values.
Insulation Resistance vs Temperature
10,000
1,000
100
0
40
60
80
100
0
20
Temperature °C
100917
4
C0G (NP0) Dielectric
Specifications and Test Methods
Parameter/Test
Operating Temperature Range
Capacitance
NP0 Specification Limits
Measuring Conditions
Temꢀerature Cycle Chamber
-55ºC to +125ºC
Within sꢀecified tolerance
ꢁ30 ꢀp: Qꢃ 400+20 x Caꢀ Value
ꢃ30 ꢀp: Qꢃ 1000
preq.: 1.0 MHz 10ꢂ for caꢀ ꢄ 1000 ꢀp
1.0 kHz 10ꢂ for caꢀ ꢅ 1000 ꢀp
Voltage: 1.0Vrms .2V
Q
100,000MΩ or 1000MΩ - µp,
whichever is less
Charge device with rated voltage for
60 5 secs ꢆ room temꢀꢇhumidity
Charge device with 250ꢂ of rated voltage for
1-5 seconds, wꢇcharge and discharge current
limited to 50 mA (max)
Insulation Resistance
Dielectric Strength
No breakdown or visual defects
Note: Charge device with 150ꢂ of rated
voltage for 500V devices.
Aꢀꢀearance
Caꢀacitance
No defects
5ꢂ or .5 ꢀp, whichever is greater
Deflection: 2mm
Test Time: 30 seconds
Resistance to
Flexure
Variation
Q
Meets Initial Values (As Above)
ꢃ Initial Value x 0.3
ꢃ 95ꢂ of each terminal should be covered
with fresh solder
No defects, ꢁ25ꢂ leaching of either end terminal
Stresses
Insulation
Resistance
Diꢀ device in eutectic solder at 230 5ºC
for 5.0 0.5 seconds
Solderability
Aꢀꢀearance
Caꢀacitance
Variation
ꢄ 2.5ꢂ or .25 ꢀp, whichever is greater
Diꢀ device in eutectic solder at 260ºC for 60
seconds. Store at room temꢀerature for 24
2
Resistance to
Solder Heat
Q
Meets Initial Values (As Above)
Meets Initial Values (As Above)
hours before measuring electrical ꢀroꢀerties.
Insulation
Resistance
Dielectric
Meets Initial Values (As Above)
No visual defects
ꢄ 2.5ꢂ or .25 ꢀp, whichever is greater
Strength
Aꢀꢀearance
Caꢀacitance
Variation
Steꢀ 1: -55ºC 2º
Steꢀ 2: Room Temꢀ
30 3 minutes
ꢄ 3 minutes
Thermal
Shock
Q
Meets Initial Values (As Above)
Meets Initial Values (As Above)
Steꢀ 3: +125ºC 2º
Steꢀ 4: Room Temꢀ
Reꢀeat for 5 cycles and measure after
24 hours at room temꢀerature
30 3 minutes
ꢄ 3 minutes
Insulation
Resistance
Dielectric
Meets Initial Values (As Above)
No visual defects
ꢄ 3.0ꢂ or .3 ꢀp, whichever is greater
Strength
Aꢀꢀearance
Caꢀacitance
Variation
Charge device with twice rated voltage in
test chamber set at 125ºC 2ºC
for 1000 hours (+48, -0).
ꢃ 30 ꢀp:
ꢃ10 ꢀp, ꢁ30 ꢀp:
ꢁ10 ꢀp:
Qꢃ 350
Qꢃ 275 +5Cꢇ2
Qꢃ 200 +10C
Q
Load Life
(C=Nominal Caꢀ)
Insulation
Resistance
Dielectric
Remove from test chamber and stabilize at
room temꢀerature for 24 hours
before measuring.
ꢃ Initial Value x 0.3 (See Above)
Meets Initial Values (As Above)
No visual defects
ꢄ 5.0ꢂ or .5 ꢀp, whichever is greater
Strength
Aꢀꢀearance
Caꢀacitance
Variation
Store in a test chamber set at 85ºC 2ºCꢇ
85ꢂ 5ꢂ relative humidity for 1000 hours
(+48, -0) with rated voltage aꢀꢀlied.
ꢃ 30 ꢀp:
ꢃ10 ꢀp, ꢁ30 ꢀp:
ꢁ10 ꢀp:
Qꢃ 350
Qꢃ 275 +5Cꢇ2
Qꢃ 200 +10C
Load
Q
Humidity
Insulation
Resistance
Dielectric
Strength
Remove from chamber and stabilize at
room temꢀerature for 24 2 hours
before measuring.
ꢃ Initial Value x 0.3 (See Above)
Meets Initial Values (As Above)
100917
5
C0G (NP0) Dielectric
Capacitance Range
PREFERRED SIZES ARE SHADED
SIZE
Soldering
Packaging
(L) Length
(W) Width
0101*
0201
0402
ReflowꢀWave
0603
ReflowꢀWave
0805
ReflowꢀWave
1206
ReflowꢀWave
Reflow Only Reflow Only
All Paper
All Paper
All Paper
All Paper
PaperꢀEmbossed
PaperꢀEmbossed
mm
0.40 0.02
0.60 0.09
1.00 0.10
1.60 0.15
2.01 0.20
3.20 0.20
(in.)
(0.016 0.0008)
(0.024 0.004)
(0.040 0.004)
(0.063 0.006)
(0.079 0.008)
(0.126 0.008)
mm
0.20 0.02
0.30 0.09
0.50 0.10
0.81 0.15
1.25 0.20
1.60 0.20
(in.)
(0.008 0.0008)
(0.011 0.004)
(0.020 0.004)
(0.032 0.006)
(0.049 0.008)
(0.063 0.008)
mm
(in.)
0.10 0.04
0.15 0.05
0.25 0.15
0.35 0.15
0.50 0.25
0.50 0.25
(t) Terminal
(0.004 0.0016)
(0.006 0.002)
(0.010 0.006)
(0.014 0.006)
(0.020 0.010)
(0.020 0.010)
WVDC
16
25
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
50
16
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
25
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
50
16
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
25
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
50
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
100
200
16
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
P
P
P
P
P
P
P
25
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
P
P
P
P
P
P
P
50
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
P
P
P
P
P
P
P
100
J
200
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
16
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
P
25
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
P
50
100
200
J
500
J
Caꢀ
(ꢀp)
0.5
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
J
J
1.0
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
J
J
J
J
J
1.2
J
J
J
J
J
1.5
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
J
J
J
J
J
1.8
J
J
J
J
J
2.2
J
J
J
J
J
2.7
J
J
J
J
J
3.3
J
J
J
J
J
3.9
J
J
J
J
J
4.7
J
J
J
J
J
5.6
J
J
J
J
J
6.8
J
J
J
J
J
8.2
J
J
J
J
J
10
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
J
J
J
J
J
12
J
J
J
J
J
15
J
J
J
J
J
18
J
J
J
J
J
22
J
J
J
J
J
27
J
J
J
J
J
33
J
J
J
J
J
39
J
J
J
J
J
47
J
J
J
J
J
56
J
J
J
J
J
68
J
J
J
J
J
82
J
J
J
J
J
100
120
150
180
220
270
330
390
470
560
680
820
1000
1200
1500
1800
2200
2700
3300
3900
4700
5600
6800
8200
0.010
0.012
0.015
0.018
0.022
0.027
0.033
0.039
0.047
0.068
0.082
0.1
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
M
M
M
P
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
Q
Q
Q
Q
Q
Q
Q
J
J
J
J
J
J
J
J
M
M
P
P
P
P
P
P
P
P
P
N
N
N
N
N
N
M
M
M
M
M
M
M
M
M
P
Caꢀ
(µp)
WVDC
SIZE
16
0101*
50
16
25
0402
50
16
25
50
0603
100
200
16
25
50
0805
100
200
16
25
100
50 1206
200
500
25 0201
Letter
Max.
A
B
C
E
G
J
K
M
N
P
Q
X
Y
Z
0.±±
0.22
0.56
0.71
(0.028)
0.90
0.94
1.02
1.27
1.40
1.52
1.78
2.29
2.54
2.79
Thickness (0.01±)
(0.009)
(0.022)
(0.0±5)
(0.0±7)
(0.040)
(0.050)
(0.055)
(0.060)
(0.070)
(0.090)
(0.100)
(0.110)
PAPER
EMBOSSED
PAPER and EMBOSSED available for 01005
100917
6
C0G (NP0) Dielectric
Capacitance Range
PREFERRED SIZES ARE SHADED
SIZE
Soldering
Packaging
1210
Reflow Only
1812
Reflow Only
1825
Reflow Only
2220
Reflow Only
2225
Reflow Only
PaperꢀEmbossed
All Embossed
All Embossed
All Embossed
All Embossed
mm
(in.)
3.20 0.20
4.50 0.30
4.50 0.30
5.70 0.40
5.72 0.25
(L) Length
(0.126 0.008)
(0.177 0.012)
(0.177 0.012)
(0.225 0.016)
(0.225 0.010)
mm
2.50 0.20
3.20 0.20
6.40 0.40
5.00 0.40
6.35 0.25
(W) Width
(in.)
mm
(in.)
(0.098 0.008)
(0.126 0.008)
(0.252 0.016)
(0.197 0.016)
(0.250 0.010)
0.50 0.25
0.61 0.36
0.61 0.36
0.64 0.39
0.64 0.39
(t) Terminal
(0.020 0.010)
(0.024 0.014)
(0.024 0.014)
(0.025 0.015)
(0.025 0.015)
WVDC
25
50
100
200
500
25
50
100
200
500
50
100
200
50
100
200
50
100
200
Caꢀ
(ꢀp)
0.5
1.0
1.2
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10
J
J
12
15
J
18
J
22
J
27
J
33
J
39
J
47
J
56
J
68
J
82
J
100
120
150
180
220
270
330
390
470
560
680
820
1000
1200
1500
1800
2200
2700
3300
3900
4700
5600
6800
8200
0.010
0.012
0.015
0.018
0.022
0.027
0.033
0.039
0.047
J
J
J
J
J
J
J
M
M
M
P
P
P
P
P
P
N
J
J
J
J
J
J
J
J
K
K
P
P
P
P
P
P
P
J
J
J
J
P
P
P
P
P
P
P
P
P
P
P
K
K
K
K
K
K
K
K
K
K
K
K
K
K
P
P
P
Q
Q
X
X
K
K
K
K
K
K
K
K
K
K
K
M
M
M
P
P
P
Q
Q
X
X
N
N
N
N
N
N
N
N
N
P
Q
Q
Q
Q
Q
Q
Q
X
X
X
X
N
N
N
N
N
P
P
P
P
P
Q
Q
Q
M
M
M
M
P
M
M
M
M
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
M
M
M
M
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
M
M
M
M
M
M
X
X
X
X
X
X
X
X
X
X
X
Y
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
P
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
Y
P
P
P
P
P
P
P
P
P
P
P
P
P
P
Y
Y
Y
Y
Y
Y
P
P
P
P
P
P
P
P
P
P
P
N
N
P
P
P
P
P
P
P
P
P
P
P
N
N
Q
Q
Q
Y
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Y
Y
X
X
X
X
X
X
X
X
X
X
X
Y
Caꢀ
(µp)
Y
X
Y
X
Y
X
Z
0.068
0.082
0.1
Z
Z
Z
Z
Y
Y
Z
Z
X
X
Z
Z
Z
Z
Z
Z
Z
Z
WVDC
25
50
100
200
500
25
50
100
200
500
50
100
200
50
100
200
50
100
200
SIZE
1210
1812
1825
2220
2225
Letter
Max.
A
B
C
E
G
J
K
M
N
P
Q
X
Y
Z
0.±±
0.22
0.56
0.71
0.90
0.94
(0.0±7)
1.02
1.27
1.40
1.52
1.78
2.29
2.54
(0.100)
2.79
Thickness (0.01±)
(0.009)
(0.022)
(0.028)
(0.0±5)
(0.040)
(0.050)
(0.055)
(0.060)
(0.070)
(0.090)
(0.110)
PAPER
EMBOSSED
100917
7
RF/Microwave C0G (NP0)
Capacitors (RoHS)
Ultra Low ESR, “U” Series, C0G (NP0) Chip Capacitors
GENERAL INFORMATION
“U” Series capacitors are C0G (NP0) chip capacitors spe-
cially designed for “Ultra” low ESR for applications in the
communications market. Max ESR and effective capacitance
are met on each value producing lot to lot uniformity.
Sizes available are EIA chip sizes 0402, 0603, 0805, and
1210.
DIMENSIONS: inches (millimeters)
0402
0603
0805
1210
inches (mm)
E
N/A
Size
0402
0603
0805
1210
A
B
C
D
N/A
0.039 0.004 (1.00 0.1)
0.060 0.010 (1.52 0.25) 0.030 0.010 (0.76 0.25)
0.079 0.008 (2.01 0.2)
0.126 0.008 (3.2 0.2)
0.020 0.004 (0.50 0.1)
0.022 (0.55mm) max
0.036 (0.91mm) max
0.040 0.005 (1.02 0.127) 0.020 0.010 (0.51 0.255)
0.010 0.005 (0.25 0.13)
0.030 (0.76) min
0.020 (0.51) min
0.049 0.008 (1.25 0.2)
0.098 0.008 (2.49 0.2)
0.050 0.005 (1.27 0.127) 0.025 0.015 (0.635 0.381) 0.040 (1.02) min
HOW TO ORDER
0805
1
U
100
J
A
T
2
A
Case Size
0402
0603
0805
1210
Dielectric =
Capacitance
Termination
T= Plated Ni and
Sn
Special Code
A = Standard
Ultra Low ESR
Tolerance Code
B = 0.1pF
C = 0.25pF
D = 0.5pF
F = 1ꢀ
G = 2ꢀ
J = 5ꢀ
K = 10ꢀ
M = 20ꢀ
Voltage Code
3 = 25V
5 = 50V
1 = 100V
2 = 200V
Failure Rate
Code
A = Not Applicable
Packaging
Code
2 = 7" Reel
4 = 13" Reel
Capacitance
EIA Capacitance Code in pF.
First two digits = significant figures or “R” for
decimal place.
Third digit = number of zeros or after “R” sig-
nificant figures.
NOTE: Contact factory for availability of Termination and Toler-
ance Options for Specific Part Numbers.
ELECTRICAL CHARACTERISTICS
Dielectric Working Voltage (DWV):
Capacitance Values and Tolerances:
Size 0402 - 0.2 pF to 30 pF @ 1 MHz
Size 0603 - 1.0 pF to 100 pF @ 1 MHz
Size 0805 - 1.6 pF to 160 pF @ 1 MHz
Size 1210 - 2.4 pF to 1000 pF @ 1 MHz
250ꢀ of rated WVDC
Equivalent Series Resistance Typical (ESR):
0402 - See Performance Curve, page 9
0603 - See Performance Curve, page 9
0805 - See Performance Curve, page 9
1210 - See Performance Curve, page 9
Temperature Coefficient of Capacitance (TC):
0 30 ppm/ꢁC (-55ꢁ to +125ꢁC)
Marking: Laser marking EIA J marking standard
(except 0603) (capacitance code and
tolerance upon request).
Insulation Resistance (IR):
1012 Ω min. @ 25ꢁC and rated WVDC
1011 Ω min. @ 125ꢁC and rated WVDC
Working Voltage (WVDC):
MILITARY SPECIFICATIONS
Size
Working Voltage
Meets or exceeds the requirements of MIL-C-55681
0402 - 100, 50, 25 WVDC
0603 - 200, 100, 50 WVDC
0805 - 200, 100 WVDC
1210 - 200, 100 WVDC
120216
8
RF/Microwave C0G (NP0)
Capacitors (RoHS)
Ultra Low ESR, “U” Series, C0G (NP0) Chip Capacitors
CAPACITANCE RANGE
Size
Cap (pF) Tolerance 0402 0603 0805 1210
Size
Cap (pF) Tolerance 0402 0603 0805 1210
Size
Cap (pF) Tolerance 0402 0603 0805 1210
Size
Cap (pF) Tolerance 0402 0603 0805 1210
Available
Available
Available
Available
7.5
8.2
9.1
10
11
12
13
15
18
20
22
24
27
30
33
36
39
43
47
51
56
68
75
82
91
B,C,J,K,M 100V 200V 200V 200V
100
110
F,G,J,K,M N/A 100V 200V 200V
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
B,C
100V N/A N/A N/A
1.0
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.9
2.0
2.1
2.2
2.4
2.7
3.0
3.3
3.6
3.9
4.3
4.7
5.1
5.6
6.2
6.8
B,C,D
100V 200V 200V 200V
᭡
50V
᭡
᭡
᭡
B,C,J,K,M
120
50V
F,G,J,K,M 100V
50V
130
N/A 200V
B,C
B,C,D
140
100V
᭡
150
᭡
160
100V
N/A
᭡
᭡
᭡
᭡
᭡
180
B,C,D
200V
100V
200
220
270
300
᭡
330
50V
N/A
360
᭡
390
430
200V
100V
470
510
560
620
680
750
᭡
820
᭡
910
B,C,D
B,C,J,K,M
᭡
᭡
᭡
᭡
᭡
᭡
᭡
᭡
᭡
᭡
᭡
᭡
᭡
1000 F,G,J,K,M
ULTRA LOW ESR, “U” SERIES
ESR Measured on the Boonton 34A
120216
9
RF/Microwave C0G (NP0) Capacitors
Ultra Low ESR, “U” Series, C0G (NP0) Chip Capacitors
120216
10
RF/Microwave C0G (NP0)
Capacitors (Sn/Pb)
Ultra Low ESR, “U” Series, C0G (NP0) Chip Capacitors
GENERAL INFORMATION
“U” Series capacitors are C0G (NP0) chip capacitors specially
designed for “Ultra” low ESR for applications in the commu-
nications market. Max ESR and effective capacitance
are met on each value producing lot to lot uniformity.
Sizes available are EIA chip sizes 0402, 0603, 0805, and
1210.
DIMENSIONS: inches (millimeters)
0402
0603
0805
1210
A
A
E
A
A
E
C
B
B
C
B
B
C
C
D
D
D
D
D
D
E
inches (mm)
Size
0402
0603
0805
1210
A
B
C
D
N/A
E
N/A
0.039 0.004 (1.00 0.1)
0.060 0.010 (1.52 0.25) 0.030 0.010 (0.76 0.25)
0.079 0.008 (2.01 0.2)
0.126 0.008 (3.2 0.2)
0.020 0.004 (0.50 0.1)
0.022 (0.55mm) max
0.036 (0.91mm) max
0.040 0.005 (1.02 0.127) 0.020 0.010 (0.51 0.254)
0.050 0.005 (1.27 0.127) 0.025 0.015 (0.635 0.381) 0.040 (1.02) min
0.010 0.005 (0.25 0.13)
0.030 (0.76) min
0.020 (0.51) min
0.049 0.008 (1.25 0.2)
0.098 0.008 (2.49 0.2)
HOW TO ORDER
LD05
1
U
100
J
A
B
2
A
Case Size
LD02 = 0402
LD03 = 0603
LD05 = 0805
LD10 = 1210
Dielectric =
Ultra Low
ESR
Capacitance
Tolerance
Code
B = 0.1pF
C = 0.25pF
D = 0.5pF
F = 1ꢀ
Termination
*B = 5ꢀ min lead
Special Code
A = Standard
G = 2ꢀ
J = 5ꢀ
K = 10ꢀ
M = 20ꢀ
Voltage Code
3 = 25V
5 = 50V
1 = 100V
2 = 200V
Failure Rate
Code
A = Not Applica-
ble
Packaging
Code
2 = 7" Reel
4 = 13" Reel
Capacitance
EIA Capacitance Code in pF.
First two digits = significant figures
or “R” for decimal place.
Third digit = number of zeros or after
“R” significant figures.
*
Not RoHS Compliant
ELECTRICAL CHARACTERISTICS
Capacitance Values and Tolerances:
Size 0402 - 0.2 pF to 22 pF @ 1 MHz
Size 0603 - 1.0 pF to 100 pF @ 1 MHz
Size 0805 - 1.6 pF to 160 pF @ 1 MHz
Size 1210 - 2.4 pF to 1000 pF @ 1 MHz
Dielectric Working Voltage (DWV):
250ꢀ of rated WVDC
Equivalent Series Resistance Typical (ESR):
Temperature Coefficient of Capacitance (TC):
0402
0603
0805
1210
-
-
-
-
See Performance Curve, page 12
See Performance Curve, page 12
See Performance Curve, page 12
See Performance Curve, page 12
0 30 ppm/ꢁC (-55ꢁ to +125ꢁC)
Insulation Resistance (IR):
1012 Ω min. @ 25ꢁC and rated WVDC
1011 Ω min. @ 125ꢁC and rated WVDC
Marking: Laser marking EIA J marking standard
(except 0603) (capacitance code and
tolerance upon request).
Working Voltage (WVDC):
Size
Working Voltage
50, 25 WVDC
200, 100, 50 WVDC
200, 100 WVDC
200, 100 WVDC
0402
0603
0805
1210
-
-
-
-
MILITARY SPECIFICATIONS
Meets or exceeds the requirements of MIL-C-55681
REV 1
11
RF/Microwave C0G (NP0)
Capacitors (Sn/Pb)
Ultra Low ESR, “U” Series, C0G (NP0) Chip Capacitors
CAPACITANCE RANGE
Size
Cap (pF) Tolerance LD02 LD03 LD05 LD10
Size
Cap (pF) Tolerance LD02 LD03 LD05 LD10
Size
Size
Cap (pF) Tolerance LD02 LD03 LD05 LD10
Available
Available
Available
Available
Cap (pF) Tolerance LD02 LD03 LD05 LD10
7.5
8.2
9.1
10
11
12
13
15
18
20
22
24
27
30
33
36
39
43
47
51
56
68
75
82
91
B,C,J,K,M 50V 200V 200V 200V
100
110
120
130
140
150
160
180
200
220
270
300
330
360
390
430
470
510
560
620
680
750
820
910
F,G,J,K,M N/A 100V 200V 200V
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
B,C
50V N/A N/A N/A
1.0
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.9
2.0
2.1
2.2
2.4
2.7
3.0
3.3
3.6
3.9
4.3
4.7
5.1
5.6
6.2
6.8
B,C,D
50V 200V 200V 200V
᭡
50V
᭡
᭡
B,C,J,K,M
F,G,J,K,M
50V
N/A 200V
B,C
B,C,D
100V
᭡
᭡
100V
N/A
᭡
᭡
᭡
᭡
᭡
B,C,D
200V
100V
᭡
50V
N/A
᭡
200V
100V
᭡
᭡
B,C,D
B,C,J,K,M
᭡
᭡
᭡
᭡
᭡
᭡
᭡
᭡
᭡
᭡
᭡
᭡
᭡
1000 F,G,J,K,M
ULTRA LOW ESR, “U” SERIES
TYPICAL ESR vs. FREQUENCY
0402 “U” SERIES
TYPICAL ESR vs. FREQUENCY
0603 “U” SERIES
1
1
10 pF
15 pF
3.3 pF
3.9 pF
4.7 pF
5.1 pF
6.8 pF
10.0 pF
15.0 pF
0.1
0.1
0.01
0.01
2500
2500
0
0
500
1000
Frequency (MHz)
2000
500
1000
Frequency (MHz)
2000
1500
1500
TYPICAL ESR vs. FREQUENCY
1210 “U” SERIES
TYPICAL ESR vs. FREQUENCY
0805 “U” SERIES
1
1
100 pF
10.0 pF
10 pF
100 pF
0.1
0.1
300 pF
0.01
0.01
2500
0
0
500
1000
2000
500
1000
Frequency (MHz)
2000
1500
1500
Frequency (MHz)
ESR Measured on the Boonton 34A
REV 1
12
RF/Microwave Automotive C0G (NP0)
Capacitors (RoHS), AEC Q200 Qualified
Ultra Low ESR, “U” Series, C0G (NP0) Chip Capacitors
GENERAL INFORMATION
DIMENSIONS: mm (inches)
Automotive “U” Series capacitors are C0G (NP0) chip capacitors
specially designed for “Ultra” low ESR for applications in the
automotive market. Max ESR and effective capacitance are met on
each value producing lot to lot uniformity. Sizes available are EIA
chip sizes 0402 and 0603.
0402
0603
Size
A
B
C
D
E
1.00 0.1
0.50 0.1
0.60 max
(0.024)
0.91 max
(0.036)
0402
N/A
N/A
(0.039 0.004)
1.52 0.25
(0.060 0.010)
(0.020 0.004)
0.76 0.25
(0.030 0.010)
0.25 0.13
(0.010 0.005)
0.76 min
(0.030)
0603
HOW TO ORDER
0402
1
U
100
J
4
T
2
A
Case Size
0402
0603
Dielectric =
Capacitance
Termination
T= Plated Ni and Sn
Special Code
A = Standard
Ultra Low ESR
Tolerance Code
B = 0.1pF
C = 0.25pF
D = 0.5pF
F = 1ꢀ
G = 2ꢀ
J = 5ꢀ
K = 10ꢀ
M = 20ꢀ
Voltage Code
5 = 50V
Failure Rate
Code
4 = Automotive
Packaging
Code
2 = 7" Reel
4 = 13" Reel
1 = 100V
Capacitance
EIA Capacitance Code in pF.
2 = 200V
First two digits = significant figures
or “R” for decimal place.
Third digit = number of zeros or
after “R” significant figures.
ELECTRICAL CHARACTERISTICS
Capacitance Values and Tolerances:
Size 0402 - 0.2 pF to 22 pF @ 1 MHz
Size 0603 - 1.0 pF to 100 pF @ 1 MHz
Dielectric Working Voltage (DWV):
250ꢀ of rated WVDC
Equivalent Series Resistance Typical (ESR):
0402 - See Performance Curve
0603 - See Performance Curve
Temperature Coefficient of Capacitance (TC):
0 30 ppm/ꢁC (-55ꢁ to +125ꢁC)
Insulation Resistance (IR):
Automotive Specifications
Meets or exceeds the requirements of AEC Q200
1012 Ω min. @ 25ꢁC and rated WVDC
1011 Ω min. @ 125ꢁC and rated WVDC
Working Voltage (WVDC):
Size
Working Voltage
0402 - 50, 25 WVDC
0603 - 200, 100, 50 WVDC
REV 1
13
RF/Microwave Automotive C0G (NP0)
Capacitors (RoHS), AEC Q200 Qualified
Ultra Low ESR, “U” Series, C0G (NP0) Chip Capacitors
CAPACITANCE RANGE
Size
Cap (pF) Tolerance 0402 0603
Size
Cap (pF) Tolerance 0402 0603
Size
Size
Cap (pF) Tolerance 0402 0603
Available
Available
Available
Cap (pF) Tolerance 0402 0603
Available
7.5
8.2
9.1
10
11
12
13
15
18
20
22
24
27
30
33
36
39
43
47
51
56
68
75
82
91
B,C,J,K,M 50V 200V
100
110
F,G,J,K,M N/A 100V
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
B,C
50V N/A
1.0
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.9
2.0
2.1
2.2
2.4
2.7
3.0
3.3
3.6
3.9
4.3
4.7
5.1
5.6
6.2
6.8
B,C,D
50V 200V
᭡
50V
50V
N/A
᭡
B,C,J,K,M
F,G,J,K,M
120
130
B,C
B,C,D
140
150
᭡
160
᭡
᭡
᭡
180
B,C,D
200V
100V
200
220
270
300
᭡
330
50V
N/A
360
390
430
470
510
560
620
680
750
᭡
820
᭡
910
B,C,D
B,C,J,K,M
᭡
᭡
᭡
᭡
᭡
᭡
᭡
1000 F,G,J,K,M
ULTRA LOW ESR, “U” SERIES
TYPICAL ESR vs. FREQUENCY
0402 “U” SERIES
TYPICAL ESR vs. FREQUENCY
0603 “U” SERIES
TYPICAL SERIES RESONANT FREQUENCY
“U” SERIES CHIP
10
0402
0603
1.0
0.1
1000
1.0
10
100
Capacitance (pF)
REV 1
14
Designer Kits
Communication Kits “U” Series
“U” SERIES KITS
0402
Kit 5000 UZ
Cap.
0603
Kit 4000 UZ
Cap.
Cap.
Cap.
Value Tolerance Value Tolerance
Value Tolerance Value Tolerance
pF
pF
pF
pF
0.5
1.0
1.5
1.8
2.2
2.4
3.0
3.6
4.7
5.6
6.8
1.0
1.2
1.5
1.8
2.0
2.4
2.7
3.0
3.3
3.9
4.7
5.6
6.8
7.5
8.2
B ( 0.1pF)
B ( 0.1pF)
J ( 5ꢀ)
8.2
10.0
12.0
15.0
18.0
22.0
27.0
33.0
39.0
47.0
B ( 0.1pF)
10.0
12.0
15.0
B ( 0.1pF)
J ( 5ꢀ)
***25 each of 15 values
***25 each of 24 values
0805
Kit 3000 UZ
1210
Kit 3500 UZ
Cap.
Cap.
Cap.
Cap.
Value Tolerance Value Tolerance
Value Tolerance Value Tolerance
pF
pF
pF
pF
1.0
1.5
2.2
2.4
2.7
3.0
3.3
3.9
4.7
5.6
7.5
8.2
9.1
10.0
12.0
15.0
18.0
22.0
24.0
27.0
33.0
2.2
2.7
4.7
5.1
6.8
8.2
9.1
10.0
13.0
15.0
18.0
20.0
24.0
27.0
30.0
36.0
39.0
47.0
B ( 0.1pF) 51.0
56.0
68.0
82.0
100.0
120.0
B ( 0.1pF) 36.0
39.0
47.0
56.0
68.0
82.0
J ( 5ꢀ)
J ( 5ꢀ)
130.0
240.0
J ( 5ꢀ)
300.0
100.0
130.0
390.0
470.0
680.0
J ( 5ꢀ)
160.0
***25 each of 30 values
***25 each of 30 values
REV 1
15
X8R/X8L Dielectric
General Specifications
AVX has develoꢀed a range of multilayer ceramic caꢀacitors designed for use in aꢀꢀlications uꢀ to 150ºC. These caꢀacitors
are manufactured with an X8R and an X8L dielectric material. X8R material has caꢀacitance variation of 15ꢂ between -
55ºC and +150ºC. The X8L material has caꢀacitance variation of 15ꢂ between -55ºC to 125ºC and +15ꢇ-40ꢂ from +125ºC
to +150ºC.
The need for X8R and X8L ꢀerformance has been driven by customer requirements for ꢀarts that oꢀerate at elevated
temꢀeratures. They ꢀrovide a highly reliable caꢀacitor with low loss and stable caꢀacitance over temꢀerature.
They are ideal for automotive under the hood sensors, and various industrial aꢀꢀlications. Tyꢀical industrial aꢀꢀlication would
be drilling monitoring system. They can also be used as bulk caꢀacitors for high temꢀerature camera modules.
Both X8R and X8L dielectric caꢀacitors are automotive AEC-Q200 qualified. Oꢀtional termination systems, tin, pLEXITERM® and
conductive eꢀoxy for hybrid aꢀꢀlications are available. Providing this series with our pLEXITERM® termination
system ꢀrovides further advantage to customers by way of enhanced resistance to both, temꢀerature cycling and
mechanical damage.
PART NUMBER (see page 2 for complete part number explanation)
0805
5
F
104
K
4
T
2
A
Size
0603
0805
1206
Voltage
16V = Y
25V = 3
50V = 5
100V = 1
Dielectric
X8R = p
Capacitance Capacitance
Failure
Rate
Terminations
T = Plated Ni
and Sn
Packaging
2 = 7" Reel
Special
Code
Code (In pF)
2 Sig. Digits +
Tolerance
J = 5ꢂ
X8L = L
4 = Automotive
A = Not
4 = 13" Reel
A = Std.
Product
K = 10ꢂ
M = 20ꢂ
Z = pLEXITERM®
Number of Zeros
e.g. 10µp = 106
Aꢀꢀlicable
NOTE: Contact factory for availability of Termination and Tolerance Oꢀtions for Sꢀecific Part Numbers.
X8R
X8L
SIZE
Soldering
WVDC
0603
0805
1206
SIZE
Soldering
WVDC
0603
0805
1206
1210
ReflowꢇWave
ReflowꢇWave
ReflowꢇWave
ReflowꢇWave
ReflowꢇWave
ReflowꢇWave
ReflowꢇWave
25V
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
50V
G
G
G
G
G
G
G
G
G
G
G
G
G
G
25V
J
50V
J
25V
50V
25V
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
50V
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
100V
25V
50V
100V
16V
25V
50V
100V
10V
50V
100V
331
Caꢀ
(ꢀp)
330
470
271
Caꢀ
(ꢀp)
270
471
681
102
152
222
332
472
682
103
153
223
333
473
683
104
154
224
334
474
684
105
155
225
J
J
331
471
681
102
152
182
222
272
332
392
472
562
682
822
103
123
153
183
223
273
333
393
473
563
683
823
104
124
154
184
224
274
334
394
474
684
824
105
155
225
475
106
330
470
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
J
J
680
J
J
1000
1500
2200
3300
4700
6800
0.01
J
J
J
J
J
J
680
J
J
J
J
1000
1500
1800
2200
2700
3300
3900
4700
5600
6800
8200
0.01
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
P
P
P
P
P
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
Caꢀ
J
J
J
J
J
J
J
J
(µp) 0.015
0.022
0.033
0.047
0.068
0.1
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
N
N
N
M
M
M
M
M
M
M
M
M
M
M
J
J
J
J
Caꢀ
J
J
J
J
0.15
(µp) 0.012
0.015
0.018
0.022
0.027
0.033
0.039
0.047
0.056
0.068
0.082
0.1
J
J
J
J
0.22
J
J
J
J
0.33
J
J
J
J
0.47
J
J
J
J
0.68
J
J
J
J
1
J
N
N
N
N
N
N
N
J
J
1.5
J
J
J
2.2
J
J
J
WVDC
25V
50V
25V
50V
25V
50V
J
J
J
J
J
J
SIZE
0603
0805
1206
J
J
J
J
J
M
M
Q
Q
Q
Q
Q
Q
Q
Q
Q
Q
0.12
J
J
0.15
J
J
J
J
0.18
N
N
N
N
N
N
N
N
N
J
0.22
J
J
0.27
J
M
M
M
M
M
M
M
M
M
0.33
J
0.39
M
M
M
M
M
M
M
0.47
0.68
0.82
1
1.5
2.2
Z
Z
Z
Z
WVDC
25V
50V
100V
25V
50V
100V
16V
25V
50V
100V
10V
50V
100V
SIZE
0603
0805
1206
1210
= AEC-Q200
Qualified
Letter
A
C
E
G
J
K
M
N
P
Q
X
Y
Z
Max.
0.±±
0.56
0.71
0.90
0.94
1.02
1.27
1.40
1.52
1.78
2.29
(0.090)
2.54
(0.100)
2.79
Thickness (0.01±)
(0.022)
(0.028)
(0.0±5)
(0.0±7)
(0.040)
(0.050)
(0.055)
(0.060)
(0.070)
(0.110)
PAPER
EMBOSSED
100917
16
X8R/X8L Dielectric
General Specifications
APPLICATIONS FOR X8R AND X8L CAPACITORS
• All market sectors with a 150°C requirement
• Automotive on engine aꢀꢀlications
• Oil exꢀloration aꢀꢀlications
• Hybrid automotive aꢀꢀlications
– Battery control
– Inverter ꢇ converter circuits
– Motor control aꢀꢀlications
– Water ꢀumꢀ
• Hybrid commercial aꢀꢀlications
– Emergency circuits
– Sensors
– Temꢀerature regulation
ADVANTAGES OF X8R AND X8L MLC CAPACITORS
• Both ranges are qualified to the highest automotive
AEC-Q200 standards
• Excellent reliability comꢀared to other caꢀacitor
technologies
• RoHS comꢀliant
• Low ESR ꢇ ESL comꢀared to other technologies
• Tin solder finish
• pLEXITERM® available
• Eꢀoxy termination for hybrid available
• 100V range available
ENGINEERING TOOLS FOR HIGH VOLTAGE MLC CAPACITORS
• Samꢀles
• Technical Articles
• Aꢀꢀlication Engineering
• Aꢀꢀlication Suꢀꢀort
X8R/X8L Dielectric
0805, 50V, X8R/X8L Typical Temperature Coefficient
10.00
X8R
0.00
-10.00
X8L
-20.00
-30.00
-40.00
-50.00
-55 -35 -15
0
20 25 35 45 65 85 105 125 130 135 140 150
Temperature (°C)
100917
17
X8R/X8L Dielectric
Specifications and Test Methods
Parameter/Test
Operating Temperature Range
Capacitance
X8R/X8L Specification Limits
Measuring Conditions
Temꢀerature Cycle Chamber
preq.: 1.0 kHz 10ꢂ
-55ºC to +150ºC
Within sꢀecified tolerance
ꢄ 2.5ꢂ for ꢃ 50V DC rating
ꢄ 3.5ꢂ for 25V DC and 16V DC rating
100,000MΩ or 1000MΩ - µp,
whichever is less
Voltage: 1.0Vrms .2V
Dissipation Factor
Charge device with rated voltage for
120 5 secs ꢆ room temꢀꢇhumidity
Charge device with 250ꢂ of rated voltage for
1-5 seconds, wꢇcharge and discharge current
limited to 50 mA (max)
Insulation Resistance
Dielectric Strength
No breakdown or visual defects
Note: Charge device with 150ꢂ of rated
voltage for 500V devices.
Aꢀꢀearance
Caꢀacitance
No defects
ꢄ 12ꢂ
Deflection: 2mm
Test Time: 30 seconds
Resistance to
Flexure
Variation
Dissiꢀation
pactor
Meets Initial Values (As Above)
ꢃ Initial Value x 0.3
ꢃ 95ꢂ of each terminal should be covered
with fresh solder
No defects, ꢁ25ꢂ leaching of either end terminal
Stresses
Insulation
Resistance
Diꢀ device in eutectic solder at 230 5ºC
for 5.0 0.5 seconds
Solderability
Aꢀꢀearance
Caꢀacitance
Variation
ꢄ 7.5ꢂ
Diꢀ device in eutectic solder at 260ºC for 60
Dissiꢀation
pactor
seconds. Store at room temꢀerature for 24
2
Resistance to
Solder Heat
Meets Initial Values (As Above)
Meets Initial Values (As Above)
hours before measuring electrical ꢀroꢀerties.
Insulation
Resistance
Dielectric
Strength
Meets Initial Values (As Above)
No visual defects
Aꢀꢀearance
Caꢀacitance
Variation
Steꢀ 1: -55ºC 2º
Steꢀ 2: Room Temꢀ
30 3 minutes
ꢄ 3 minutes
ꢄ 7.5ꢂ
Dissiꢀation
pactor
Thermal
Shock
Meets Initial Values (As Above)
Meets Initial Values (As Above)
Steꢀ 3: +125ºC 2º
Steꢀ 4: Room Temꢀ
30 3 minutes
ꢄ 3 minutes
Insulation
Resistance
Dielectric
Strength
Reꢀeat for 5 cycles and measure after
24 2 hours at room temꢀerature
Meets Initial Values (As Above)
No visual defects
Aꢀꢀearance
Caꢀacitance
Variation
Charge device with 1.5 rated voltage (ꢄ 10V) in
test chamber set at 150ºC 2ºC
for 1000 hours (+48, -0)
ꢄ 12.5ꢂ
Dissiꢀation
pactor
ꢄ Initial Value x 2.0 (See Above)
ꢃ Initial Value x 0.3 (See Above)
Load Life
Remove from test chamber and stabilize
at room temꢀerature for 24 2 hours
before measuring.
Insulation
Resistance
Dielectric
Strength
Meets Initial Values (As Above)
No visual defects
Aꢀꢀearance
Caꢀacitance
Variation
Store in a test chamber set at 85ºC 2ºCꢇ
85ꢂ 5ꢂ relative humidity for 1000 hours
(+48, -0) with rated voltage aꢀꢀlied.
ꢄ 12.5ꢂ
Load
Dissiꢀation
pactor
ꢄ Initial Value x 2.0 (See Above)
ꢃ Initial Value x 0.3 (See Above)
Meets Initial Values (As Above)
Humidity
Remove from chamber and stabilize at
room temꢀerature and humidity for
24 2 hours before measuring.
Insulation
Resistance
Dielectric
Strength
100917
18
X7R Dielectric
General Specifications
X7R formulations are called “temꢀerature stable” ceramics and fall into EIA
Class II materials. X7R is the most ꢀoꢀular of these intermediate dielectric
constant materials. Its temꢀerature variation of caꢀacitance is within 15ꢂ
from -55°C to +125°C. This caꢀacitance change is non-linear.
Caꢀacitance for X7R varies under the influence of electrical oꢀerating con-
ditions such as voltage and frequency.
X7R dielectric chiꢀ usage covers the broad sꢀectrum of industrial
aꢀꢀlications where known changes in caꢀacitance due to aꢀꢀlied voltages
are acceꢀtable.
PART NUMBER (see page 2 for complete part number explanation)
0805
5
C
103
M
A
T
2
A
Size
Voltage
4V = 4
Dielectric
Capacitance
Code (In pF)
2 Sig. Digits + Num-
ber of Zeros
Capacitance
Tolerance
J = 5ꢂ%
Failure
Rate
Terminations
Packaging
2 = 7" Reel
Special
Code
(L" x W")
X7R = C
T = Plated Ni
6.3V = 6
10V = Z
16V = Y
25V = 3
50V = 5
100V = 1
200V = 2
500V = 7
A = Not
4 = 13" Reel
A = Std. Product
and Sn
K = 10ꢂ
Aꢀꢀlicable
7 = Gold Plated%
M = 20ꢂ
Z= pLEXITERM®%%
Contact
Factory For
Multiples
%ꢄ1µp only,
contact factory for addi-
tional values
%Oꢀtional termination
%%See pLEXITERM®
X7R section
NOTE: Contact factory for availability of Termination and Tolerance Oꢀtions for Sꢀecific Part Numbers.
Contact factory for non-sꢀecified caꢀacitance values.
100917
19
X7R Dielectric
Specifications and Test Methods
Parameter/Test
Operating Temperature Range
Capacitance
X7R Specification Limits
Measuring Conditions
-55ºC to +125ºC
Temꢀerature Cycle Chamber
Within sꢀecified tolerance
ꢄ 10ꢂ for ꢃ 50V DC rating
preq.: 1.0 kHz 10ꢂ
Voltage: 1.0Vrms .2V
por Caꢀ ꢅ 10µp, 05Vrm ꢆ 120Hz
ꢄ 12.5ꢂ for 25V DC rating
ꢄ 12.5ꢂ for 25V and 16V DC rating
ꢄ 12.5ꢂ for ꢄ 10V DC rating
100,000MΩ or 1000MΩ - µp,
whichever is less
Dissipation Factor
Charge device with rated voltage for
120 5 secs ꢆ room temꢀꢇhumidity
Charge device with 250ꢂ of rated voltage for
1-5 seconds, wꢇcharge and discharge current
limited to 50 mA (max)
Insulation Resistance
Dielectric Strength
No breakdown or visual defects
Note: Charge device with 150ꢂ of rated
voltage for 500V devices.
Aꢀꢀearance
Caꢀacitance
No defects
ꢄ 12ꢂ
Deflection: 2mm
Test Time: 30 seconds
Resistance to
Flexure
Variation
Dissiꢀation
pactor
Meets Initial Values (As Above)
ꢃ Initial Value x 0.3
ꢃ 95ꢂ of each terminal should be covered
with fresh solder
No defects, ꢁ25ꢂ leaching of either end terminal
Stresses
Insulation
Resistance
Diꢀ device in eutectic solder at 230 5ºC
for 5.0 0.5 seconds
Solderability
Aꢀꢀearance
Caꢀacitance
Variation
ꢄ 7.5ꢂ
Diꢀ device in eutectic solder at 260ºC for 60
Dissiꢀation
pactor
seconds. Store at room temꢀerature for 24
2
Resistance to
Solder Heat
Meets Initial Values (As Above)
Meets Initial Values (As Above)
hours before measuring electrical ꢀroꢀerties.
Insulation
Resistance
Dielectric
Strength
Meets Initial Values (As Above)
No visual defects
Aꢀꢀearance
Caꢀacitance
Variation
Steꢀ 1: -55ºC 2º
Steꢀ 2: Room Temꢀ
30 3 minutes
ꢄ 3 minutes
ꢄ 7.5ꢂ
Dissiꢀation
pactor
Thermal
Shock
Meets Initial Values (As Above)
Meets Initial Values (As Above)
Steꢀ 3: +125ºC 2º
Steꢀ 4: Room Temꢀ
30 3 minutes
ꢄ 3 minutes
Insulation
Resistance
Dielectric
Strength
Reꢀeat for 5 cycles and measure after
24 2 hours at room temꢀerature
Meets Initial Values (As Above)
No visual defects
Aꢀꢀearance
Caꢀacitance
Variation
Charge device with 1.5 rated voltage (ꢄ 10V) in
test chamber set at 125ºC 2ºC
for 1000 hours (+48, -0)
ꢄ 12.5ꢂ
Dissiꢀation
pactor
ꢄ Initial Value x 2.0 (See Above)
ꢃ Initial Value x 0.3 (See Above)
Load Life
Remove from test chamber and stabilize
at room temꢀerature for 24 2 hours
before measuring.
Insulation
Resistance
Dielectric
Strength
Meets Initial Values (As Above)
No visual defects
Aꢀꢀearance
Caꢀacitance
Variation
Store in a test chamber set at 85ºC 2ºCꢇ
85ꢂ 5ꢂ relative humidity for 1000 hours
(+48, -0) with rated voltage aꢀꢀlied.
ꢄ 12.5ꢂ
Load
Dissiꢀation
pactor
ꢄ Initial Value x 2.0 (See Above)
ꢃ Initial Value x 0.3 (See Above)
Meets Initial Values (As Above)
Humidity
Remove from chamber and stabilize at
room temꢀerature and humidity for
24 2 hours before measuring.
Insulation
Resistance
Dielectric
Strength
100917
20
X7R Dielectric
Capacitance Range
PREFERRED SIZES ARE SHADED
SIZE
Soldering
Packaging
0101*
Reflow Only
0201
Reflow Only
0402
ReflowꢀWave
0603
ReflowꢀWave
0805
ReflowꢀWave
1206
ReflowꢀWave
PaperꢀEmbossed
All Paper
All Paper
All Paper
PaperꢀEmbossed
PaperꢀEmbossed
mm
(in.)
0.40 0.02
0.60 0.03
1.00 0.10
1.60 0.15
2.01 0.20
3.20 0.20
(L) Length
(0.016 0.0008)
(0.024 0.001)
(0.040 0.004)
(0.063 0.006)
(0.079 0.008)
(0.126 0.008)
mm
0.20 0.02
0.30 0.03
0.50 0.10
0.81 0.15
1.25 0.20
1.60 0.20
(W) Width
(in.)
mm
(in.)
(0.008 0.0008)
(0.011 0.001)
(0.020 0.004)
(0.032 0.006)
(0.049 0.008)
(0.063 0.008)
0.10 0.04
0.15 0.05
0.25 0.15
0.35 0.15
0.50 0.25
0.50 0.25
(t) Terminal
(0.004 0.0016)
(0.006 0.002)
(0.010 0.006)
(0.014 0.006)
(0.020 0.010)
(0.020 0.010)
WVDC
16
B
B
B
B
B
B
B
B
B
10
A
A
A
A
A
A
A
A
A
A
A
A
A
16 25
50
A
6.3
10
16
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
25
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
50
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
6.3
10
16
25
50
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
100 200 6.3
10
16
25
50
100 200 6.3
10
16
25
50
100 200 500
Caꢀ
(ꢀp)
100
101
151
221
331
471
681
102
152
222
332
472
682
103
153
223
333
473
683
104
154
224
334
474
684
105
225
475
106
226
476
107
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
J
G
G
G
G
G
G
G
150
220
A
A
330
A
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
J
J
J
J
J
J
J
J
J
J
J
J
J
N
K
K
K
K
470
A
680
J
J
J
J
1000
1500
2200
3300
4700
6800
0.01
0.015
0.022
0.033
0.047
0.068
0.1
C
C
C
C
C
C
C
C
C
C
C
C
C
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
M
P
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
Caꢀ
(µp)
G
G
G
G
G
G
G
G
J
J
J
J
J
J
J
J
J
J
J
P
J
J
J
J
J
J
J
J
J
M
M
M
M
P
P
P
J
J
J
J
J
J
J
J
J
X
J
J
J
N
N
N
N
N
N
N
N
J
J
J
J
J
X
G
G
G
G
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
G
G
G
J
J
J
J
J
J
J
J
P
Q
Q
Q
Q
Q
Q
Q%%
0.15
0.22
0.33
0.47
0.68
1.0
G
G
J
J
J
J
J
J
J
J
C
J
J
J
J
N
N
N
N
N
P
P
J
J
J
J
J
J
J
N
N
N
N
P
P
P
N
N
N
N
P
P
J
J
M
M
Q
Q
Q
Q
Q
P
P
Q
Q
Q
Q
C
C
J
J
J
M
M
M
Q
Q
Q
Q
M
M
M
Q
Q
Q
J
J
J
J
J
J
J
N
P%%
2.2
J
J
J
4.7
10
P
22
Q
47
100
WVDC
16
10
16 25
50
6.3
10
16
25
50
6.3
10
16
25
50
100 200 6.3
10
16
25
50
100 200 6.3
10
16
25
50
100 200 500
SIZE
0101
0201
0402
0603
0805
1206
Letter
Max.
Thickness (0.01±)
A
B
C
E
G
J
K
M
N
P
Q
X
Y
Z
0.±±
0.22
0.56
(0.022)
PAPER
0.71
0.90
0.94
1.02
(0.040)
1.27
1.40
1.52
1.80
2.29
2.54
2.79
(0.009)
(0.028)
(0.0±5)
(0.0±7)
(0.050)
(0.055)
(0.060)
EMBOSSED
(0.071)
(0.090)
(0.100)
(0.110)
PAPER and EMBOSSED available for 01005
NOTE: Contact factory for non-sꢀecified caꢀacitance values
%EIA 01005
%%Contact pactory for Sꢀecifications
100917
21
X7R Dielectric
Capacitance Range
PREFERRED SIZES ARE SHADED
SIZE
Soldering
Packaging
1210
Reflow Only
1812
Reflow Only
1825
Reflow Only
2220
Reflow Only
2225
Reflow Only
PaperꢀEmbossed
All Embossed
All Embossed
All Embossed
All Embossed
mm
(in.)
3.30 0.4
4.50 0.30
4.50 0.30
5.70 0.40
5.72 0.25
(L) Length
(0.130 0.016)
(0.177 0.012)
(0.177 0.012)
(0.225 0.016)
(0.225 0.010)
mm
2.50 0.20
3.20 0.20
6.40 0.40
5.00 0.40
6.35 0.25
(W) Width
(in.)
mm
(in.)
(0.098 0.008)
(0.126 0.008)
(0.252 0.016)
(0.197 0.016)
(0.250 0.010)
0.50 0.25
0.61 0.36
0.61 0.36
0.64 0.39
0.64 0.39
(t) Terminal
(0.020 0.010)
(0.024 0.014)
(0.024 0.014)
(0.025 0.015)
(0.025 0.015)
WVDC
10
16
25
50
100
200
500
16
25
50
100
200
500
50
100
200
25
50
100
200
500
50
100
200
Caꢀ
(ꢀp)
100
150
220
330
470
680
1000
1500
2200
3300
4700
6800
0.01
0.015
0.022
0.033
0.047
0.068
0.1
101
151
221
331
471
681
102
152
222
332
472
682
103
153
223
333
473
683
104
154
224
334
474
684
105
155
225
335
475
106
226
476
107
WVDC
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
M
M
M
P
Q
Q
Q
Q
X
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
Caꢀ
(µp)
J
J
J
J
J
J
K
K
K
K
K
K
K
K
K
K
K
M
M
Z
K
K
K
K
K
K
K
K
K
K
K
M
M
Z
K
K
K
K
K
K
K
K
K
M
P
Q
X
Z
K
K
K
K
K
K
K
P
P
X
X
K
P
P
X
Z
Z
Z
Z
Z
M
M
M
M
M
M
M
M
M
M
M
M
M
Q
M
M
M
M
M
M
M
M
M
M
M
P
M
M
M
M
M
M
M
M
M
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Z
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Z
Z
Z
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
P
P
P
P
P
P
P
P
P
P
P
P
P
X
X
P
P
P
P
P
P
P
X
X
X
X
X
X
Z
Z
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
Z
Z
J
J
J
J
J
0.15
0.22
0.33
0.47
0.68
1.0
J
J
J
J
M
P
Q
Q
X
Z
Z
Z
Z
J
J
J
J
J
J
J
J
M
M
N
N
X
X
Z
Z
Z
Z
M
M
N
N
X
X
Z
Z
Z
M
P
P
Z
Z
Z
Z
Z
Z
M
X
X
Z
Z
Z
Z
Z
Z
P
1.5
2.2
Z
Z
Z
Z
3.3
Z
Z
4.7
Z
Z
10
Z
22
Z
47
100
10
16
25
50
100
200
500
16
25
50
100
200
500
50
100
200
25
50
100
200
500
50
100
200
SIZE
1210
1812
1825
2220
2225
Letter
Max.
A
B
C
E
G
J
K
M
N
P
Q
X
Y
Z
0.±±
0.22
0.56
0.71
0.90
0.94
1.02
1.27
1.40
1.52
1.80
2.29
(0.090)
2.54
2.79
Thickness (0.01±)
(0.009)
(0.022)
(0.028)
(0.0±5)
(0.0±7)
(0.040)
(0.050)
(0.055)
(0.060)
(0.071)
(0.100)
(0.110)
PAPER
EMBOSSED
NOTE: Contact factory for non-sꢀecified caꢀacitance values
100917
22
X7S Dielectric
General Specifications
GENERAL DESCRIPTION
X7S formulations are called “temperature stable” ceramics and
fall into EIA Class II materials. Its temperature variation of
capacitance s within 22ꢀ from –55ꢁC to +125ꢁC. This
capacitance change is non-linear.
Capacitance for X7S varies under the influence of electrical
operating conditions such as voltage and frequency.
X7S dielectric chip usage covers the broad spectrum of
industrial applications where known changes in capacitance due
to applied voltages are acceptable.
PART NUMBER (see page 2 for complete part number explanation)
1206
Z
Z
105
M
A
T
2
A
Size
(L" x W")
Voltage
4 = 4V
Dielectric
Z = X7S
Capacitance Capacitance
Failure
Rate
A = N/A
Special
Code
A = Std.
Product
Terminations
T = Plated Ni
and Sn
Packaging
2 = 7" Reel
4 = 13" Reel
Code (In pF)
2 Sig. Digits +
Number of
Zeros
Tolerance
K = 10ꢀ
M = 20ꢀ
6 = 6.3V
Z = 10V
Y = 16V
3 = 25V
5 = 50V
1 = 100V
2 = 200V
NOTE: Contact factory for availability of Tolerance Options for Specific Part Numbers.
TYPICAL ELECTRICAL CHARACTERISTICS
X7S Dielectric
Typical Temperature Coefficient
Insulation Resistance vs Temperature
⌬ Capacitance vs. Frequency
10,000
1,000
100
10
5
+30
+20
+10
0
-5
0
-10
-20
-30
-10
-15
-20
-25
-60 -40 -20
0
20 40 60 80 100 120 140
0
0
20
40
60
80
100
120
1KHz
10 KHz
100 KHz
1 MHz
10 MHz
Temperature (°C)
Frequency
Temperature °C
Variation of Impedance with Cap Value
Impedance vs. Frequency
1,000 pF vs. 10,000 pF - X7S
0805
Variation of Impedance with Chip Size
Impedance vs. Frequency
100,000 pF - X7S
Variation of Impedance with Chip Size
Impedance vs. Frequency
10,000 pF - X7S
10
10.00
10
1206
0805
1210
1206
0805
1210
1,000 pF
10,000 pF
1.0
0.1
.01
1.00
1.0
0.10
0.01
0.1
.01
100
1,000
1
10
100
1000
10
100
1,000
1
10
Frequency, MHz
Frequency, MHz
Frequency, MHz
101316
23
X7S Dielectric
Specifications and Test Methods
Parameter/Test
Operating Temperature Range
Capacitance
X7S Specification Limits
Measuring Conditions
Temperature Cycle Chamber
-55ºC to +125ºC
Within specified tolerance
≤ 5.0ꢀ for ≥ 100V DC rating
≤ 5.0ꢀ for ≥ 25V DC rating
≤ 10.0ꢀ for ≥ 10V DC rating
≤ 10.0ꢀ for ≤ 10V DC rating
100,000MΩ or 1000MΩ - μF,
whichever is less
Freq.: 1.0 kHz 10ꢀ
Voltage: 1.0Vrms .2V
For Cap > 10 μF, 0.5Vrms @ 120Hz
Dissipation Factor
Charge device with rated voltage for
120 5 secs @ room temp/humidity
Charge device with 250ꢀ of rated voltage for
1-5 seconds, w/charge and discharge current
limited to 50 mA (max)
Insulation Resistance
Dielectric Strength
No breakdown or visual defects
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
No defects
Deflection: 2mm
Test Time: 30 seconds
≤
12ꢀ
Resistance to
Flexure
Meets Initial Values (As Above)
≥ Initial Value x 0.3
Stresses
≥ 95ꢀ of each terminal should be covered
with fresh solder
No defects, <25ꢀ leaching of either end terminal
Dip device in eutectic solder at 230 5ºC
for 5.0 0.5 seconds
Solderability
Appearance
Capacitance
Variation
≤
7.5ꢀ
Dip device in eutectic solder at 260ºC for 60
seconds. Store at room temperature for 24
hours before measuring electrical properties.
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
2
Resistance to
Solder Heat
Meets Initial Values (As Above)
Meets Initial Values (As Above)
Meets Initial Values (As Above)
No visual defects
Appearance
Capacitance
Variation
Step 1: -55ºC 2º
Step 2: Room Temp
30 3 minutes
≤ 3 minutes
≤
7.5ꢀ
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
Thermal
Shock
Meets Initial Values (As Above)
Meets Initial Values (As Above)
Step 3: +125ºC 2º
Step 4: Room Temp
30 3 minutes
≤ 3 minutes
Repeat for 5 cycles and measure after
24 2 hours at room temperature
Meets Initial Values (As Above)
No visual defects
Charge device with 1.5 rated voltage (≤ 10V) in
test chamber set at 125ºC 2ºC
for 1000 hours (+48, -0)
≤
12.5ꢀ
≤ Initial Value x 2.0 (See Above)
≥ Initial Value x 0.3 (See Above)
Load Life
Remove from test chamber and stabilize
at room temperature for 24 2 hours
before measuring.
Meets Initial Values (As Above)
No visual defects
Store in a test chamber set at 85ºC 2ºC/
85ꢀ 5ꢀ relative humidity for 1000 hours
(+48, -0) with rated voltage applied.
≤
12.5ꢀ
Load
Humidity
≤ Initial Value x 2.0 (See Above)
≥ Initial Value x 0.3 (See Above)
Meets Initial Values (As Above)
Remove from chamber and stabilize at
room temperature and humidity for
24 2 hours before measuring.
101316
24
X7S Dielectric
Capacitance Range
PREFERRED SIZES ARE SHADED
SIZE
0402
0603
0805
1206
1210
Soldering
Packaging
Reflow/Wave
All Paper
Reflow/Wave
All Paper
Reflow/Wave
Reflow/Wave
Reflow Only
Paper/Embossed
Paper/Embossed
Paper/Embossed
mm
(in.)
1.00 0.10
1.60 0.15
2.01 0.20
3.20 0.20
3.20 0.20
(L) Length
(0.040 0.004)
(0.063 0.006)
(0.079 0.008)
(0.126 0.008)
(0.126 0.008)
mm
(in.)
0.50 0.10
(0.020 0.004)
0.81 0.15
(0.032 0.006)
1.25 0.20
(0.049 0.008)
1.60 0.20
(0.063 0.008)
2.50 0.20
(0.098 0.008)
(W) Width
mm
(in.)
0.25 0.15
(0.010 0.006)
0.35 0.15
(0.014 0.006)
0.50 0.25
(0.020 0.010)
0.50 0.25
(0.020 0.010)
0.50 0.25
(0.020 0.010)
(t) Terminal
WVDC
6.3
6.3
4
10
50
100
6.3
Cap
(pF)
100
150
220
330
470
680
1000
1500
2200
3300
4700
6800
0.010
0.015
0.022
0.033
0.047
0.068
0.10
0.15
0.22
0.33
0.47
0.68
1.0
Cap
(μF
C
C
C
C
G
G
G
G
1.5
2.2
3.3
4.7
N
N
N
N
Q
Q*
10
22
Z
47
100
WVDC
6.3
6.3
4
10
50
100
6.3
SIZE
0402
0603
0805
1206
1210
Letter
Max.
Thickness (0.013)
A
0.33
C
0.56
(0.022)
E
0.71
(0.028)
G
0.90
(0.035)
J
0.94
(0.037)
K
1.02
(0.040)
M
1.27
(0.050)
N
1.40
(0.055)
P
1.52
(0.060)
Q
1.90
(0.075)
X
2.29
(0.090)
Y
2.54
(0.100)
Z
2.79
(0.110)
PAPER
EMBOSSED
*Contact Factory for Specifications
101316
25
X5R Dielectric
General Specifications
GENERAL DESCRIPTION
• General Purꢀose Dielectric for Ceramic Caꢀacitors
• EIA Class II Dielectric
• Temꢀerature variation of caꢀacitance is within 15ꢂ
from -55°C to +85°C
• Well suited for decouꢀling and filtering aꢀꢀlications
• Available in High Caꢀacitance values (uꢀ to 100µp)
PART NUMBER (see page 2 for complete part number explanation)
1210
4
D
107
M
A
T
2
A
Size
(L" x W")
0101%%
0201
Voltage
4 = 4V
Dielectric
Capacitance Capacitance
Failure
Rate
Special
Code
Terminations
T = Plated Ni
and Sn
Packaging
2 = 7" Reel
Code (In pF)
2 Sig. Digits +
Tolerance
K = 10ꢂ
D = X5R
A = NꢇA
A = Std.
6 = 6.3V
Z = 10V
Y = 16V
3 = 25V
D = 35V
5 = 50V
1 = 100V
4 = 13" Reel
U = 4mm TR
(01005)
Number of Zeros
M = 20ꢂ
0402
0603
0805
1206
1210
1812
%%EIA 01005
NOTE: Contact factory for availability of Tolerance Oꢀtions for Sꢀecific Part Numbers.
Contact factory for non-sꢀecified caꢀacitance values.
TYPICAL ELECTRICAL CHARACTERISTICS
Temperature Coefficient
Insulation Resistance vs Temperature
10,000
1,000
100
20
15
10
5
0
-5
-10
-15
-20
0
-60 -40
-20
0
+20 +40 +60 +80
0
20
40
60
80
100
120
Temperature °C
Temperature °C
100917
26
X5R Dielectric
Specifications and Test Methods
Parameter/Test
Operating Temperature Range
Capacitance
X5R Specification Limits
Measuring Conditions
-55ºC to +85ºC
Within sꢀecified tolerance
Temꢀerature Cycle Chamber
ꢄ 2.5ꢂ for ꢃ 50V DC rating
ꢄ 12.5ꢂ for 25V, 35V DC rating
ꢄ 12.5ꢂ Max. for 16V DC rating and lower
Contact pactory for Dp by PN
10,000MΩ or 500MΩ - µp,
whichever is less
preq.: 1.0 kHz 10ꢂ
Voltage: 1.0Vrms .2V
por Caꢀ ꢅ 10 µp, 0.5Vrms ꢆ 120Hz
Dissipation Factor
Charge device with rated voltage for
120 5 secs ꢆ room temꢀꢇhumidity
Charge device with 250ꢂ of rated voltage for
1-5 seconds, wꢇcharge and discharge current
limited to 50 mA (max)
Insulation Resistance
Dielectric Strength
No breakdown or visual defects
Aꢀꢀearance
Caꢀacitance
No defects
ꢄ 12ꢂ
Deflection: 2mm
Test Time: 30 seconds
Resistance to
Flexure
Variation
Dissiꢀation
pactor
Meets Initial Values (As Above)
ꢃ Initial Value x 0.3
ꢃ 95ꢂ of each terminal should be covered
with fresh solder
No defects, ꢁ25ꢂ leaching of either end terminal
Stresses
Insulation
Resistance
Diꢀ device in eutectic solder at 230 5ºC
for 5.0 0.5 seconds
Solderability
Aꢀꢀearance
Caꢀacitance
Variation
ꢄ 7.5ꢂ
Diꢀ device in eutectic solder at 260ºC for 60
Dissiꢀation
pactor
seconds. Store at room temꢀerature for 24
2
Resistance to
Solder Heat
Meets Initial Values (As Above)
Meets Initial Values (As Above)
hours before measuring electrical ꢀroꢀerties.
Insulation
Resistance
Dielectric
Strength
Meets Initial Values (As Above)
No visual defects
Aꢀꢀearance
Caꢀacitance
Variation
Steꢀ 1: -55ºC 2º
Steꢀ 2: Room Temꢀ
30 3 minutes
ꢄ 3 minutes
ꢄ 7.5ꢂ
Dissiꢀation
pactor
Thermal
Shock
Meets Initial Values (As Above)
Meets Initial Values (As Above)
Steꢀ 3: +85ºC 2º
Steꢀ 4: Room Temꢀ
30 3 minutes
ꢄ 3 minutes
Insulation
Resistance
Dielectric
Strength
Reꢀeat for 5 cycles and measure after
24 2 hours at room temꢀerature
Meets Initial Values (As Above)
No visual defects
Aꢀꢀearance
Caꢀacitance
Variation
Charge device with 1.5X rated voltage in
test chamber set at 85ºC 2ºC for 1000 hours (+48, -0).
Note: Contact factory for %oꢀtional
ꢄ 12.5ꢂ
Dissiꢀation
pactor
sꢀecification ꢀart numbers that are tested at
ꢁ 1.5X rated voltage.
ꢄ Initial Value x 2.0 (See Above)
ꢃ Initial Value x 0.3 (See Above)
Load Life
Insulation
Resistance
Dielectric
Strength
Remove from test chamber and stabilize
at room temꢀerature for 24 2 hours
Meets Initial Values (As Above)
No visual defects
Aꢀꢀearance
Caꢀacitance
Variation
Store in a test chamber set at 85ºC 2ºCꢇ
85ꢂ 5ꢂ relative humidity for 1000 hours
(+48, -0) with rated voltage aꢀꢀlied.
ꢄ 12.5ꢂ
Load
Dissiꢀation
pactor
ꢄ Initial Value x 2.0 (See Above)
ꢃ Initial Value x 0.3 (See Above)
Meets Initial Values (As Above)
Humidity
Remove from chamber and stabilize at
room temꢀerature and humidity for
24 2 hours before measuring.
Insulation
Resistance
Dielectric
Strength
100917
27
X5R Dielectric
Capacitance Range
PREFERRED SIZES ARE SHADED
Case Size
Soldering
Packaging
0101*
0201
0402
0603
0805
Reflow Only
Reflow Only
All Paꢀer
ReflowꢇWave
All Paꢀer
ReflowꢇWave
All Paꢀer
ReflowꢇWave
PaꢀerꢇEmbossed
PaꢀerꢇEmbossed
(L) Length
mm
(in.)
0.40 0.02
0.60 0.09
1.00 0.10
1.60 0.15
2.01 0.20
(0.016 0.0008)
(0.024 0.004)
(0.040 0.004)
(0.063 0.006)
(0.079 0.008)
(W) Width
mm
0.20 0.02
0.30 0.09
0.50 0.10
0.81 0.15
1.25 0.20
(in.)
mm
(in.)
(0.008 0.0008
(0.011 0.004)
(0.020 0.004)
(0.032 0.006)
(0.049 0.008)
(t) Terminal
0.10 0.04
0.15 0.05
0.25 0.15
0.35 0.15
0.50 0.25
(0.004 0.0016)
(0.006 0.002)
(0.010 0.006
(0.014 0.006)
(0.020 0.010)
Voltage:
100
6.3
16
B
B
B
B
B
B
B
B
B
B
B
B
B
4
6.3
10
16
25
A
A
A
A
A
A
A
A
A
A
A
A
A
4
6.3
10
16
25
50
4
6.3
10
16
25
35
50
4
6.3
10
16
25
35
50
Caꢀ (ꢀp)
101
150
220
330
470
680
151
221
331
471
681
102
152
222
332
472
682
103
153
223
333
473
683
104
154
224
334
474
684
105
155
225
335
475
106
226
476
107
C
C
C
C
C
C
C
C
1000
1500
2200
3300
4700
6800
0.01
0.015
0.022
0.033
0.047
0.068
0.1
0.15
0.22
0.33
0.47
0.68
1.0
1.5
2.2
3.3
4.7
10
22
47
100
A
A
A
A
A
A
A
B
B
B
B
B
B
B
B
B
B
B
B
A
A
A
A
A
C
C
C
C
C
G
G
G
G
G
G
G
G
G
Caꢀ (µp)
G
G
G
G
G
G
G
G
G
G
J
G
G
G
G
G
A
A
A
A
A
p
p
C
C
C
C
C
N
N
N
N
N
C
C
A
A
C
C
C
C
C
E
C
G
N
N
N
N
N
N
N
N
N
N
B
A
A
p
p
C
C
C
C
C
C
C
G
G
G
G
G
N
P
P
P
P
C
C
C
P
P
P
P
p
p
p
E
G
G
G
J
J
G
G
N
N
G
J
J
K
K
G
J
J
J
K
J
J
J
J
K
J
N
N
J
P
P
N
N
N
P
P
P
E
E
E
E
E
E
G
J
N
P
P
P
P
4
N
P
P
N
P
P
Voltage:
6.3
16
4
6.3
10
16
25
4
6.3
10
16
25
50
4
6.3
10
16
25
35
50
6.3
10
16
25
35
50
Case Size
0101*
0201
0402
0603
0805
Letter
Max.
A
B
C
E
F
G
J
K
M
N
P
Q
X
Y
Z
0.±±
0.22
0.56
(0.022)
0.71
0.40
0.90
0.94
1.02
1.27
1.40
1.52
1.78
2.29
(0.090)
2.54
2.79
Thickness (0.01±)
(0.009)
(0.028)
(0.016)
(0.0±5)
(0.0±7)
(0.040)
(0.050)
(0.055)
(0.060)
(0.070)
(0.100)
(0.110)
PAPER
EMBOSSED
PAPER and EMBOSSED available for 01005
NOTE: Contact factory for non-sꢀecified caꢀacitance values
%EIA 01005
100917
28
X5R Dielectric
Capacitance Range
PREFERRED SIZES ARE SHADED
Case Size
Soldering
Packaging
1206
1210
1812
ReflowꢇWave
PaꢀerꢇEmbossed
Reflow Only
Reflow Only
All Embossed
PaꢀerꢇEmbossed
(L) Length
mm
(in.)
3.20 0.20
3.20 0.20
4.50 0.30
(0.126 0.008)
(0.126 0.008)
(0.177 0.012
(W) Width
mm
1.60 0.20
2.50 0.20
3.20 0.20
(in.)
mm
(in.)
(0.063 0.008)
(0.098 0.008)
(0.126 0.008
(t) Terminal
0.50 0.25
0.50 0.25
0.61 0.36
(0.020 0.010)
(0.020 0.010)
(0.024 0.014)
Voltage:
100
4
6.3
10
16
25
35
50
100
4
6.3
10
16
25
35
50
4
6.3
10
16
25
35
50
Caꢀ (ꢀp)
101
150
220
330
470
680
151
221
331
471
681
102
152
222
332
472
682
103
153
223
333
473
683
104
154
224
334
474
684
105
155
225
335
475
106
226
476
107
1000
1500
2200
3300
4700
6800
0.01
0.015
0.022
0.033
0.047
0.068
0.1
0.15
0.22
0.33
0.47
0.68
1.0
1.5
2.2
3.3
4.7
10
22
47
100
Caꢀ (µp)
Q
Q
Q
Q
Q
Q
X
X
Z
X
X
Z
Q
Q
Q
Q
X
X
X
Q
Q
X
X
X
X
Q
Q
X
X
X
X
X
X
X
X
X
4
X
X
X
X
X
X
X
X
X
X
Q
X
Z
Z
Z
Q
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
X
Z
Z
Z
6.3
Z
Z
Z
Z
4
X
6.3
Voltage
10
16
25
35
50
100
10
16
25
35
50
4
6.3
10
16
25
35
50
Case Size
1206
1210
1812
Letter
Max.
A
B
C
E
F
G
J
K
M
N
P
Q
X
Y
Z
0.±±
0.22
(0.009)
0.56
0.71
0.40
0.90
0.94
1.02
1.27
1.40
1.52
1.78
2.29
2.54
2.79
Thickness (0.01±)
(0.022)
(0.028)
(0.016)
(0.0±5)
(0.0±7)
(0.040)
(0.050)
(0.055)
(0.060)
(0.070)
(0.090)
(0.100)
(0.110)
PAPER
EMBOSSED
NOTE: Contact factory for non-sꢀecified caꢀacitance values
%EIA 01005
100917
29
Y5V Dielectric
General Specifications
Y5V formulations are for general-purpose use in a limited
temperature range. They have a wide temperature
characteristic of +22ꢀ –82ꢀ capacitance change over the
operating temperature range of –30ꢁC to +85ꢁC.
These characteristics make Y5V ideal for decoupling
applications within limited temperature range.
PART NUMBER (see page 2 for complete part number explanation)
0805
3
G
104
Z
A
T
2
A
Size
(L" x W")
Voltage
6.3V = 6
10V = Z
16V = Y
25V = 3
50V = 5
Dielectric
Y5V = G
Capacitance Capacitance
Failure
Rate
A = Not
Applicable
Terminations
T = Plated Ni
and Sn
Packaging
2 = 7" Reel
4 = 13" Reel
Special
Code
A = Std.
Product
Code (In pF)
2 Sig. Digits +
Number of
Zeros
Tolerance
Z = +80 –20ꢀ
Capacitance Change
vs. DC Bias Voltage
Temperature Coefficient
Insulation Resistance vs. Temperature
10,000
+20
+10
0
+40
+20
0
-10
1,000
100
0
-20
-30
-40
-50
-60
-70
-80
-20
-40
-60
-80
-100
-55 -35
+125
+20
+30
+40 +50 +60
+70 +80 +90
-15 +5 +25 +45 +65 +85 +105
0
20
40
60
100
80
Temperature °C
Temperature °C
% DC Bias Voltage
0.1 F - 0603
Impedance vs. Frequency
0.22 F - 0805
Impedance vs. Frequency
1 F - 1206
Impedance vs. Frequency
1,000
100
10
1,000
10,000
1,000
100
10
1
100
10
1
1
0.1
0.1
0.1
0.01
10,000
0.01
10,000
0.01
10,000
100,000
100,000
100,000
1,000,000
10,000,000
1,000,000
10,000,000
1,000,000
10,000,000
Frequency (Hz)
Frequency (Hz)
Frequency (Hz)
101316
30
Y5V Dielectric
Specifications and Test Methods
Parameter/Test
Operating Temperature Range
Capacitance
Y5V Specification Limits
Measuring Conditions
Temperature Cycle Chamber
-30ºC to +85ºC
Within specified tolerance
≤ 5.0ꢀ for ≥ 50V DC rating
≤ 7.0ꢀ for 25V DC rating
≤ 9.0ꢀ for 16V DC rating
≤ 12.5ꢀ for ≤ 10V DC rating
10,000MΩ or 500MΩ - μF,
whichever is less
Freq.: 1.0 kHz 10ꢀ
Voltage: 1.0Vrms .2V
For Cap > 10 μF, 0.5Vrms @ 120Hz
Dissipation Factor
Charge device with rated voltage for
120 5 secs @ room temp/humidity
Charge device with 250ꢀ of rated voltage for
1-5 seconds, w/charge and discharge current
limited to 50 mA (max)
Insulation Resistance
Dielectric Strength
No breakdown or visual defects
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
No defects
Deflection: 2mm
Test Time: 30 seconds
≤
30ꢀ
Resistance to
Flexure
Meets Initial Values (As Above)
≥ Initial Value x 0.1
Stresses
≥ 95ꢀ of each terminal should be covered
with fresh solder
No defects, <25ꢀ leaching of either end terminal
Dip device in eutectic solder at 230 5ºC
for 5.0 0.5 seconds
Solderability
Appearance
Capacitance
Variation
≤
20ꢀ
Dip device in eutectic solder at 260ºC for 60
seconds. Store at room temperature for 24
hours before measuring electrical properties.
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
2
Resistance to
Solder Heat
Meets Initial Values (As Above)
Meets Initial Values (As Above)
Meets Initial Values (As Above)
No visual defects
Appearance
Capacitance
Variation
Step 1: -30ºC 2º
Step 2: Room Temp
30 3 minutes
≤ 3 minutes
≤
20ꢀ
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
Thermal
Shock
Meets Initial Values (As Above)
Meets Initial Values (As Above)
Step 3: +85ºC 2º
Step 4: Room Temp
30 3 minutes
≤ 3 minutes
Repeat for 5 cycles and measure after
24 2 hours at room temperature
Meets Initial Values (As Above)
No visual defects
Charge device with twice rated voltage in
test chamber set at 85ºC 2ºC
for 1000 hours (+48, -0)
≤
30ꢀ
≤ Initial Value x 1.5 (See Above)
≥ Initial Value x 0.1 (See Above)
Load Life
Remove from test chamber and stabilize
at room temperature for 24 2 hours
before measuring.
Meets Initial Values (As Above)
No visual defects
Store in a test chamber set at 85ºC 2ºC/
85ꢀ 5ꢀ relative humidity for 1000 hours
(+48, -0) with rated voltage applied.
≤
30ꢀ
Load
Humidity
≤ Initial Value x 1.5 (See above)
≥ Initial Value x 0.1 (See Above)
Meets Initial Values (As Above)
Remove from chamber and stabilize at
room temperature and humidity for
24 2 hours before measuring.
101316
31
Y5V Dielectric
Capacitance Range
PREFERRED SIZES ARE SHADED
SIZE
Soldering
Packaging
0201
Reflow Only
All Paper
0402
Reflow/Wave
All Paper
0603
Reflow/Wave
All Paper
0805
1206
1210
Reflow/Wave
Reflow/Wave
Reflow Only
Paper/Embossed
Paper/Embossed
Paper/Embossed
mm
(in.)
0.60 0.09
(0.024 0.004)
1.00 0.10
(0.040 0.004)
1.60 0.15
(0.063 0.006)
2.01 0.20
(0.079 0.008)
3.20 0.20
(0.126 0.008)
3.20 0.20
(0.126 0.008)
(L) Length
mm
(in.)
0.30 0.09
(0.011 0.004)
0.50 0.10
(0.020 0.004)
.81 0.15
(0.032 0.006)
1.25 0.20
(0.049 0.008)
1.60 0.20
(0.063 0.008)
2.50 0.20
(0.098 0.008)
(W) Width
mm
(in.)
0.15 0.05
(0.006 0.002)
0.25 0.15
(0.010 0.006)
0.35 0.15
(0.014 0.006)
0.50 0.25
(0.020 0.010)
0.50 0.25
(0.020 0.010)
.50 0.25
(0.020 0.010)
(t) Terminal
WVDC
6.3
10
6
10
16
25
50
10
16
25
50
10
16
25
50
10
16
25
50
10
16
25
50
Cap
(pF)
820
1000
2200
A
A
4700
0.010
0.022
A
A
Cap
(μF)
A
A
0.047
0.10
0.22
A
C
C
C
G
G
K
N
G
0.33
0.47
1.0
G
G
G
C
G
J
C
6
C
C
G
J
N
N
M
M
M
Q
N
2.2
4.7
10.0
N
N
P
N
N
K
Q
X
N
N
P
Q
N
Q
N
Q
Q
Q
X
X
22.0
47.0
Z
WVDC
6.3
10
10
16
25
50
10
16
25
50
10
16
25
50
10
16
25
50
10
16
25
50
SIZE
0201
0402
0603
0805
1206
1210
Letter
Max.
Thickness (0.013)
A
0.33
C
0.56
(0.022)
E
0.71
(0.028)
G
J
0.94
(0.037)
K
1.02
(0.040)
M
1.27
(0.050)
N
1.40
(0.055)
P
1.52
(0.060)
Q
1.78
(0.070)
X
2.29
(0.090)
Y
2.54
(0.100)
Z
2.79
(0.110)
0.90
(0.035)
PAPER
EMBOSSED
101316
32
MLCC Gold Termination – AU Series
General Specifications
AVX Corporation will support those customers for
commercial and military Multilayer Ceramic Capacitors with
a termination consisting of Gold. This termination is
indicated by the use of a “7” or “G” in the 12th position of
the AVX Catalog Part Number. This fulfills AVX’s
commitment to providing a full range of products to our
customers. Please contact the factory if you require
additional information on our MLCC Gold Termination.
PART NUMBER
AU03
C
104
K
A
7
2
A
Y
Size
Dielectric
Capacitance
Capacitance
Tolerance
Failure
Rate
A = Not
Applicable
Terminations
G* = 1.9 μ" to
7.87 μ"
Packaging
2 = 7" Reel
Special
Code
A = Std.
Product
Voltage
6.3V = 6
10V = Z
16V = Y
25V = 3
35V = D
50V = 5
100V = 1
200V = 2
500V = 7
AU01 - 0201
AU02 - 0402
AU03 - 0603
AU05 - 0805
AU06 - 1206
AU10 - 1210
AU12 - 1812
AU13 - 1825
AU14 - 2225
AU16 - 0306
AU17 - 0508
AU18 - 0612
C0G (NP0) = A Code (In pF)
X7R = C
X5R = D
B = .10 pF (<10pF)
C = .25 pF (<10pF)
D = .50 pF (<10pF)
F = 1ꢀ (≥ 10 pF)
G = 2ꢀ (≥ 10 pF)
4 = 13" Reel
U = 4mm TR
(01005)
2 Sig. Digits +
Number of
Zeros
7 = 100 μ"
minimum
Contact
Factory
For
J
=
5ꢀ
K = 10ꢀ
M = 20ꢀ
Multiples*
* Contact factory for availability.
041416
33
MLCC Gold Termination – AU Series
Capacitance Range (NP0 Dielectric)
PREFERRED SIZES ARE SHADED
SIZE
AU01
AU02
AU03
AU05
AU06
Soldering
Reflow/Epoxy/
Reflow/Epoxy/
Reflow/Epoxy/
Reflow/Epoxy/
Reflow/Epoxy/
Wire Bond*
Wire Bond*
Wire Bond
Wire Bond
Wire Bond
Packaging
All Paper
All Paper
All Paper
Paper/Embossed
Paper/Embossed
mm
(in.)
0.60 0.09
1.00 0.10
1.60 0.15
2.01 0.20
3.20 0.20
(L) Length
(0.024 0.004
(0.040 0.004)
(0.063 0.006)
(0.079 0.008)
(0.126 0.008)
mm
(in.)
0.30 0.09
(0.011 0.004)
0.50 0.10
(0.020 0.004)
0.81 0.15
(0.032 0.006)
1.25 0.20
(0.049 0.008)
1.60 0.20
(0.063 0.008)
(W) Width
mm
(in.)
0.15 0.05
(0.006 0.002)
0.25 0.15
(0.010 0.006)
0.35 0.15
(0.014 0.006)
0.50 0.25
(0.020 0.010)
0.50 0.25
(0.020 0.010)
(t) Terminal
WVDC
0.5
1.0
1.2
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10
12
15
18
22
27
33
39
47
56
68
16
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
25
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
16
25
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
50
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
16
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
25
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
50
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
100
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
16
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
25
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
50
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
100
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
200
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
16
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
25
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
50
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
M
M
M
M
100
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
P
P
P
P
P
200
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
500
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
Cap
(pF)
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
82
100
120
150
180
220
270
330
390
470
560
680
820
1000
1200
1500
1800
2200
2700
3300
3900
4700
5600
6800
8200
0.010
0.012
0.015
0.018
0.022
0.027
0.033
0.039
0.047
0.068
0.082
0.1
J
M
M
M
M
M
M
P
M
M
M
M
M
J
J
J
J
M
Q
Q
Q
Cap
(μF)
WVDC
16
25
16
25
50
16
25
50
100
16
25
50
100
200
16
25
50
Z
100
200
500
SIZE
AU01
AU02
AU03
AU05
AU06
* Contact factory
Letter
Max.
A
0.33
C
0.56
E
0.71
(0.028)
G
J
K
1.02
(0.040)
M
N
1.40
(0.055)
P
Q
1.78
(0.070)
X
2.29
(0.090)
Y
2.54
0.90
(0.035)
0.94
(0.037)
1.27
(0.050)
1.52
(0.060)
2.79
(0.110)
Thickness (0.013)
(0.022)
(0.100)
PAPER
EMBOSSED
041416
34
MLCC Gold Termination – AU Series
Capacitance Range (NP0 Dielectric)
PREFERRED SIZES ARE SHADED
SIZE
AU10
AU12
AU13
AU14
Soldering
Reflow/Epoxy/
Reflow/Epoxy/
Reflow/Epoxy/
Reflow/Epoxy/
Wire Bond*
Wire Bond*
Wire Bond*
Wire Bond*
Packaging
Paper/Embossed
All Embossed
All Embossed
All Embossed
mm
(in.)
3.20 0.20
4.50 0.30
4.50 0.30
5.72 0.25
(L) Length
(0.126 0.008)
(0.177 0.012)
(0.177 0.012)
(0.225 0.010)
mm
(in.)
2.50 0.20
(0.098 0.008)
3.20 0.20
(0.126 0.008)
6.40 0.40
(0.252 0.016)
6.35 0.25
(0.250 0.010)
(W) Width
mm
(in.)
0.50 0.25
(0.020 0.010)
0.61 0.36
(0.024 0.014)
0.61 0.36
(0.024 0.014)
0.64 0.39
(0.025 0.015)
(t) Terminal
WVDC
0.5
1.0
25
50
100
200
500
25
50
100
200
500
50
100
200
50
100
200
Cap
(pF)
1.2
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10
12
J
J
15
J
18
J
22
J
27
J
33
J
39
J
47
J
56
J
68
J
82
J
100
120
150
180
220
270
330
390
470
560
680
820
1000
1200
1500
1800
2200
2700
3300
3900
4700
5600
6800
8200
0.010
0.012
0.015
0.018
0.022
0.027
0.033
0.039
0.047
J
J
J
J
J
J
J
M
M
M
M
M
M
M
M
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
M
M
M
M
K
K
K
K
K
P
P
P
P
P
X
M
M
M
M
P
Q
Q
Q
Q
X
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
P
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
P
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
Y
P
P
P
P
P
P
P
P
P
P
P
P
P
P
Y
Y
Y
Y
M
M
M
Q
Q
J
M
M
K
K
M
M
M
M
M
M
M
M
M
M
Cap
(μF)
K
M
M
M
M
M
M
M
P
P
P
P
Y
P
P
P
P
0.068
0.082
0.1
M
M
M
M
P
Q
Q
WVDC
25
50
100
200
500
25
50
100
200
500
50
100
200
50
100
200
SIZE
* Contact factory
AU10
AU12
AU13
AU14
Letter
Max.
Thickness (0.013)
A
0.33
C
0.56
(0.022)
E
0.71
(0.028)
G
0.90
(0.035)
J
0.94
(0.037)
K
1.02
(0.040)
M
1.27
(0.050)
N
1.40
(0.055)
P
1.52
(0.060)
Q
1.78
(0.070)
X
2.29
(0.090)
Y
2.54
(0.100)
Z
2.79
(0.110)
PAPER
EMBOSSED
041416
35
MLCC Gold Termination – AU Series
Capacitance Range (X7R Dielectric)
PREFERRED SIZES ARE SHADED
SIZE
AU02
AU03
AU05
AU06
Soldering
Reflow/Epoxy
Reflow/Epoxy
Reflow/Epoxy
Reflow/Epoxy
Wire Bond*
Wire Bond*
Wire Bond*
Wire Bond*
Packaging
All Paper
All Paper
Paper/Embossed
Paper/Embossed
mm
(in.)
1.00 0.10
1.60 0.15
2.01 0.20
3.20 0.20
(L) Length
(0.040 0.004)
(0.063 0.006)
(0.079 0.008)
(0.126 0.008)
mm
(in.)
0.50 0.10
(0.020 0.004)
0.81 0.15
(0.032 0.006)
1.25 0.20
(0.049 0.008)
1.60 0.20
(0.063 0.008)
(W) Width
mm
(in.)
0.25 0.15
(0.010 0.006)
0.35 0.15
(0.014 0.006)
0.50 0.25
(0.020 0.010)
0.50 0.25
(0.020 0.010)
(t) Terminal
WVDC
16
25
50
6.3
10
16
25
50
100
200
6.3
10
16
25
50
100
200
6.3
10
16
25
50
100 200
500
Cap
(pF)
100
150
220
330
470
680
C
C
C
C
C
C
C
C
C
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
K
K
K
1000
1500
2200
3300
4700
6800
0.010
0.015
0.022
0.033
0.047
0.068
0.10
0.15
0.22
0.33
0.47
0.68
1.0
K
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
P
P
Q
Q
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
M
P
C
C
C
C
C
C
C
C
Cap
(μF
J
J
J
J
P
G
G
G
G
G
G
M
M
M
M
P
P
N
N
N
N
N
N
N
N
G
G
G
J
J
C*
G
G
G
M
Q
Q
Q
Q
Q
Q
G
G
N
N
N
N
N*
J
M
M
Q
Q
Q
Q
J*
M
M
M
P
Q
M
M
M
Q
Q
J*
J*
1.5
2.2
J*
P*
3.3
4.7
10
P*
P*
Q*
Q*
Q*
Q*
Q*
P*
22
Q*
47
100
WVDC
16
25
50
6.3
10
16
25
50
100
200
6.3
10
16
25
50
100
200
6.3
10
16
25
50
100 200
500
SIZE
AU02
AU03
AU05
AU06
* Contact factory
Letter
Max.
Thickness (0.013)
A
0.33
C
0.56
(0.022)
E
0.71
(0.028)
G
J
0.94
(0.037)
K
M
1.27
(0.050)
N
1.40
(0.055)
P
Q
1.78
(0.070)
X
2.29
(0.090)
Y
Z
2.79
(0.110)
0.90
(0.035)
1.02
(0.040)
1.52
(0.060)
2.54
(0.100)
PAPER
EMBOSSED
041416
36
MLCC Gold Termination – AU Series
Capacitance Range (X7R Dielectric)
PREFERRED SIZES ARE SHADED
SIZE
AU10
AU12
AU13
AU14
Soldering
Reflow/Epoxy/
Reflow/Epoxy/
Reflow/Epoxy/ Reflow/Epoxy/
Wire Bond*
Wire Bond*
Wire Bond* Wire Bond*
Packaging
Paper/Embossed
All Embossed
All Embossed All Embossed
mm
(in.)
3.20 0.20
4.50 0.30
4.50 0.30
5.72 0.25
(L) Length
(0.126 0.008)
(0.177 0.012)
(0.177 0.012)
(0.225 0.010)
mm
(in.)
2.50 0.20
(0.098 0.008)
3.20 0.20
(0.126 0.008)
6.40 0.40
(0.252 0.016)
6.35 0.25
(0.250 0.010)
(W) Width
mm
(in.)
0.50 0.25
(0.020 0.010)
0.61 0.36
(0.024 0.014)
0.61 0.36
(0.024 0.014)
0.64 0.39
(0.025 0.015)
(t) Terminal
WVDC
10
16
25
50
100
200
500
50
100
200
500
50
100
50
100
Cap
(pF)
100
150
220
330
470
680
1000
1500
2200
3300
4700
6800
0.010
0.015
0.022
0.033
0.047
0.068
0.10
0.15
0.22
0.33
0.47
0.68
1.0
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
N
N
X
X
X
Z
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
N
N
X
X
X
Z
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
P
P
Z
Z
Z
Z
Z
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
X
X
Z
Z
Z
Z
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
M
M
M
P
Cap
(μF
K
K
K
K
K
K
K
K
K
K
K
M
M
Z
K
K
K
K
K
K
K
K
K
M
P
Q
X
K
K
K
K
K
K
K
P
P
X
K
P
P
X
Z
Z
Z
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
P
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
P
P
P
P
P
P
P
P
P
P
P
P
P
X
Q
Q
J
J
J
J
M
M
Z
Z
M
P
Q
Q
X
Z
Z
Z
P
1.5
2.2
3.3
4.7
Z
Z
Z
Z
Z
10
22
47
100
WVDC
10
16
25
50
100
200
500
50
100
200
500
50
100
50
100
SIZE
* Contact factory
AU10
AU12
AU13
AU14
Letter
Max.
Thickness (0.013)
A
0.33
C
0.56
(0.022)
E
0.71
(0.028)
G
0.90
(0.035)
J
0.94
(0.037)
K
1.02
(0.040)
M
1.27
(0.050)
N
1.40
(0.055)
P
1.52
(0.060)
Q
1.78
(0.070)
X
2.29
(0.090)
Y
2.54
(0.100)
Z
2.79
(0.110)
PAPER
EMBOSSED
041416
37
MLCC Gold Termination – AU Series
Capacitance Range (X5R Dielectric)
PREFERRED SIZES ARE SHADED
SIZE
AU01
AU02
AU03
AU05
AU06
AU10
AU12
Soldering
Reflow/Epoxy/
Reflow/Epoxy/
Reflow/Epoxy/
Reflow/Epoxy/
Reflow/Epoxy/
Reflow/Epoxy/
Wire Bond*
Wire Bond*
Wire Bond*
Wire Bond*
Wire Bond*
Wire Bond*
Packaging
All Paper
All Paper
All Paper
Paper/Embossed
Paper/Embossed
Paper/Embossed
mm
(in.)
0.60 0.09
1.00 0.10
1.60 0.15
2.01 0.20
3.20 0.20
3.20 0.20
(L) Length
(0.024 0.004)
(0.040 0.004)
(0.063 0.006)
(0.079 0.008)
(0.126 0.008)
(0.126 0.008)
mm
(in.)
0.30 0.09
(0.011 0.004)
0.50 0.10
(0.020 0.004)
0.81 0.15
(0.032 0.006)
1.25 0.20
(0.049 0.008)
1.60 0.20
(0.063 0.008)
2.50 0.20
(0.098 0.008)
(W) Width
mm
(in.)
0.15 0.05
(0.006 0.002)
0.25 0.15
(0.010 0.006)
0.35 0.15
(0.014 0.006)
0.50 0.25
(0.020 0.010)
0.50 0.25
(0.020 0.010)
0.50 0.25
(0.020 0.010)
(t) Terminal
WVDC
6.3 10 16 25
4
6.3 10 16 25 50
4
6.3 10 16 25 35 50 6.3 10 16 25 35 50 6.3 10 16 25 35 50
4
6.3 10 16 25 35 50 6.3 10 25 50
Cap
(pF)
100
150
220
A
A
A
A
A
A
A
A
A
A
A
A
C
330
470
680
A
A
A
A
A
A
A
A
A
A
A
A
C
C
C
1000
1500
2200
A
A
A
A
A
A
A
A
A
A
C
C
C
3300
4700
6800
A
A
A
A
A
A
C
C
C
G
G
Cap
(μF)
0.010
0.015
0.022
A
A
A
A
C
C
G
G
G
G
G
G
G
C
C
C
C
N
0.033
0.047
0.068
A
A
C
C
C
G
G
G
G
G
G
G
G
N
N
N
0.10
0.15
0.22
A
C
C
C
G
G
G
G
N
N
N
N
N
N
C*
G
Q
0.33
0.47
0.68
G
G
G
G
N
N
N
C* C*
Q
Q
Q
X
1.0
1.5
2.2
G
G
G
J*
N
N
N
N
N
N
N
N
P*
Q
Q
X
Z
X
X
X
C*
G* G* J* J*
N
Q
3.3
4.7
10
J* J* J* J*
J* J* J*
K*
N
N
N
N
Q
Q
Q
Q
Q
Q
N* N*
Q
Q
Q
Q*
Q
Z
Z
Z
P* P* P*
X
Z
Z
22
47
P*
Q* Q* Q*
Q*
Z
Z*
Z
Z
100
Z* Z*
6.3 10 16 25 35 50 6.3 10 25 50
WVDC
6.3 10 16 25
4
6.3 10 16 25 50
4
6.3 10 16 25 35 50 6.3 10 16 25 35 50 6.3 10 16 25 35 50
4
SIZE
* Contact factory
AU01
AU02
AU03
AU05
AU06
AU10
AU12
Letter
Max.
Thickness (0.013)
A
0.33
C
0.56
(0.022)
E
0.71
(0.028)
G
0.90
(0.035)
J
0.94
(0.037)
K
1.02
(0.040)
M
1.27
(0.050)
N
1.40
(0.055)
P
1.52
(0.060)
Q
1.78
(0.070)
X
2.29
(0.090)
Y
2.54
(0.100)
Z
2.79
(0.110)
PAPER
EMBOSSED
= *Optional Specifications – Contact factory
NOTE: Contact factory for non-specified capacitance values
041416
38
MLCC Gold Termination – AU Series
AU16/AU17/AU18
SIZE
AU16
AU17
AU18
PHYSICAL DIMENSIONS AND
PAD LAYOUT
(0306)
(0508)
(0612)
Packaging
Embossed
Embossed
Embossed
mm
(in.)
0.81 0.15
1.27 0.25
1.60 0.25
Length
(0.032 0.006)
(0.050 0.010)
(0.063 0.010)
mm
(in.)
1.60 0.15
2.00 0.25
3.20 0.25
Width
(0.063 0.006)
(0.080 0.010)
(0.126 0.010)
t
W
Cap Code
102
222
332
472
682
103
153
223
333
473
683
104
154
224
334
474
684
105
155
225
335
475
WVDC
4
6.3 10 16 25 6.3 10 16 25 50 6.3 10 16 25 50
Cap 0.001
(μF) 0.0022
0.0033
0.0047
0.0068
0.01
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
S
S
S
S
S
S
S
S
S
S
S
S
S
S
V
V
A
A
A
S
S
S
S
S
S
S
S
S
S
S
S
S
S
V
V
A
A
S
S
S
S
S
S
S
S
S
S
S
V
V
A
A
A
S
S
S
S
S
S
S
S
V
V
A
A
V
V
V
V
V
V
V
V
V
A
A
A
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
V
V
W
A
A
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
V
V
W
A
S
S
S
S
S
S
S
S
S
S
S
S
S
V
V
V
W
A
S
S
S
S
S
S
S
S
S
S
V
V
V
T
V
V
V
L
V
0.015
0.022
0.033
0.047
0.068
0.1
W
W
W
W
W
W
W
PHYSICAL DIMENSIONS
mm (in)
L
W
t
V
AU16
(0306)
AU17
(0508)
AU18
(0612)
0.81 0.15
(0.032 0.006)
1.60 0.15
(0.063 0.006)
0.13 min.
(0.005 min.)
0.15
W
W
0.22
1.27 0.25
(0.050 0.010)
2.00 0.25
(0.080 0.010)
0.13 min.
(0.005 min.)
0.33
0.47
1.60 0.25
(0.063 0.010)
3.20 0.25
(0.126 0.010)
0.13 min.
(0.005 min.)
0.68
1
A
T - See Range Chart for Thickness and Codes
1.5
2.2
3.3
PAD LAYOUT DIMENSIONS
mm (in)
4.7
A
B
C
685
106
6.8
10
AU16
(0306)
0.31 (0.012)
1.52 (0.060)
0.51 (0.020)
AU17
0.51 (0.020)
0.76 (0.030)
2.03 (0.080)
3.05 (0.120)
0.51 (0.020)
Solid = X7R
= X5R
= X7S
(0508)
AU18
(0612)
0.635 (0.025)
mm (in.)
mm (in.)
mm (in.)
AU16
(0306)
AU17
(0508)
AU18
(0612)
Code Thickness
Code Thickness
Code Thickness
A
0.56 (0.022)
S
V
A
0.56 (0.022)
0.76 (0.030)
1.02 (0.040)
S
V
0.56 (0.022)
0.76 (0.030)
1.02 (0.040)
1.27 (0.050)
W
A
“B”
C
“A”
C
041416
39
MLCC Tin/Lead Termination “B”
C0G (NP0) – General Specifications
AVX Corporation will support those customers for
commercial and military Multilayer Ceramic Capacitors with
a termination consisting of 5ꢀ minimum lead. This
termination is indicated by the use of a “B” in the 12th
position of the AVX Catalog Part Number. This fulfills AVX’s
commitment to providing a full range of products to our
customers. AVX has provided in the following pages a full
range of values that we are currently offering in this special
“B” termination. Please contact the factory if you require
additional information on our MLCC Tin/Lead Termination
“B” products.
Not RoHS Compliant
PART NUMBER (see page 2 for complete part number explanation)
LD05
A
101
J
A
B
2
A
5
Size
Dielectric
Capacitance
Capacitance
Tolerance
Failure
Rate
Terminations
B = 5ꢀ min lead
X = FLEXITERM®
with 5ꢀ min
lead**
Packaging
Special
Code
A = Std.
Product
Voltage
6.3V = 6
10V = Z
16V = Y
25V = 3
35V = D
50V = 5
100V = 1
200V = 2
500V = 7
LD02 - 0402
LD03 - 0603
LD04 - 0504*
LD05 - 0805
LD06 - 1206
LD10 - 1210
LD12 - 1812
LD13 - 1825
LD14 - 2225
LD20 - 2220
C0G (NP0) = A Code (In pF)
2 = 7" Reel
X7R = C
B = .10 pF (<10pF) A = Not
C = .25 pF (<10pF) Applicable
D = .50 pF (<10pF)
4 = 13" Reel
2 Sig. Digits +
Number of
X5R = D
X8R = F
Contact Factory
For
Zeros
F = 1ꢀ (≥ 10 pF)
G = 2ꢀ (≥ 10 pF)
Multiples
**X7R only
J
=
5ꢀ
K = 10ꢀ
M = 20ꢀ
See FLEXITERM® section for CV options
*LD04 has the same CV ranges as LD03.
NOTE: Contact factory for availability of Tolerance Options for Specific Part Numbers.
Contact factory for non-specified capacitance values.
Insulation Resistance vs Temperature
10,000
1,000
100
0
40
60
80
100
0
20
Temperature °C
112916
40
MLCC Tin/Lead Termination “B”
C0G (NP0) – Specifications and Test Methods
Parameter/Test
Operating Temperature Range
Capacitance
NP0 Specification Limits
-55ºC to +125ºC
Within specified tolerance
<30 pF: Q≥ 400+20 x Cap Value
≥30 pF: Q≥ 1000
Measuring Conditions
Temperature Cycle Chamber
Freq.: 1.0 MHz 10ꢀ for cap ≤ 1000 pF
1.0 kHz 10ꢀ for cap > 1000 pF
Voltage: 1.0Vrms .2V
Q
100,000MΩ or 1000MΩ - μF,
whichever is less
Charge device with rated voltage for
60 5 secs @ room temp/humidity
Charge device with 250ꢀ of rated voltage for
1-5 seconds, w/charge and discharge current
limited to 50 mA (max)
Insulation Resistance
Dielectric Strength
No breakdown or visual defects
Note: Charge device with 150ꢀ of rated
voltage for 500V devices.
Appearance
Capacitance
Variation
No defects
Deflection: 2mm
Test Time: 30 seconds
5ꢀ or .5 pF, whichever is greater
Resistance to
Flexure
Q
Meets Initial Values (As Above)
≥ Initial Value x 0.3
Stresses
Insulation
Resistance
≥ 95ꢀ of each terminal should be covered
with fresh solder
No defects, <25ꢀ leaching of either end terminal
Dip device in eutectic solder at 230 5ºC
for 5.0 0.5 seconds
Solderability
Appearance
Capacitance
Variation
≤
≤
≤
2.5ꢀ or .25 pF, whichever is greater
Dip device in eutectic solder at 260ºC for 60
seconds. Store at room temperature for 24
hours before measuring electrical properties.
2
Resistance to
Solder Heat
Q
Meets Initial Values (As Above)
Meets Initial Values (As Above)
Insulation
Resistance
Dielectric
Meets Initial Values (As Above)
No visual defects
Strength
Appearance
Capacitance
Variation
Step 1: -55ºC 2º
Step 2: Room Temp
30 3 minutes
≤ 3 minutes
2.5ꢀ or .25 pF, whichever is greater
Thermal
Shock
Q
Meets Initial Values (As Above)
Meets Initial Values (As Above)
Step 3: +125ºC 2º
Step 4: Room Temp
30 3 minutes
≤ 3 minutes
Insulation
Resistance
Dielectric
Repeat for 5 cycles and measure after
24 hours at room temperature
Meets Initial Values (As Above)
No visual defects
Strength
Appearance
Capacitance
Variation
3.0ꢀ or .3 pF, whichever is greater
Charge device with twice rated voltage in
test chamber set at 125ºC 2ºC
for 1000 hours (+48, -0).
≥ 30 pF:
≥10 pF, <30 pF:
<10 pF:
Q≥ 350
Q≥ 275 +5C/2
Q≥ 200 +10C
Q
Load Life
(C=Nominal Cap)
Insulation
Resistance
Dielectric
Remove from test chamber and stabilize at
room temperature for 24 hours
before measuring.
≥ Initial Value x 0.3 (See Above)
Meets Initial Values (As Above)
No visual defects
Strength
Appearance
Capacitance
Variation
≤
5.0ꢀ or .5 pF, whichever is greater
Store in a test chamber set at 85ºC 2ºC/
85ꢀ 5ꢀ relative humidity for 1000 hours
(+48, -0) with rated voltage applied.
≥ 30 pF:
≥10 pF, <30 pF:
<10 pF:
Q≥ 350
Q≥ 275 +5C/2
Q≥ 200 +10C
Load
Q
Humidity
Insulation
Resistance
Dielectric
Strength
Remove from chamber and stabilize at
room temperature for 24 2 hours
before measuring.
≥ Initial Value x 0.3 (See Above)
Meets Initial Values (As Above)
112916
41
MLCC Tin/Lead Termination “B”
Capacitance Range (NP0 Dielectric)
PREFERRED SIZES ARE SHADED
SIZE
LD02
LD03
LD05
LD06
Soldering
Packaging
Reflow/Wave
All Paper
Reflow/Wave
All Paper
Reflow/Wave
Reflow/Wave
Paper/Embossed
Paper/Embossed
mm
(in.)
1.00 0.10
1.60 0.15
2.01 0.20
3.20 0.20
(L) Length
(0.040 0.004)
(0.063 0.006)
(0.079 0.008)
(0.126 0.008)
mm
(in.)
0.50 0.10
(0.020 0.004)
0.81 0.15
(0.032 0.006)
1.25 0.20
(0.049 0.008)
1.60 0.20
(0.063 0.008)
(W) Width
mm
(in.)
0.25 0.15
(0.010 0.006)
0.35 0.15
(0.014 0.006)
0.50 0.25
(0.020 0.010)
0.50 0.25
(0.020 0.010)
(t) Terminal
WVDC
0.5
1.0
1.2
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10
12
15
18
22
27
33
39
47
56
68
16
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
25
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
50
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
16
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
25
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
50
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
100
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
16
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
25
50
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
100
200
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
16
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
25
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
50
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
M
M
M
M
100
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
P
P
P
P
P
200
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
500
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
Cap
(pF)
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
82
100
120
150
180
220
270
330
390
470
560
680
820
1000
1200
1500
1800
2200
2700
3300
3900
4700
5600
6800
8200
0.010
0.012
0.015
0.018
0.022
0.027
0.033
0.039
0.047
0.068
0.082
0.1
J
M
M
M
M
M
M
P
M
M
M
M
M
J
J
J
J
M
Q
Q
Q
Cap
(μF)
WVDC
16
25
50
E
16
25
50
100
16
25
50
100
200
16
25
50
100
200
500
SIZE
LD02
LD03
LD05
LD06
Letter
Max.
Thickness (0.013)
A
C
G
J
K
M
N
P
Q
X
Y
Z
0.33
0.56
(0.022)
0.71
(0.028)
0.90
(0.035)
0.94
(0.037)
1.02
(0.040)
1.27
(0.050)
1.40
(0.055)
1.52
(0.060)
1.78
(0.070)
2.29
(0.090)
2.54
(0.100)
2.79
(0.110)
PAPER
EMBOSSED
112916
42
MLCC Tin/Lead Termination “B”
Capacitance Range (NP0 Dielectric)
PREFERRED SIZES ARE SHADED
SIZE
LD10
LD12
LD13
LD14
Soldering
Reflow Only
Reflow Only
Reflow Only
Reflow Only
Packaging
Paper/Embossed
All Embossed
All Embossed
All Embossed
mm
(in.)
3.20 0.20
4.50 0.30
4.50 0.30
5.72 0.25
(L) Length
(0.126 0.008)
(0.177 0.012)
(0.177 0.012)
(0.225 0.010)
mm
(in.)
2.50 0.20
(0.098 0.008)
3.20 0.20
(0.126 0.008)
6.40 0.40
(0.252 0.016)
6.35 0.25
(0.250 0.010)
(W) Width
mm
(in.)
0.50 0.25
(0.020 0.010)
0.61 0.36
(0.024 0.014)
0.61 0.36
(0.024 0.014)
0.64 0.39
(0.025 0.015)
(t) Terminal
WVDC
0.5
1.0
25
50
100
200
500
25
50
100
200
500
50
100
200
50
100
200
Cap
(pF)
1.2
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10
12
J
J
15
J
18
J
22
J
27
J
33
J
39
J
47
J
56
J
68
J
82
J
100
120
150
180
220
270
330
390
470
560
680
820
1000
1200
1500
1800
2200
2700
3300
3900
4700
5600
6800
8200
0.010
0.012
0.015
0.018
0.022
0.027
0.033
0.039
0.047
J
J
J
J
J
J
J
M
M
M
M
M
M
M
M
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
M
M
M
M
K
K
K
K
K
P
P
P
P
P
X
M
M
M
M
P
Q
Q
Q
Q
X
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
P
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
P
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
Y
P
P
P
P
P
P
P
P
P
P
P
P
P
P
Y
Y
Y
Y
M
M
M
Q
Q
J
M
M
K
K
M
M
M
M
M
M
M
M
M
M
Cap
(μF)
K
M
M
M
M
M
M
M
P
P
P
P
Y
P
P
P
P
0.068
0.082
0.1
M
M
M
M
P
Q
Q
WVDC
25
50
100
200
500
25
50
100
200
500
50
100
200
50
100
200
SIZE
LD10
LD12
LD13
LD14
Letter
Max.
Thickness (0.013)
A
0.33
C
0.56
(0.022)
E
0.71
(0.028)
G
0.90
(0.035)
J
0.94
(0.037)
K
1.02
(0.040)
M
1.27
(0.050)
N
1.40
(0.055)
P
1.52
(0.060)
Q
1.78
(0.070)
X
2.29
(0.090)
Y
2.54
(0.100)
Z
2.79
(0.110)
PAPER
EMBOSSED
112916
43
MLCC Tin/Lead Termination “B”
X8R – General Specifications
AVX Corporation will support those customers for
commercial and military Multilayer Ceramic Capacitors with
a termination consisting of 5ꢀ minimum lead. This
termination is indicated by the use of a “B” in the 12th
position of the AVX Catalog Part Number. This fulfills AVX’s
commitment to providing a full range of products to our
customers. AVX has provided in the following pages a full
range of values that we are currently offering in this special
“B” termination. Please contact the factory if you require
additional information on our MLCC Tin/Lead Termination
“B” products.
Not RoHS Compliant
PART NUMBER (see page 2 for complete part number explanation)
LD05
F
101
J
A
B
2
A
5
Size
Dielectric
X8R = F
Capacitance
Code (In pF)
2 Sig. Digits +
Number of
Zeros
Capacitance
Tolerance
Failure
Rate
Terminations
B = 5ꢀ min lead
X = FLEXITERM®
with 5ꢀ min
lead**
Packaging
Special
Code
A = Std.
Product
Voltage
6.3V = 6
10V = Z
16V = Y
25V = 3
35V = D
50V = 5
100V = 1
200V = 2
500V = 7
LD02 - 0402
LD03 - 0603
LD04 - 0504*
LD05 - 0805
LD06 - 1206
LD10 - 1210
LD12 - 1812
LD13 - 1825
LD14 - 2225
LD20 - 2220
2 = 7" Reel
B = .10 pF (<10pF) A = Not
C = .25 pF (<10pF) Applicable
D = .50 pF (<10pF)
4 = 13" Reel
Contact Factory
For
F = 1ꢀ (≥ 10 pF)
G = 2ꢀ (≥ 10 pF)
Multiples
**X7R only
J
=
5ꢀ
K = 10ꢀ
M = 20ꢀ
See FLEXITERM® section for CV options
*LD04 has the same CV ranges as LD03.
NOTE: Contact factory for availability of Tolerance Options for Specific Part Numbers.
Contact factory for non-specified capacitance values.
112916
44
MLCC Tin/Lead Termination “B”
X8R – Specifications and Test Methods
Parameter/Test
Operating Temperature Range
Capacitance
X8R Specification Limits
-55ºC to +150ºC
Within specified tolerance
≤ 2.5ꢀ for ≥ 50V DC rating
≤ 3.5ꢀ for 25V DC and 16V DC rating
100,000MΩ or 1000MΩ - μF,
whichever is less
Measuring Conditions
Temperature Cycle Chamber
Freq.: 1.0 kHz 10ꢀ
Voltage: 1.0Vrms .2V
Dissipation Factor
Charge device with rated voltage for
120 5 secs @ room temp/humidity
Charge device with 250ꢀ of rated voltage for
1-5 seconds, w/charge and discharge current
limited to 50 mA (max)
Insulation Resistance
Dielectric Strength
No breakdown or visual defects
Note: Charge device with 150ꢀ of rated
voltage for 500V devices.
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
No defects
Deflection: 2mm
Test Time: 30 seconds
≤
12ꢀ
Resistance to
Flexure
Meets Initial Values (As Above)
≥ Initial Value x 0.3
Stresses
≥ 95ꢀ of each terminal should be covered
with fresh solder
No defects, <25ꢀ leaching of either end terminal
Dip device in eutectic solder at 230 5ºC
for 5.0 0.5 seconds
Solderability
Appearance
Capacitance
Variation
≤
7.5ꢀ
Dip device in eutectic solder at 260ºC for 60
seconds. Store at room temperature for 24
hours before measuring electrical properties.
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
2
Resistance to
Solder Heat
Meets Initial Values (As Above)
Meets Initial Values (As Above)
Meets Initial Values (As Above)
No visual defects
Appearance
Capacitance
Variation
Step 1: -55ºC 2º
Step 2: Room Temp
30 3 minutes
≤ 3 minutes
≤
7.5ꢀ
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
Thermal
Shock
Meets Initial Values (As Above)
Meets Initial Values (As Above)
Step 3: +125ºC 2º
Step 4: Room Temp
30 3 minutes
≤ 3 minutes
Repeat for 5 cycles and measure after
24 2 hours at room temperature
Meets Initial Values (As Above)
No visual defects
Charge device with 1.5 rated voltage (≤ 10V) in
test chamber set at 150ºC 2ºC
for 1000 hours (+48, -0)
≤
12.5ꢀ
≤ Initial Value x 2.0 (See Above)
≥ Initial Value x 0.3 (See Above)
Load Life
Remove from test chamber and stabilize
at room temperature for 24 2 hours
before measuring.
Meets Initial Values (As Above)
No visual defects
Store in a test chamber set at 85ºC 2ºC/
85ꢀ 5ꢀ relative humidity for 1000 hours
(+48, -0) with rated voltage applied.
≤
12.5ꢀ
Load
Humidity
≤ Initial Value x 2.0 (See Above)
≥ Initial Value x 0.3 (See Above)
Meets Initial Values (As Above)
Remove from chamber and stabilize at
room temperature and humidity for
24 2 hours before measuring.
112916
45
MLCC Tin/Lead Termination “B”
Capacitance Range (X8R Dielectric)
SIZE
LD03
LD05
LD06
WVDC
270
330
470
680
25V
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
50V
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
25V
50V
25V
50V
271
331
471
681
102
152
182
222
272
332
392
472
562
682
822
103
123
153
183
223
273
333
393
473
563
683
823
104
124
154
184
224
274
334
394
474
684
824
105
Cap
(pF)
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
N
N
N
N
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
N
N
1000
1500
1800
2200
2700
3300
3900
4700
5600
6800
8200
0.01
0.012
0.015
0.018
0.022
0.027
0.033
0.039
0.047
0.056
0.068
0.082
0.1
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
Cap
(μF)
J
J
J
J
J
J
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
0.12
0.15
0.18
0.22
0.27
0.33
0.39
0.47
0.68
0.82
1
WVDC
25V
50V
25V
50V
25V
50V
SIZE
LD03
LD05
LD06
Letter
Max.
Thickness (0.013)
A
0.33
C
E
0.71
(0.028)
G
0.90
(0.035)
J
0.94
(0.037)
K
1.02
(0.040)
M
1.27
(0.050)
N
P
1.52
(0.060)
Q
1.78
(0.070)
X
2.29
(0.090)
Y
2.54
(0.100)
Z
2.79
(0.110)
0.56
(0.022)
1.40
(0.055)
PAPER
EMBOSSED
112916
46
MLCC Tin/Lead Termination “B”
X7R – General Specifications
AVX Corporation will support those customers for
commercial and military Multilayer Ceramic Capacitors with
a termination consisting of 5ꢀ minimum lead. This
termination is indicated by the use of a “B” in the 12th
position of the AVX Catalog Part Number. This fulfills AVX’s
commitment to providing a full range of products to our
customers. AVX has provided in the following pages a full
range of values that we are currently offering in this special
“B” termination. Please contact the factory if you require
additional information on our MLCC Tin/Lead Termination
“B” products.
Not RoHS Compliant
PART NUMBER (see page 2 for complete part number explanation)
LD05
C
101
J
A
B
2
A
5
Size
Dielectric
X7R = C
Capacitance
Code (In pF)
2 Sig. Digits +
Number of
Zeros
Capacitance
Tolerance
Failure
Rate
Terminations
B = 5ꢀ min lead
X = FLEXITERM®
with 5ꢀ min
lead**
Packaging
Special
Code
A = Std.
Product
Voltage
6.3V = 6
10V = Z
16V = Y
25V = 3
35V = D
50V = 5
100V = 1
200V = 2
500V = 7
LD02 - 0402
LD03 - 0603
LD04 - 0504*
LD05 - 0805
LD06 - 1206
LD10 - 1210
LD12 - 1812
LD13 - 1825
LD14 - 2225
LD20 - 2220
2 = 7" Reel
B = .10 pF (<10pF) A = Not
C = .25 pF (<10pF) Applicable
D = .50 pF (<10pF)
4 = 13" Reel
Contact Factory
For
F = 1ꢀ (≥ 10 pF)
G = 2ꢀ (≥ 10 pF)
Multiples
**X7R only
J
=
5ꢀ
K = 10ꢀ
M = 20ꢀ
See FLEXITERM® section for CV options
*LD04 has the same CV ranges as LD03.
NOTE: Contact factory for availability of Tolerance Options for Specific Part Numbers.
Contact factory for non-specified capacitance values.
112916
47
MLCC Tin/Lead Termination “B”
X7R – Specifications and Test Methods
Parameter/Test
Operating Temperature Range
Capacitance
X7R Specification Limits
-55ºC to +125ºC
Measuring Conditions
Temperature Cycle Chamber
Within specified tolerance
≤ 10ꢀ for ≥ 50V DC rating
≤ 12.5ꢀ for 25V DC rating
≤ 12.5ꢀ for 25V and 16V DC rating
≤ 12.5ꢀ for ≤ 10V DC rating
100,000MΩ or 1000MΩ - μF,
whichever is less
Freq.: 1.0 kHz 10ꢀ
Voltage: 1.0Vrms .2V
Dissipation Factor
Charge device with rated voltage for
120 5 secs @ room temp/humidity
Charge device with 250ꢀ of rated voltage for
1-5 seconds, w/charge and discharge current
limited to 50 mA (max)
Insulation Resistance
Dielectric Strength
No breakdown or visual defects
Note: Charge device with 150ꢀ of rated
voltage for 500V devices.
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
No defects
Deflection: 2mm
Test Time: 30 seconds
≤
12ꢀ
Resistance to
Flexure
Meets Initial Values (As Above)
≥ Initial Value x 0.3
Stresses
≥ 95ꢀ of each terminal should be covered
with fresh solder
No defects, <25ꢀ leaching of either end terminal
Dip device in eutectic solder at 230 5ºC
for 5.0 0.5 seconds
Solderability
Appearance
Capacitance
Variation
≤
7.5ꢀ
Dip device in eutectic solder at 260ºC for 60
seconds. Store at room temperature for 24
hours before measuring electrical properties.
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
2
Resistance to
Solder Heat
Meets Initial Values (As Above)
Meets Initial Values (As Above)
Meets Initial Values (As Above)
No visual defects
Appearance
Capacitance
Variation
Step 1: -55ºC 2º
Step 2: Room Temp
30 3 minutes
≤ 3 minutes
≤
7.5ꢀ
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
Thermal
Shock
Meets Initial Values (As Above)
Meets Initial Values (As Above)
Step 3: +125ºC 2º
Step 4: Room Temp
30 3 minutes
≤ 3 minutes
Repeat for 5 cycles and measure after
24 2 hours at room temperature
Meets Initial Values (As Above)
No visual defects
Charge device with 1.5 rated voltage (≤ 10V) in
test chamber set at 125ºC 2ºC
for 1000 hours (+48, -0)
≤
12.5ꢀ
≤ Initial Value x 2.0 (See Above)
≥ Initial Value x 0.3 (See Above)
Load Life
Remove from test chamber and stabilize
at room temperature for 24 2 hours
before measuring.
Meets Initial Values (As Above)
No visual defects
Store in a test chamber set at 85ºC 2ºC/
85ꢀ 5ꢀ relative humidity for 1000 hours
(+48, -0) with rated voltage applied.
≤
12.5ꢀ
Load
Humidity
≤ Initial Value x 2.0 (See Above)
≥ Initial Value x 0.3 (See Above)
Meets Initial Values (As Above)
Remove from chamber and stabilize at
room temperature and humidity for
24 2 hours before measuring.
112916
48
MLCC Tin/Lead Termination “B”
Capacitance Range (X7R Dielectric)
PREFERRED SIZES ARE SHADED
SIZE
LD02
LD03
LD05
LD06
Soldering
Packaging
Reflow/Wave
All Paper
Reflow/Wave
All Paper
Reflow/Wave
Reflow/Wave
Paper/Embossed
Paper/Embossed
mm
(in.)
1.00 0.10
1.60 0.15
2.01 0.20
3.20 0.20
(L) Length
(0.040 0.004)
(0.063 0.006)
(0.079 0.008)
(0.126 0.008)
mm
(in.)
0.50 0.10
(0.020 0.004)
0.81 0.15
(0.032 0.006)
1.25 0.20
(0.049 0.008)
1.60 0.20
(0.063 0.008)
(W) Width
mm
(in.)
0.25 0.15
(0.010 0.006)
0.35 0.15
(0.014 0.006)
0.50 0.25
(0.020 0.010)
0.50 0.25
(0.020 0.010)
(t) Terminal
WVDC
16
25
50
6.3
10
16
25
50
100
200
6.3
10
16
25
50
100
200
6.3
10
16
25
50
100 200
500
Cap
(pF)
100
150
220
330
470
680
C
C
C
C
C
C
C
C
C
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
K
K
K
1000
1500
2200
3300
4700
6800
0.010
0.015
0.022
0.033
0.047
0.068
0.10
0.15
0.22
0.33
0.47
0.68
1.0
K
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
P
P
Q
Q
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
M
P
C
C
C
C
C
C
C
C
C
Cap
(μF
J
J
J
J
P
G
G
G
G
G
G
M
M
M
M
P
P
N
N
N
N
N
N
N
N
G
G
G
J
J
C*
G
G
G
P
Q
Q
Q
Q
Q
Q
G
G
N
N
N
N
N*
J
M
M
Q
Q
Q
Q
J*
M
M
M
P
Q
M
M
M
Q
Q
J*
J*
1.5
2.2
J*
P*
3.3
4.7
10
P*
P
P*
Q*
Q*
Q*
Q*
Q*
Q
P*
22
Q*
47
100
WVDC
16
25
50
6.3
10
16
25
50
100
200
6.3
10
16
25
50
100
200
6.3
10
16
25
50
100 200
500
SIZE
LD02
LD03
LD05
LD06
Letter
Max.
Thickness (0.013)
A
0.33
C
0.56
(0.022)
E
0.71
(0.028)
G
J
0.94
(0.037)
K
M
1.27
(0.050)
N
1.40
(0.055)
P
Q
1.78
(0.070)
X
2.29
(0.090)
Y
Z
2.79
(0.110)
0.90
(0.035)
1.02
(0.040)
1.52
(0.060)
2.54
(0.100)
PAPER
EMBOSSED
= Under Development
112916
49
MLCC Tin/Lead Termination “B”
Capacitance Range (X7R Dielectric)
PREFERRED SIZES ARE SHADED
SIZE
LD10
LD12
LD13
LD20
LD14
Soldering
Reflow Only
Reflow Only
Reflow Only
Reflow Only
Reflow Only
Packaging
Paper/Embossed
All Embossed
All Embossed
All Embossed
All Embossed
mm
(in.)
3.20 0.20
4.50 0.30
4.50 0.30
5.70 0.40
5.72 0.25
(L) Length
(0.126 0.008)
(0.177 0.012)
(0.177 0.012)
(0.225 0.016)
(0.225 0.010)
mm
(in.)
2.50 0.20
(0.098 0.008)
3.20 0.20
(0.126 0.008)
6.40 0.40
(0.252 0.016)
5.00 0.40
(0.197 0.016)
6.35 0.25
(0.250 0.010)
(W) Width
mm
(in.)
0.50 0.25
(0.020 0.010)
0.61 0.36
(0.024 0.014)
0.61 0.36
(0.024 0.014)
0.64 0.39
(0.025 0.015)
0.64 0.39
(0.025 0.015)
(t) Terminal
WVDC
10
16
25
50
100
200
500
50
100
200
500
50
100
25
50
100
200
50
100
Cap
(pF)
100
150
220
330
470
680
1000
1500
2200
3300
4700
6800
0.010
0.015
0.022
0.033
0.047
0.068
0.10
0.15
0.22
0.33
0.47
0.68
1.0
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
N
N
X
X
X
Z
Z
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
N
N
X
X
X
Z
Z
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
P
P
Z
Z
Z
Z
Z
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
X
X
Z
Z
Z
Z
Z
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
M
M
M
P
Cap
(μF
K
K
K
K
K
K
K
K
K
K
K
M
M
Z
K
K
K
K
K
K
K
K
K
M
P
Q
X
K
K
K
K
K
K
K
P
P
X
K
P
P
X
Z
Z
Z
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
P
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Z
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Z
Z
Z
X
X
X
X
X
X
X
X
X
X
X
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
P
P
P
P
P
P
P
P
P
P
P
P
P
X
Q
Q
J
J
J
J
M
M
Z
Z
M
P
Q
Q
X
Z
Z
Z
P
1.5
2.2
3.3
4.7
10
22
Z
Z
Z
Z
Z
Z
47
100
WVDC
10
16
25
50
100
200
500
50
100
200
500
50
100
25
50
100
200
50
100
SIZE
LD10
LD12
LD13
LD20
LD14
Letter
Max.
Thickness (0.013)
A
0.33
C
0.56
(0.022)
E
0.71
(0.028)
G
0.90
(0.035)
J
0.94
(0.037)
K
1.02
(0.040)
M
1.27
(0.050)
N
1.40
(0.055)
P
1.52
(0.060)
Q
1.78
(0.070)
X
2.29
(0.090)
Y
Z
2.79
(0.110)
2.54
(0.100)
PAPER
EMBOSSED
112916
50
MLCC Tin/Lead Termination “B”
X5R – General Specifications
AVX Corporation will support those customers for
commercial and military Multilayer Ceramic Capacitors with
a termination consisting of 5ꢀ minimum lead. This
termination is indicated by the use of a “B” in the 12th
position of the AVX Catalog Part Number. This fulfills AVX’s
commitment to providing a full range of products to our
customers. AVX has provided in the following pages a full
range of values that we are currently offering in this special
“B” termination. Please contact the factory if you require
additional information on our MLCC Tin/Lead Termination
“B” products.
Not RoHS Compliant
PART NUMBER (see page 2 for complete part number explanation)
LD05
D
101
J
A
B
2
A
5
Size
Dielectric
X5R = D
Capacitance
Code (In pF)
2 Sig. Digits +
Number of
Zeros
Capacitance
Tolerance
Failure
Rate
Terminations
B = 5ꢀ min lead
X = FLEXITERM®
with 5ꢀ min
lead**
Packaging
Special
Code
A = Std.
Product
Voltage
6.3V = 6
10V = Z
16V = Y
25V = 3
35V = D
50V = 5
100V = 1
200V = 2
500V = 7
LD02 - 0402
LD03 - 0603
LD04 - 0504*
LD05 - 0805
LD06 - 1206
LD10 - 1210
LD12 - 1812
LD13 - 1825
LD14 - 2225
LD20 - 2220
2 = 7" Reel
B = .10 pF (<10pF) A = Not
C = .25 pF (<10pF) Applicable
D = .50 pF (<10pF)
4 = 13" Reel
Contact Factory
For
F = 1ꢀ (≥ 10 pF)
G = 2ꢀ (≥ 10 pF)
Multiples
**X7R only
J
=
5ꢀ
K = 10ꢀ
M = 20ꢀ
See FLEXITERM® section for CV options
*LD04 has the same CV ranges as LD03.
NOTE: Contact factory for availability of Tolerance Options for Specific Part Numbers.
Contact factory for non-specified capacitance values.
TYPICAL ELECTRICAL CHARACTERISTICS
Temperature Coefficient
Insulation Resistance vs Temperature
10,000
1,000
100
20
15
10
5
0
-5
-10
-15
-20
0
-60 -40
-20
0
+20 +40 +60 +80
0
20
40
60
80
100
120
Temperature °C
Temperature °C
112916
51
MLCC Tin/Lead Termination “B”
X5R – Specifications and Test Methods
Parameter/Test
Operating Temperature Range
Capacitance
X5R Specification Limits
-55ºC to +85ºC
Measuring Conditions
Temperature Cycle Chamber
Within specified tolerance
≤ 2.5ꢀ for ≥ 50V DC rating
≤ 3.0ꢀ for 25V, 35V DC rating
≤ 12.5ꢀ Max. for 16V DC rating and lower
Contact Factory for DF by PN
10,000MΩ or 500MΩ - μF,
whichever is less
Freq.: 1.0 kHz 10ꢀ
Voltage: 1.0Vrms .2V
For Cap > 10 μF, 0.5Vrms @ 120Hz
Dissipation Factor
Charge device with rated voltage for
120 5 secs @ room temp/humidity
Charge device with 250ꢀ of rated voltage for
1-5 seconds, w/charge and discharge current
limited to 50 mA (max)
Insulation Resistance
Dielectric Strength
No breakdown or visual defects
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
No defects
Deflection: 2mm
Test Time: 30 seconds
≤
12ꢀ
Resistance to
Flexure
Meets Initial Values (As Above)
≥ Initial Value x 0.3
Stresses
≥ 95ꢀ of each terminal should be covered
with fresh solder
No defects, <25ꢀ leaching of either end terminal
Dip device in eutectic solder at 230 5ºC
for 5.0 0.5 seconds
Solderability
Appearance
Capacitance
Variation
≤
7.5ꢀ
Dip device in eutectic solder at 260ºC for 60
seconds. Store at room temperature for 24
hours before measuring electrical properties.
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
2
Resistance to
Solder Heat
Meets Initial Values (As Above)
Meets Initial Values (As Above)
Meets Initial Values (As Above)
No visual defects
Appearance
Capacitance
Variation
Step 1: -55ºC 2º
Step 2: Room Temp
30 3 minutes
≤ 3 minutes
≤
7.5ꢀ
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
Thermal
Shock
Meets Initial Values (As Above)
Meets Initial Values (As Above)
Step 3: +85ºC 2º
Step 4: Room Temp
30 3 minutes
≤ 3 minutes
Repeat for 5 cycles and measure after
24 2 hours at room temperature
Charge device with 1.5X rated voltage in
test chamber set at 85ºC 2ºC for 1000 hours
(+48, -0). Note: Contact factory for *optional
specification part numbers that are tested at
< 1.5X rated voltage.
Meets Initial Values (As Above)
No visual defects
≤
12.5ꢀ
≤ Initial Value x 2.0 (See Above)
≥ Initial Value x 0.3 (See Above)
Load Life
Remove from test chamber and stabilize
at room temperature for 24 2 hours
before measuring.
Meets Initial Values (As Above)
No visual defects
Store in a test chamber set at 85ºC 2ºC/
85ꢀ 5ꢀ relative humidity for 1000 hours
(+48, -0) with rated voltage applied.
≤
12.5ꢀ
Load
Humidity
≤ Initial Value x 2.0 (See Above)
≥ Initial Value x 0.3 (See Above)
Meets Initial Values (As Above)
Remove from chamber and stabilize at
room temperature and humidity for
24 2 hours before measuring.
112916
52
MLCC Tin/Lead Termination “B”
Capacitance Range (X5R Dielectric)
PREFERRED SIZES ARE SHADED
SIZE
LD02
LD03
LD05
LD06
LD10
LD12
Soldering
Packaging
Reflow/Wave
All Paper
Reflow/Wave
All Paper
Reflow/Wave
Reflow/Wave
Reflow/Wave
Paper/Embossed
Paper/Embossed
Paper/Embossed
mm
(in.)
1.00 0.10
1.60 0.15
2.01 0.20
3.20 0.20
3.20 0.20
(L) Length
(0.040 0.004)
(0.063 0.006)
(0.079 0.008)
(0.126 0.008)
(0.126 0.008)
mm
(in.)
0.50 0.10
(0.020 0.004)
0.81 0.15
(0.032 0.006)
1.25 0.20
(0.049 0.008)
1.60 0.20
(0.063 0.008)
2.50 0.20
(0.098 0.008)
(W) Width
mm
(in.)
0.25 0.15
(0.010 0.006)
0.35 0.15
(0.014 0.006)
0.50 0.25
(0.020 0.010)
0.50 0.25
(0.020 0.010)
0.50 0.25
(0.020 0.010)
(t) Terminal
WVDC
4
6.3 10 16 25 50
4
6.3 10 16 25 35 50 6.3 10 16 25 35 50 6.3 10 16 25 35 50
4
6.3 10 16 25 35 50 6.3 10 25 50
Cap
(pF)
100
150
220
C
330
470
680
C
C
C
1000
1500
2200
C
C
C
3300
4700
6800
C
C
C
G
G
Cap
(μF)
0.010
0.015
0.022
C
C
G
G
G
G
G
G
G
C
C
C
C
N
0.033
0.047
0.068
C
C
C
G
G
G
G
G
G
G
G
N
N
N
0.10
0.15
0.22
C
C
G
G
G
G
N
N
N
N
N
N
C*
C* C*
G
Q
0.33
0.47
0.68
G
G
G
G
N
N
N
Q
Q
Q
X
1.0
1.5
2.2
C* C* C*
C*
G
G
G
J*
N
N
N
P*
Q
Q
X
Z
X
X
X
G* G* J* J*
N
N
Q
3.3
4.7
10
J* J* J* J*
J* J* J*
K*
N
N
P
N
N
P
X
X
X
X
X
X
N* N*
P
X
X
X
X
Q
Z
Z
Z
X
Z
Z
22
47
100
P*
X
X
X
X
X
Z
Z*
Z
Z
Z
Z*
4
WVDC
4
6.3 10 16 25 50
4
6.3 10 16 25 35 50 6.3 10 16 25 35 50 6.3 10 16 25 35 50
6.3 10 16 25 35 50 6.3 10 25 50
SIZE
LD02
LD03
LD05
LD06
LD10
LD12
Letter
Max.
Thickness (0.013)
A
0.33
C
0.56
(0.022)
E
0.71
(0.028)
G
0.90
(0.035)
J
0.94
(0.037)
K
1.02
(0.040)
M
1.27
(0.050)
N
1.40
(0.055)
P
1.52
(0.060)
Q
1.78
(0.070)
X
2.29
(0.090)
Y
2.54
(0.100)
Z
2.79
(0.110)
PAPER
EMBOSSED
*Optional Specifications – Contact factory
NOTE: Contact factory for non-specified capacitance values
112916
53
MLCC Low Profile
General Specifications
GENERAL DESCRIPTION
AVX introduces the LT series comprising a range of low
profile products in our X5R and X7R dielectric. X5R is a
Class II dielectric with temperature varation of
capacitance within 15ꢀ from –55ꢁC to +85ꢁC. Offerings
include 0201, 0402, 0603, 0805 1206, and 1210
packages in compact, low profile designs. The LT series
is ideal for decoupling and filtering applications where
height clearance is limited.
AVX is also expanding the low profile products in our X7R
dielectric. X7R is a Class II dielectric with temperature
variation of capacitance within 15ꢀ from -55ºC to
+125ºC. Please contact the factory for availability of any
additional values not listed.
PART NUMBER (see page 2 for complete part number explanation)
LT05
Z
D
475
K
A
T
2
S
Size
Voltage
4V = 4
6.3V = 6
10V = Z
16V = Y
25V = 3
Dielectric
X5R = D
X7R = C
Capacitance Capacitance
Failure
Rate
A = Not
Applicable
Special
Code
See table below
Terminations
T = Plated Ni
and Sn
Packaging
2 = 7" Reel
Code (In pF)
2 Sig. Digits +
Number of
Zeros
Tolerance
K = 10ꢀ
M = 20ꢀ
LT01 - 0201
LT02 - 0402
LT03 - 0603
LT05 - 0805
LT06 - 1206
LT10 - 1210
4 = 13" Reel
Contact
Factory
For
Multiples
NOTE: Contact factory for availability of tolerance options for specific part numbers.
SIZE
LT01
LT02
LT03
LT05
LT06
LT10
WVDC
4
Z
6.3
4
6.3
Q
10
16
S
4
6.3
16
25
6.3
10
16
25
X
6.3
10
X
16
25
50
W
16
25
Cap
(μF)
0.10
0.22
0.47
1.0
Z
X
X
X
X
X
Q
C
S
S
S
X
X
X
1.5
2.2
C
C
S
X
X
S
X
X
X
X
X
X
X
X
X
X
4.7
S
4
X
X
W
W
W
W
W
W
10
W
22
47
WVDC
4
6.3
4
6.3
10
16
6.3
16
25
6.3
10
16
25
6.3
10
16
25
50
16
25
SIZE
LT01
LT02
LT03
LT05
LT06
LT10
= X7R
Letter
Max.
Thickness (0.006)
J
0.15
Z
0.22
(0.009)
Q
0.25
(0.010)
C
0.36
(0.014)
S
0.56
(0.022)
X
0.95
(0.038)
W
1.02
(0.040)
EMBOSSED
PAPER
REV 01
54
Automotive MLCC
Automotive
GENERALDESCRIPTION
AVX Corꢀoration has suꢀꢀorted the Automotive Industry requirements for Multilayer
Ceramic Caꢀacitors consistently for more than 10 years. Products have been de- veloꢀed
and tested sꢀecifically for automotive aꢀꢀlications and all manufacturing facilities are
QS9000 and VDA 6.4aꢀꢀroved.
As ꢀart of our sustained investment in caꢀacity and state of the art technology, we are now
transitioning from the established PdꢇAg electrode system to a Base Metal Electrode
system(BME).
AVX is using AECQ200 as the qualification vehicle for this transition. A detailed qualification
ꢀackage is available on request and contains results on a range of ꢀart numbers including:
• X7R dielectric comꢀonents containing BME electrode and coꢀꢀer
terminations with a NiꢇSn ꢀlated overcoat.
• X7R dielectric comꢀonents, BME electrode with eꢀoxy finish for conductive glue mounting.
• X7R dielectric comꢀonents BME electrode and soft terminations with a NiꢇSn ꢀlated over-
coat.
• NP0 dielectric comꢀonents containing PdꢇAg electrode and silver termination with a NiꢇSn
ꢀlated overcoat.
HOW TO ORDER
0805
5
A
104
K
4
2
A
T
Size
0402
0603
0805
1206
1210
1812
Voltage
10V =Z
Failure Rate
Packaging
2 = 7" Reel
Special Code
Capacitance
Code (InpF)
2Significant
Capacitance
Tolerance
p = 1ꢂ
Dielectric
NP0 = A
X7R = C
X8R =p
Terminations
4=Automotive
A = Std. Product
T = Plated Ni and Sn
®
16V =Y
4 =13" Reel
Z =pLEXITERM %%
Digits + Numberof
Zeros
ꢀꢁꢂS)ꢃꢄꢅꢅ
G = 2ꢂ
25V =3
U =Conductive Eꢀoxy%%
%%X7R X8Ronly
50V =5
e.g. 10 p =106
ꢀꢁꢂS)ꢃꢄꢅꢅ
J = 5ꢂ
100V =1
200V =2
250V = V
500V =7
ꢀꢁ)ꢃꢅꢅ
K = 10ꢂ
M = 20ꢂ
%NPOonly
Contact factory for availability of Tolerance Oꢀtions for Sꢀecific PartNumbers.
NOTE: Contact factory for non-sꢀecified caꢀacitancevalues.
0402 case size available in T termination only.
COMMERCIAL VS AUTOMOTIVE MLCC PROCESS COMPARISON
Commercial
Standard PartNumbers.
No restriction on who purchases these parts.
Automotive
Administrative
Design
Specific Automotive Part Number. sed tocontrol
supply of product to Automotivecustomers.
Minimum Ceramic thickness of 0.029" (0.74mm)
on all X7R product.
Minimum ceramic thickness of 0.020"
Side & End Margins = 0.004" min
Cover Layers = 0.00±" min
Dicing
Side & End Margins = 0.00±" min
As per EIARS469
Lot Qualification
(Destructive Physical
Analysis - DPA)
Increased sample plan
stricter criteria.
Visual/Cosmetic Quality
Application Robustness
Standard process and inspection
100ꢁ inspection
Standard sampling for accelerated
wave solder on X7R dielectrics
Increased sampling for accelerated wave solder on
X7R and NP0 followed by lot by lot reliability testing.
All Tests have Accept/Re ect Criteria0/1
112817
55
Automotive MLCC
NP0/X7R Dielectric
FLEXITERM FEATURES
a) Bend Test
b) Temꢀerature Cycle testing
®
The caꢀacitor is soldered to the PC Board as shown:
pLEXITERM has the ability to withstand at least 1000 cycles be-
tween –55°C and +125°C
Tyꢀical bend test results are shown below:
0603
0805
1206
ꢅ2mm
ꢅ5
ꢅ5
ꢅ5
ꢅ2mm
ꢅ2mm
112817
56
Automotive MLCC-NP0
Capacitance Range
0402
0603
0805
1206
Soldering ReflowꢇWave
ReflowꢇWave
ReflowꢇWave
ReflowꢇWave
25V
C
50V
C
25V
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
50V
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
100V
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
200V 25V
50V
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
100V
J
200V
250V 25V
50V
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
100V
J
200V
J
250V 500V
100 10ꢀp
G
G
G
G
G
G
G
G
G
G
G
G
G
G
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
120
150
180
220
270
330
390
470
510
560
680
820
12
15
18
22
27
33
39
47
51
56
68
82
C
C
J
J
J
C
C
J
J
J
C
C
J
J
J
C
C
J
J
J
C
C
J
J
J
C
C
J
J
J
C
C
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
101 100
121 120
151 150
181 180
221 220
271 270
331 330
391 390
471 470
561 560
681 680
821 820
102 1000
122 1200
152 1500
182 1800
222 2200
272 2700
332 3300
392 3900
472 4700
103 10np
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
25V
50V
25V
50V
100V
200V 25V
50V
100V
200V
250V 25V
50V
100V
200V
250V 500V
0402
0603
0805
1206
Letter
Max.
A
C
E
G
J
K
M
N
P
Q
X
Y
Z
0.±±
0.56
0.71
0.90
0.94
1.02
(0.040)
1.27
1.40
(0.055)
1.52
1.78
(0.070)
2.29
2.54
2.79
Thickness (0.01±)
(0.022)
(0.028)
PAPER
(0.0±5)
(0.0±7)
(0.050)
(0.060)
EMBOSSED
(0.090)
(0.100)
(0.110)
112817
57
Automotive MLCC-X7R
Capacitance Range
0402
0603
0805
1206
1210
1812
2220
Soldering
ReflowꢇWave
ReflowꢇWave
ReflowꢇWave
ReflowꢇWave
Reflow Only
Reflow Only
Reflow Only
16V 25V 50V 10V 16V 25V 50V 100V 200V 250V 16V 25V 50V 100V 200V 250V 16V 25V 50V 100V 200V 250V 500V 16V 25V 50V 100V 50V 100V 25V 50V 100V
221
Caꢀ 220
(ꢀp) 270
C
C
C
C
C
C
271
331
391
471
561
681
821
102
182
222
332
472
330
390
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
470
560
680
820
1000
1800
2200
3300
4700
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
103 Caꢀ 0.01
C
G
G
G
G
G
G
J
J
J
J
J
J
J
J
J
J
J
J
J
K
K
K
K
K
K
123 (p) 0.012
C
G
G
G
G
J
J
J
N
N
N
J
J
J
J
J
J
K
K
K
K
K
K
153
183
223
273
333
473
563
683
823
104
124
154
224
334
474
684
105
155
225
335
475
106
226
0.015
0.018
0.022
0.027
0.033
0.047
0.056
0.068
0.082
0.01
0.12
0.15
0.22
0.33
0.47
0.68
1
C
C
C
C
C
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
J
J
J
J
J
J
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
J
J
J
J
J
J
J
J
J
J
J
K
K
K
K
K
K
K
K
K
K
K
K
M
P
P
P
P
P
X
X
X
Z
K
K
K
K
K
K
K
K
K
K
K
K
M
P
P
P
Q
Q
Z
K
K
K
K
K
K
K
K
K
K
K
K
M
P
P
Q
Q
Z
K
K
K
K
K
K
M
M
M
M
P
P
P
Q
Q
X
X
Z
K
K
K
K
K
K
K
K
K
K
K
K
M
X
X
X
X
X
Z
Z
Z
Z
K
K
K
K
K
K
K
K
K
K
K
K
M
X
X
X
X
X
Z
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
M
M
M
M
Q
Q
Q
Q
Q
Q
Q
M
M
M
M
M
Q
Q
Q
M
M
M
M
M
Q
Q
Q
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
N
N
N
N
N
N
N
J
J
J
J
J
J
J
M
M
M
P
P
Q
Q
Q
Q
Q
Q
M
M
N
N
N
N
N
N
N
N
N
N
J
J
G
G
J
M
M
M
Q
Q
Q
Q
Q
Q
J
M
M
M
Q
Q
Q
Q
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
1.5
2.2
Z
Z
3.3
Z
Z
Z
4.7
Z
Z
Z
Z
10
Z
Z
Z
22
25V
10V 16V
16V 25V
100V 200V 250V 16V 25V
500V805
16V
100V 50V 100V
50V
16V 0402 50V
25V 05600V3100V 200V 250V
50V 112000V6200V 250V 500V
215V21500V
1812 25V2220100V
Letter
A
C
E
G
J
K
M
N
P
Q
X
Y
Z
Max.
0.±±
0.56
0.71
0.90
0.94
1.02
1.27
1.40
1.52
1.78
2.29
2.54
2.79
Thickness (0.01±)
(0.022)
(0.028)
PAPER
(0.0±5)
(0.0±7)
(0.040)
(0.050)
(0.055)
(0.060)
EMBOSSED
(0.070)
(0.090)
(0.100)
(0.110)
112817
58
Automotive MLCC-X8R
Capacitance Range
SIZE
0603
0805
1206
Soldering
ReflowꢇWave
ReflowꢇWave
ReflowꢇWave
WVDC
270
25V
G
50V
G
25V
50V
25V
50V
271
Caꢀ
(ꢀp)
331
471
681
102
152
182
222
272
332
392
472
562
682
822
103
123
153
183
223
273
333
393
473
563
683
823
104
124
154
184
224
274
334
394
474
684
824
105
330
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
N
N
470
680
J
1000
1500
1800
2200
2700
3300
3900
4700
5600
6800
8200
0.01
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
Caꢀ
J
J
J
( p) 0.012
0.015
0.018
0.022
0.027
0.033
0.039
0.047
0.056
0.068
0.082
0.1
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
N
N
N
N
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
0.12
0.15
0.18
0.22
0.27
0.33
0.39
0.47
0.68
0.82
1
WVDC
25V
50V
25V
50V
25V
50V
SIZE
0603
0805
1206
Letter
Max.
A
C
E
G
J
K
M
N
P
Q
X
Y
Z
0.±±
0.56
0.71
0.90
0.94
1.02
1.27
1.40
1.52
(0.060)
1.78
2.29
2.54
2.79
Thickness (0.01±)
(0.022)
(0.028)
PAPER
(0.0±5)
(0.0±7)
(0.040)
(0.050)
(0.055)
(0.070)
(0.090)
(0.100)
(0.110)
EMBOSSED
112817
59
APS COTS+ for High Reliability Applications
Surface Mount NPO, X7R and X8R/L MLCCs
AVX’s APS COTS+ series of multilayer ceramic capacitors offers the customer a
high reliability solution with an ultralow failure rate, ≤1ppb, in a variety of case sizes
and voltages. The APS range encompasses a wide range of dielectric types to
meet the customer’s requirements from low temperature/voltage capacitance
change dielectric, NPO, to high preforming capacitance voltage X7R to high
temperature reliability dielectrics, X8R/L.
APS capacitors have a wider capacitance range than MIL spec parts that satisfies
the need for higher CV demands and board space saving requirements. Each
production lot is extensively tested and removes the requirement for customer
specific drawings. The testing regime uses many of the MIL-STD test methods as
per MIL-PRF-55681 and has a field failure rate of less than 1 ppb. The APS testing
series uses AVX’s unique in-house maverick testing detection system that
eliminates infant mortality failures.
Applications suitable for APS include Industrial, Telecommunications, Aviation, and
Military. The APS is available with a range of different termination finishes,
Flexiterm®, Nickel / Tin and Tin with Pb1. Flexiterm® technology delivers improved
thermo-mechanical stress resistance.
Dielectric
NPO
Temperature/Percentage Cap Change
-30ppm +30ppm from -55ꢁC to + 125ꢁC
-15ꢀ +15ꢀ from -55ꢁC to + 125ꢁC
-15ꢀ +15ꢀ from -55ꢁC to + 150ꢁC
-15ꢀ +40ꢀ from -55ꢁC to + 150ꢁC
AVX’S APS RELIABILITY
TEST SUMMARY
X7R
X8R
X8L
• 100 ꢀ Visual Inspection
• DPA
• IR, DF, Cap, DWV
• Maverick Lot Review
• Thermal Shock
FEATURES
• The APS range has been extensively reliability tested as standard resulting in an
ultralow failure rate, ≤1ppb.
• The APS range is available with Flexiterm® that deliver’s high thermo-mechanical
• 85/85 Testing
• Life Testing 125ꢁC 2xRV
• C of C with every Order
• Quarterly Data Package
stress resistance.
• High CV range enabling board space saving requirements.
HOW TO ORDER
AP03
5
A
104
K
Q
2
A
T
Size
Voltage Dielectric
Capacitance
Code (In pF)
2 Significant Digits +
Number of Zeros
e.g. 10μF = 106
Capacitance Failure Rate
Packaging
2 = 7" Reel
4 = 13" Reel
Special Code
A = Std. Product
Terminations
T = Plated Ni and Sn**
Z = FLEXITERM®**
B =10ꢀ min lead
X = FLEXITERM® with
10ꢀ min lead
Tolerance
J = 5ꢀ
AP03=0603
AP05=0805
AP06=1206
16V = Y
25V = 3
50V = 5
NP0 = A
X7R = C
X8R = F
X8L = L
Q = APS
K = 10ꢀ
M = 20ꢀ
AP10=1210 100V = 1
AP12=1812 200V = 2
AP20=2220 500V = 7
Z,X for X7R only
**RoHS compliant
NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.
082917
60
APS COTS+ NP0 Series
Capacitance Range
AP03 = 0603
AP05 = 0805
AP06 = 1206
AP10 = 1210
25V
50V
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
100V
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
25V
50V
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
100V
J
25V
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
50V
100V
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
200V
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
500V
25V
50V
100V
200V
100
120
150
180
220
270
330
390
470
510
560
680
820
101
121
151
181
221
271
331
391
471
561
681
821
102
122
152
182
222
272
332
392
472
103
10pF
12
15
18
22
27
33
39
47
51
56
68
82
100
120
150
180
220
270
330
390
470
560
680
820
1000
1200
1500
1800
2200
2700
3300
3900
4700
10nF
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
M
M
M
M
M
25V
50V
100V
25V
50V
100V
25V
50V
100V
200V
500V
25V
50V
100V
200V
Y
2.54
(0.100)
AP03 = 0603
AP05 = 0805
AP06 = 1206
AP10 = 1210
Letter
Max.
Thickness (0.013)
A
C
0.56
E
G
0.90
(0.035)
J
0.94
(0.037)
K
M
1.27
(0.050)
N
1.40
(0.055)
P
Q
X
2.29
(0.090)
Z
2.79
(0.110)
0.33
0.71
(0.028)
1.02
1.52
(0.060)
1.78
(0.070)
(0.022)
(0.040)
PAPER
EMBOSSED
TS 16949, ISO 9001Certified
082917
61
APS COTS+ X7R Series
Capacitance Range
AP03 = 0603
25V 50V 100V 200V 16V
AP05 = 0805
25V 50V 100V 200V 16V
AP06 = 1206
AP10 = 1210
AP12 = 1812
AP20 = 2220
50V 100V
16V
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
25V
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
50V 100V 200V 500V 16V
25V
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
M
P
P
P
Q
Q
Z
50V 100V 50V 100V 25V
102 Cap 1000
182 (pF) 1800
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
M
P
P
P
P
P
X
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
M
P
P
Q
Q
Z
K
K
K
K
K
K
K
K
K
K
K
K
K
M
M
M
M
P
P
P
Q
Q
X
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
M
X
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
M
X
222
332
472
103
123
153
183
223
273
333
473
563
683
823
104
124
154
224
334
474
684
2200
3300
4700
0.01
J
J
J
J
J
J
J
J
J
J
J
J
0.012
0.015
0.018
0.022
0.027
0.033
0.047
0.056
0.068
0.082
0.1
0.12
0.15
0.22
0.33
0.47
0.68
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
N
N
J
J
J
J
J
J
J
J
M
M
M
M
M
M
M
M
M
M
M
N
N
N
N
N
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
Q
Q
Q
Q
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
M
M
M
M
Q
Q
Q
Q
Q
J
J
M
M
M
M
M
M
N
N
J
J
J
J
J
M
M
M
P
P
Q
Q
Q
Q
M
M
N
N
N
N
M
M
M
Q
Q
Q
Q
Q
Q
X
X
X
X
105 Cap 1.0
155 (μF) 1.5
X
Z
Z
Z
X
X
X
X
225
335
475
106
226
2.2
3.3
4.7
10
Z
Z
Z
X
X
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
22
Z
16V
25V
50V 100V 200V 16V
25V
50V 100V 200V 16V
25V
50V 100V 200V 500V 16V
25V
50V 100V 50V 100V 25V
50V 100V
AP03 = 0603
AP05 = 0805
AP06 = 1206
AP10 = 1210
AP12 = 1812
AP20 = 2220
Letter
Max.
Thickness (0.013)
A
0.33
C
0.56
(0.022)
E
0.71
(0.028)
G
0.90
(0.035)
J
0.94
(0.037)
K
1.02
(0.040)
M
1.27
(0.050)
N
1.40
(0.055)
P
1.52
(0.060)
Q
1.78
(0.070)
X
2.29
(0.090)
Y
2.54
(0.100)
Z
2.79
(0.110)
PAPER
EMBOSSED
TS 16949, ISO 9001Certified
082917
62
APS COTS+ X8R/L Series
Capacitance Range
X8R
X8L
SIZE
AP03 = 0603
AP05 = 0805
AP06 = 1206
SIZE
AP03 = 0603
AP05 = 0805
AP06 = 1206
WVDC
25V
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
50V
G
G
G
G
G
G
G
G
G
G
G
G
G
G
25V
J
50V
J
25V
50V
WVDC
25V
50V
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
100V
25V
50V
J
J
J
J
J
J
J
J
J
J
J
J
J
J
100V
16V
25V
50V
100V
331
471
681
102
152
222
332
472
682
103
153
223
333
473
683
104
154
224
334
474
684
105
Cap
(pF)
330
470
680
1000
1500
2200
3300
4700
6800
331
471
681
102
152
222
332
472
682
103
153
223
333
473
683
104
154
224
334
474
684
105
Cap
(pF)
330
470
680
1000
1500
2200
3300
4700
6800
G
G
G
G
G
G
G
G
G
G
J
J
J
J
J
J
J
J
J
J
J
J
N
N
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
P
P
J
J
J
J
J
J
J
J
J
J
J
M
Q
Q
Q
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
Cap 0.01
(μF) 0.015
0.022
0.033
0.047
0.068
0.1
J
J
J
J
Cap 0.01
(μF) 0.015
0.022
0.033
0.047
0.068
0.1
J
J
J
J
G
G
G
G
G
G
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
N
N
N
M
M
M
M
M
M
M
M
M
M
M
J
J
J
J
0.15
0.22
0.33
0.47
0.15
0.22
0.33
0.47
J
N
N
J
J
J
M
M
M
16V
J
J
M
M
N
N
N
0.68
0.68
1
1
WVDC
25V
50V
25V
50V
25V
50V
WVDC
25V
50V
100V
25V
50V
100V
25V
50V
100V
SIZE
0603
0805
1206
SIZE
0603
0805
1206
Letter
Max.
Thickness (0.013)
A
0.33
C
0.56
(0.022)
E
0.71
(0.028)
G
0.90
(0.035)
J
0.94
(0.037)
K
1.02
(0.040)
M
1.27
(0.050)
N
1.40
(0.055)
P
1.52
(0.060)
Q
1.78
(0.070)
X
Y
2.54
(0.100)
Z
2.29
(0.090)
2.79
(0.110)
PAPER
EMBOSSED
TS 16949, ISO 9001Certified
082917
63
MLCC with FLEXITERM®
General Specifications
GENERAL DESCRIPTION
With increased requirements from the automotive industry for additional
component robustness, AVX recognized the need to produce a MLCC with
enhanced mechanical strength. It was noted that many components may be
subject to severe flexing and vibration when used in various under the hood
automotive and other harsh environment applications.
To satisfy the requirement for enhanced mechanical strength, AVX had to
find a way of ensuring electrical integrity is maintained whilst external forces
are being applied to the component. It was found that the structure of the
termination needed to be flexible and after much research and development,
AVX launched FLEXITERM®. FLEXITERM® is designed to enhance the
mechanical flexure and temperature cycling performance of a standard
ceramic capacitor with an X7R dielectric. The industry standard for
flexure is 2mm minimum. Using FLEXITERM®, AVX provides up to
5mm of flexure without internal cracks. Beyond 5mm, the capacitor
will generally fail “open”.
As well as for automotive applications FLEXITERM® will provide Design
Engineers with a satisfactory solution when designing PCB’s which may be
subject to high levels of board flexure.
APPLICATIONS
High Flexure Stress Circuit Boards
• e.g. Depanelization: Components near edges
of board.
PRODUCT ADVANTAGES
• High mechanical performance able to withstand, 5mm bend test
guaranteed.
• Increased temperature cycling performance, 3000 cycles and beyond.
• Flexible termination system.
• Reduction in circuit board flex failures.
Variable Temperature Applications
• Soft termination offers improved reliability per-
formance in applications where there is tem-
perature variation.
• e.g. All kind of engine sensors: Direct
connection to battery rail.
Automotive Applications
• Base metal electrode system.
• Automotive or commercial grade products available.
• Improved reliability.
• Excellent mechanical performance and
thermo mechanical performance.
HOW TO ORDER
0805
5
C
104
K
2
A
A
Z
Style
0603
0805
1206
1210
1812
2220
Voltage
6 = 6.3V
Z = 10V
Y = 16V
3 = 25V
5 = 50V
1 = 100V
2 = 200V
Dielectric
C = X7R
F = X8R
Capacitance
Code (In pF)
Capacitance
Tolerance
J = 5ꢀ*
K = 10ꢀ
M = 20ꢀ
Packaging
2 = 7" reel
4 = 13" reel
Special Code
A = Std. Product
Failure
Rate
A=Commercial
4 = Automotive
Terminations
Z = FLEXITERM®
2 Sig Digits +
For FLEXITERM®
with Tin/Lead
termination see
AVX LD Series
Number of Zeros
e.g., 104 = 100nF
*≤1μF only
NOTE: Contact factory for availability of Tolerance Options for Specific Part Numbers.
020117
64
MLCC with FLEXITERM®
Specifications and Test Methods
BOARD BEND TEST PROCEDURE
PERFORMANCE TESTING
According to AEC-Q200
AEC-Q200 Qualification:
• Created by the Automotive Electronics
Council
Test Procedure as per AEC-Q200:
Sample size:
Span: 90mm
20 components
LOADING
KNIFE
Minimum deflection spec: 2 mm
• Specification defining stress
test qualification for
passive components
• Components soldered onto FR4 PCB (Figure 1)
• Board connected electrically to the test equipment
(Figure 2)
MOUNTING
ASSEMBLY
DIGITAL
CALIPER
Testing:
BEND TESTPLATE
Key tests used to compare
soft termination to
AEC-Q200 qualification:
• Bend Test
CONNECTOR
CONTROL
PANEL
CONTROL PANEL
• Temperature Cycle Test
Fig 2 - Board Bend test
equipment
Fig 1 - PCB layout with electrical connections
BOARD BEND TEST RESULTS
AEC-Q200 Vrs AVX FLEXITERM® Bend Test
0603
0805
12
10
8
6
4
2
12
10
8
6
4
2
AVX ENHANCED SOFT
TERMINATION BEND TEST
PROCEDURE
0
0
NPO
X7R
X7R soft term
NPO
X7R
X7R soft term
Bend Test
The capacitor is soldered to the printed circuit
board as shown and is bent up to 10mm at
1mm per second:
1210
1206
12
10
8
12
10
8
6
4
2
0
6
4
2
0
Max. = 10mm
NPO
X7R
X7R soft term
NPO
X7R
X7R soft term
TABLE SUMMARY
90mm
Typical bend test results are shown below:
Style
0603
0805
1206
Conventional Termination
FLEXITERM®
>5mm
>2mm
>2mm
>2mm
• The board is placed on 2 supports 90mm
apart (capacitor side down)
• The row of capacitors is aligned with the
load stressing knife
>5mm
>5mm
TEMPERATURE CYCLE TEST PROCEDURE
Test Procedure as per AEC-Q200:
Max. = 10mm
The test is conducted to determine the resistance of the
component when it is exposed to extremes of alternating
high and low temperatures.
• Sample lot size quantity 77 pieces
• TC chamber cycle from -55ºC to +125ºC for 1000 cycles
• Interim electrical measurements at 250, 500, 1000 cycles
• Measure parameter capacitance dissipation factor,
insulation resistance
• The load is applied and the deflection where
the part starts to crack is recorded (Note:
Equipment detects the start of the crack
using a highly sensitive current detection
circuit)
Test Temperature Profile (1 cycle)
• The maximum deflection capability is 10mm
020117
65
MLCC with FLEXITERM®
Specifications and Test Methods
BEYOND 1000 CYCLES: TEMPERATURE CYCLE TEST RESULTS
0603
0805
10
8
10
8
6
6
4
4
2
2
0
0
0
500 1000 1500 2000 2500 3000
0
500 1000 1500 2000 2500 3000
1206
1210
10
8
10
8
6
6
4
4
2
2
0
0
0
500 1000 1500 2000 2500 3000
0
500 1000 1500 2000 2500 3000
AEC-Q200 specification states
1000 cycles compared to AVX
3000 temperature cycles.
Soft Term - No Defects up to 3000 cycles
FLEXITERM® TEST SUMMARY
• Qualified to AEC-Q200 test/specification with the exception • Board bend test improvement by a factor of 2 to 4 times.
of using AVX 3000 temperature cycles (up to +150ꢁC bend
• Temperature Cycling:
test guaranteed greater than 5mm).
– 0ꢀ Failure up to 3000 cycles
• FLEXITERM® provides improved performance compared to
– No ESR change up to 3000 cycles
standard termination systems.
WITHOUT SOFT TERMINATION
WITH SOFT TERMINATION
Major fear is of latent board flex failures.
Far superior mechanical performance.
Generally open failure mode beyond
5mm flexure.
020117
66
MLCC with FLEXITERM®
X8R Dielectric Capacitance Range
SIZE
0603
0805
1206
Soldering
Reflow/Wave
Reflow/Wave
Reflow/Wave
WVDC
270
330
470
680
1000
1500
1800
2200
2700
3300
3900
4700
5600
6800
8200
0.01
25V
50V
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
25V
50V
25V
50V
271
331
471
681
102
152
182
222
272
332
392
472
562
682
822
103
123
153
183
223
273
333
393
473
563
683
823
104
124
154
184
224
274
334
394
474
684
824
105
Cap
(pF)
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
N
N
N
N
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
N
N
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
Cap
(μF)
0.012
0.015
0.018
0.022
0.027
0.033
0.039
0.047
0.056
0.068
0.082
0.1
J
J
J
J
J
J
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
0.12
0.15
0.18
0.22
0.27
0.33
0.39
0.47
0.68
0.82
1
WVDC
25V
50V
25V
50V
25V
50V
SIZE
0603
0805
1206
Letter
Max.
Thickness (0.013)
A
0.33
C
E
0.71
(0.028)
G
0.90
(0.035)
J
0.94
(0.037)
K
1.02
(0.040)
M
1.27
(0.050)
N
1.40
(0.055)
P
1.52
(0.060)
Q
1.78
(0.070)
X
2.29
(0.090)
Y
2.54
(0.100)
Z
2.79
(0.110)
0.56
(0.022)
PAPER
EMBOSSED
AEC-Q200 Qualified
020117
67
MLCC with FLEXITERM®
X7R Dielectric Capacitance Range
0402
0603
0805
1206
1210
1812
2220
Soldering
Reflow/Wave
Reflow/Wave
Reflow/Wave
Reflow/Wave
Reflow Only
Reflow Only
Reflow Only
16V
25V
C
C
C
C
C
C
C
C
C
C
C
C
C
50V
10V
16V
25V
50V 100V 200V 250V 16V
25V
50V 100V 200V 250V 16V
25V
50V 100V 200V 250V 500V 16V
25V
50V 100V 50V 100V 25V 50V 100V
221 Cap 220
271 (pF) 270
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
331
391
471
561
681
821
102
182
222
332
472
330
390
470
560
680
820
1000
1800
2200
3300
4700
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
M
P
P
P
P
P
X
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
M
P
P
P
Q
Q
Z
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
M
P
P
Q
Q
Z
K
K
K
K
K
K
K
K
K
K
K
K
K
M
M
M
M
P
P
P
Q
Q
X
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
M
X
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
M
X
J
J
J
J
J
J
103 Cap 0.01
123 (μF) 0.012
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
N
N
N
N
J
J
J
J
J
J
J
J
M
M
M
M
M
M
M
M
M
M
M
N
N
N
N
N
153
183
223
273
333
473
563
683
823
104
124
154
224
334
474
684
105
155
225
335
475
106
226
0.015
0.018
0.022
0.027
0.033
0.047
0.056
0.068
0.082
0.1
0.12
0.15
0.22
0.33
0.47
0.68
1
J
J
J
M
M
M
M
M
M
M
Q
Q
Q
Q
Q
J
J
J
J
J
J
J
J
M
M
M
Q
Q
Q
Q
J
J
M
M
M
M
M
M
N
N
J
J
J
M
M
M
P
P
Q
Q
Q
Q
N
N
N
N
N
N
G
M
M
M
Q
Q
Q
Q
Q
Q
X
X
X
X
X
Z
Z
Z
X
X
1.5
2.2
3.3
4.7
10
22
X
X
Z
Z
Z
X
X
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
16V
25V
50V
10V
16V
25V
50V 100V 200V 250V 16V
25V
50V 100V 200V 250V 16V
25V
50V 100V 200V 250V 500V 16V
25V
50V 100V 50V 100V 25V 50V 100V
0402
0603
0805
1206
1210
1812
2220
Letter
Max.
Thickness (0.013)
A
0.33
C
0.56
(0.022)
E
0.71
(0.028)
G
0.90
(0.035)
J
0.94
(0.037)
K
1.02
(0.040)
M
1.27
(0.050)
N
1.40
(0.055)
P
1.52
(0.060)
Q
1.78
(0.070)
X
2.29
(0.090)
Y
2.54
(0.100)
Z
2.79
(0.110)
PAPER
EMBOSSED
020117
68
FLEXISAFE MLC Chips
For Ultra Safety Critical Applications
AVX have developed a range of components specifically for safety
critical applications.
Utilizing the award-winning FLEXITERM™ layer in conjunction with the
cascade design previously used for high voltage MLCCs, a range of
ceramic capacitors is now available for customers who require
components designed with an industry leading set of safety features.
The FLEXITERM™ layer protects the component from any damage to
the ceramic resulting from mechanical stress during PCB assembly or
use with end customers. Board flexure type mechanical damage
accounts for the majority of MLCC failures. The addition of the cascade
structure protects the component from low insulation resistance failure
resulting from other common causes for failure; thermal stress damage,
repetitive strike ESD damage and placement damage. With the inclusion
of the cascade design structure to complement the FLEXITERM™ layer,
the FLEXISAFE range of capacitors has unbeatable safety features.
HOW TO ORDER
C
104
K
Q
Z
2
A
FS03
5
Dielectric
X7R = C
Capacitance
Code (In pF)
2 Sig. Digits +
Number of
Capacitance
Tolerance
J = 5ꢀ
K = 10ꢀ
M = 20ꢀ
Failure
Rate
A = Commercial
4 = Automotive
Q = APS
Terminations
Z = FLEXITERMTM
*X = FLEXITERMTM
with 5ꢀ min lead
Packaging
2 = 7" Reel
4 = 13" Reel
Special
Code
A = Std. Product
Size
Voltage
16V = Y
25V = 3
50V = 5
100V = 1
FS03 = 0603
FS05 = 0805
FS06 = 1206
FS10 = 1210
Zeros
e.g. 10μF =106
*Not RoHS Compliant
FLEXISAFE X7R RANGE
Capacitance
FS03 = 0603
Code
FS05 = 0805
Reflow/Wave
25 50
FS06 = 1206
FS10 = 1210
Soldering
Reflow/Wave
Reflow/Wave
Reflow Only
16
25
50
100
16
100
16
25
50
16
25
50
102 μF 0.001
182
222
332
472
103
123
153
183
223
273
333
473
563
683
823
104
124
154
224
334
474
0.0018
0.0022
0.0033
0.0047
0.01
0.012
0.015
0.018
0.022
0.027
0.033
0.047
0.056
0.068
0.082
0.1
0.12
0.15
0.22
0.33
0.47
Qualified
061416
69
Capacitor Array
Capacitor Array (IPC)
BENEFITS OF USING CAPACITOR
ARRAYS
AVX capacitor arrays offer designers the opportunity to
lower placement costs, increase assembly line output
through lower component count per board and to reduce
real estate requirements.
For high volume users of cap arrays using the very latest
placement equipment capable of placing 10 components per
second, the increase in throughput can be very significant and
can have the overall effect of reducing the number of place-
ment machines required to mount components:
Reduced Costs
Placement costs are greatly reduced by effectively placing
one device instead of four or two. This results in increased
throughput and translates into savings on machine time.
Inventory levels are lowered and further savings are made
on solder materials, etc.
If 120 million 2-element arrays or 40 million 4-element arrays
were placed in a year, the requirement for placement
equipment would be reduced by one machine.
During a 20Hr operational day a machine places 720K
components. Over a working year of 167 days the machine
can place approximately 120 million. If 2-element arrays are
mounted instead of discrete components, then the number
of placements is reduced by a factor of two and in the
scenario where 120 million 2-element arrays are placed there
is a saving of one pick and place machine.
Space Saving
Space savings can be quite dramatic when compared to
the use of discrete chip capacitors. As an example, the
0508 4-element array offers a space reduction of >40ꢀ vs.
4 x 0402 discrete capacitors and of >70ꢀ vs. 4 x 0603
discrete capacitors. (This calculation is dependent on the
spacing of the discrete components.)
Smaller volume users can also benefit from replacing
discrete components with arrays. The total number of place-
ments is reduced thus creating spare capacity on placement
machines. This in turn generates the opportunity to increase
overall production output without further investment in new
equipment.
Increased Throughput
Assuming that there are 220 passive components placed in a
mobile phone:
A reduction in the passive count to 200 (by replacing
discrete components with arrays) results in an increase in
throughput of approximately 9ꢀ.
A reduction of 40 placements increases throughput by 18ꢀ.
W2A (0508) Capacitor Arrays
4 pcs 0402 Capacitors
=
1 pc 0508 Array
1.88
(0.074)
1.4
1.0
(0.055) (0.039)
5.0 (0.197)
AREA = 7.0mm (0.276 in )
2.1 (0.083)
AREA = 3.95mm (0.156 in )
2
2
2
2
The 0508 4-element capacitor array gives a PCB space saving of over 40ꢀ
vs four 0402 discretes and over 70ꢀ vs four 0603 discrete capacitors.
W3A (0612) Capacitor Arrays
4 pcs 0603 Capacitors
=
1 pc 0612 Array
1.60
(0.063)
2.3
(0.091)
1.5
(0.059)
6.0 (0.236)
AREA = 13.8mm (0.543 in )
3.2 (0.126)
AREA = 6.4mm (0.252 in )
2
2
2
2
The 0612 4-element capacitor array gives a PCB space saving of over 50ꢀ
vs four 0603 discretes and over 70ꢀ vs four 0805 discrete capacitors.
032417
70
Capacitor Array
Capacitor Array (IPC)
GENERAL DESCRIPTION
AVX is the market leader in the development and manufacture of
capacitor arrays. The array family of products also includes the 0612
4-element device as well as 0508 2-element and 4-element series,
all of which have received widespread acceptance in the
marketplace.
0508 - 2 Element
AVX capacitor arrays are available in X5R, X7R and NP0 (C0G)
ceramic dielectrics to cover a broad range of capacitance values.
Voltage ratings from 6.3 Volts up to 100 Volts are offered. AVX
also now offers a range of automotive capacitor arrays qualified to
AEC-Q200 (see separate table).
Key markets for capacitor arrays are Mobile and Cordless Phones,
Digital Set Top Boxes, Computer Motherboards and Peripherals
as well as Automotive applications, RF Modems, Networking
Products, etc.
0612 - 4 Element
0508 - 4 Element
AVX Capacitor Array - W2A41A***K
S21 Magnitude
0
-5
-10
-15
-20
-25
5pF
10pF
22pF
39pF
15pF
33pF
68pF
-30
-35
-40
0.01
0.1
1
10
Frequency (GHz)
HOW TO ORDER
W
2
A
4
3
C
103
M
2A
A
T
Style
W = RoHS
L = SnPb
Case
Size
2 = 0508
3 = 0612
Array
Number
of Caps
2 = 2 Element
4 = 4 Element
Voltage Dielectric Capacitance Capacitance
Packaging &
Quantity
Code
Failure
Rate
A = Commercial
4 = Automotive
Termination
Code
Code
2 Sig Digits +
Number of
Zeros
Tolerance
J = 5ꢀ
6 = 6V
A = NP0
C = X7R
D = X5R
*T = Plated Ni
and Sn
Z = 10V
Y = 16V
3 = 25V
5 = 50V
1 = 100V
2A = 7" Reel
(4000)
K = 10ꢀ
M = 20ꢀ
*Z = FLEXITERM®
*B = 5ꢀ min lead
*X = FLEXITERM®
with 5ꢀ min
lead
4A = 13" Reel
(10000)
2F = 7" Reel
(1000)
*RoHS Compliant
*Not RoHS Compliant
NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.
032417
71
Capacitor Array
Capacitance Range – NP0/C0G
SIZE
# Elements
Soldering
W2 = 0508
W3 = 0612
4
4
Reflow/Wave
Paper/Embossed
Reflow/Wave
Paper/Embossed
Packaging
mm
(in.)
1.30 0.15
(0.051 0.006)
1.60 0.150
(0.063 0.006)
Length
mm
(in.)
2.10 0.15
(0.083 0.006)
3.20 0.20
(0.126 0.008)
Width
Max.
Thickness
mm
(in.)
0.94
(0.037)
1.35
(0.053)
WVDC
Cap 1.0
16
25
50
16
25
50
1R0
1R2
1R5
(pF)
1.2
1.5
1R8
2R2
2R7
1.8
2.2
2.7
3R3
3R9
4R7
3.3
3.9
4.7
5R6
6R8
8R2
5.6
6.8
8.2
100
120
150
10
12
15
180
220
270
18
22
27
330
390
470
33
39
47
560
680
820
56
68
82
101
121
151
100
120
150
181
221
271
180
220
270
331
391
471
330
390
470
561
681
821
560
680
820
102
122
152
1000
1200
1500
182
222
272
1800
2200
2700
332
392
472
3300
3900
4700
562
682
822
5600
6800
8200
= Supported Values
032417
72
Capacitor Array
Capacitance Range – X7R
SIZE
# Elements
Soldering
W2 = 0508
W2 = 0508
W3 = 0612
2
4
4
Reflow/Wave
All Paper
Reflow/Wave
Paper/Embossed
Reflow/Wave
Paper/Embossed
Packaging
mm
(in.)
1.30 0.15
(0.051 0.006)
1.30 0.15
(0.051 0.006)
1.60 0.150
(0.063 0.006)
Length
mm
(in.)
2.10 0.15
(0.083 0.006)
2.10 0.15
(0.083 0.006)
3.20 0.20
(0.126 0.008)
Width
Max.
Thickness
mm
(in.)
0.94
(0.037)
0.94
(0.037)
1.35
(0.053)
WVDC
6
10
16
25
50 100
6
10
16
25
50 100
6
10
16
25
50 100
101 Cap
121 (pF)
151
100
120
150
181
221
271
180
220
270
331
391
471
330
390
470
561
681
821
560
680
820
102
122
152
1000
1200
1500
182
222
272
1800
2200
2700
332
392
472
3300
3900
4700
562
682
822
5600
6800
8200
103 Cap
123 (μF)
153
0.010
0.012
0.015
183
223
273
0.018
0.022
0.027
333
393
473
0.033
0.039
0.047
563
683
823
0.056
0.068
0.082
104
124
154
0.10
0.12
0.15
184
224
274
0.18
0.22
0.27
334
474
564
0.33
0.47
0.56
684
824
105
0.68
0.82
1.0
125
155
185
1.2
1.5
1.8
225
335
475
2.2
3.3
4.7
106
226
476
107
10
22
47
100
REV 01
73
Automotive Capacitor Array (IPC)
As the market leader in the development and manufacture of capacitor
arrays AVX is pleased to offer a range of AEC-Q200 qualified arrays to
compliment our product offering to the Automotive industry. Both the
AVX 0612 and 0508 4-element capacitor array styles are qualified to the
AEC-Q200 automotive specifications.
AEC-Q200 is the Automotive Industry qualification standard and a
detailed qualification package is available on request.
0508 - 4 Element
All AVX automotive capacitor array production facilities are certified to
ISO/TS 16949:2002.
0612 - 4 Element
HOW TO ORDER
Y
C
104
K
4
T
3
A
4
2A
W
Voltage Dielectric Capacitance Capacitance Failure Rate
Case
Size
2 = 0508
3 = 0612
Array
Packaging
& Quantity
Code
Style
W = RoHS
L = SnPb
Number
of Caps
Terminations
*T = Plated Ni and Sn
*Z = FLEXITERM®
B = 5ꢀ min lead
X = FLEXITERM®
with 5ꢀ min lead
Z = 10V
Y = 16V
3 = 25V
5 = 50V
1 = 100V
A = NP0
C = X7R
F = X8R
Code (In pF)
Significant
Digits +
Tolerance
*J = 5ꢀ
4 = Automotive
2A = 7" Reel
(4000)
*K = 10ꢀ
M = 20ꢀ
Number of
Zeros
4A = 13" Reel
(10000)
2F = 7" Reel
(1000)
e.g. 10μF=106
*RoHS compliant
*Contact factory for availability by part number for K = 10ꢀ and J = 5ꢀ tolerance.
NP0/C0G
X7R
SIZE
No. of Elements
W2 = 0508
W3 = 0612
SIZE
No. of Elements
W2 = 0508
W2 = 0508
W3 = 0612
4
4
2
4
4
WVDC
16
25
50
100
16
25
50
100
WVDC
16
25
50
100
16
25
50
100
10
16
25
50
100
1R0
1R2
1R5
Cap 1.0
(pF) 1.2
1.5
101
121
151
Cap 100
(pF) 120
150
1R8
2R2
2R7
1.8
2.2
2.7
181
221
271
180
220
270
3R3
3R9
4R7
3.3
3.9
4.7
331
391
471
330
390
470
5R6
6R8
8R2
5.6
6.8
8.2
561
681
821
560
680
820
100
120
150
10
12
15
102
122
152
1000
1200
1500
180
220
270
18
22
27
182
222
272
1800
2200
2700
330
390
470
33
39
47
332
392
472
3300
3900
4700
560
680
820
56
68
82
562
682
822
5600
6800
8200
101
121
151
100
120
150
103 Cap 0.010
123
153
(μF) 0.012
0.015
181
221
271
180
220
270
183
223
273
0.018
0.022
0.027
331
391
471
330
390
470
333
393
473
0.033
0.039
0.047
561
681
821
560
680
820
563
683
823
0.056
0.068
0.082
102
122
152
1000
1200
1500
104
124
154
0.10
0.12
0.15
182
222
272
1800
2200
2700
224
0.22
= X7R
332
392
472
3300
3900
4700
Not RoHS Compliant
562
682
822
5600
6800
8200
= NPO/COG
LEAD-FREE COMPATIBLE
COMPONENT
For RoHS compliant products,
please select correct termination style.
REV 01
74
Capacitor Array
PART & PAD LAYOUT DIMENSIONS
millimeters (inches)
0508 - 4 Element
0612 - 4 Element
0508 - 2 Element
W
X
X
W
S
S
P
X
X
S
S
P
T
T
BW
C/L OF CHIP
BW
C/L OF CHIP
C
C
L
L
BL
L
BL
L
PAD LAYOUT
PAD LAYOUT
PAD LAYOUT
PART DIMENSIONS
PAD LAYOUT DIMENSIONS
0508 - 2 Element
0508 - 2 Element
L
W
2.10 0.15
T
BW
0.43 0.10
BL
0.33 0.08
P
1.00 REF
S
A
B
C
D
E
1.30 0.15
0.94 MAX
0.50 0.10
0.68
1.32
2.00
0.46
1.00
(0.051 0.006) (0.083 0.006) (0.037 MAX) (0.017 0.004) (0.013 0.003
)
(0.039 REF) (0.020 0.004)
(0.027)
(0.052)
(0.079)
(0.018)
(0.039)
0508 - 4 Element
0508 - 4 Element
L
W
2.10 0.15
T
BW
0.25 0.06
BL
0.20 0.08
P
0.50 REF
X
S
A
B
C
D
E
1.30 0.15
0.94 MAX
0.75 0.10
0.25 0.10
0.56
1.32
1.88
0.30
0.50
(0.051 0.006) (0.083 0.006) (0.037 MAX) (0.010 0.003) (0.008 0.003
)
(0.020 REF) (0.030 0.004) (0.010 0.004)
(0.022)
(0.052)
(0.074)
(0.012)
(0.020)
0612 - 4 Element
0612 - 4 Element
A
B
C
D
E
L
W
T
BW
BL
P
X
S
+0.25
0.89
1.65
2.54
0.46
0.76
1.60 0.20
3.20 0.20
1.35 MAX
0.41 0.10
0.18
0.76 REF
1.14 0.10
0.38 0.10
-0.08
(0.035)
(0.065)
(0.100)
(0.018)
(0.030)
+0.010
(0.063 0.008) (0.126 0.008) (0.053 MAX) (0.016 0.004) (0.007
)
(0.030 REF) (0.045 0.004) (0.015 0.004)
-0.003
REV 01
75
Low Inductance Capacitors
Introduction
The signal integrity characteristics of a Power Delivery
Network (PDN) are becoming critical aspects of board level
and semiconductor package designs due to higher operating
frequencies, larger power demands, and the ever shrinking
lower and upper voltage limits around low operating voltages.
These power system challenges are coming from mainstream
designs with operating frequencies of 300MHz or greater,
modest ICs with power demand of 15 watts or more, and
operating voltages below 3 volts.
capacitor, one resistor, and one inductor. The RLC values in
this model are commonly referred to as equivalent series
capacitance (ESC), equivalent series resistance (ESR), and
equivalent series inductance (ESL).
The ESL of a capacitor determines the speed of energy
transfer to a load. The lower the ESL of a capacitor, the faster
that energy can be transferred to a load. Historically, there
has been a tradeoff between energy storage (capacitance)
and inductance (speed of energy delivery). Low ESL devices
typically have low capacitance. Likewise, higher capacitance
devices typically have higher ESLs. This tradeoff between
ESL (speed of energy delivery) and capacitance (energy
storage) drives the PDN design topology that places the
fastest low ESL capacitors as close to the load as possible.
Low Inductance MLCCs are found on semiconductor
packages and on boards as close as possible to the load.
The classic PDN topology is comprised of a series of
capacitor stages. Figure 1 is an example of this architecture
with multiple capacitor stages.
An ideal capacitor can transfer all its stored energy to a load
instantly. A real capacitor has parasitics that prevent
instantaneous transfer of a capacitor’s stored energy. The
true nature of a capacitor can be modeled as an RLC
equivalent circuit. For most simulation purposes, it is possible
to model the characteristics of a real capacitor with one
Slowest Capacitors
Fastest Capacitors
Semiconductor Product
VR
Bulk
Board-Level
Package-Level
Die-Level
Low Inductance Decoupling Capacitors
Figure 1 Classic Power Delivery Network (PDN) Architecture
LOW INDUCTANCE CHIP CAPACITORS
INTERDIGITATED CAPACITORS
The key physical characteristic determining equivalent series
inductance (ESL) of a capacitor is the size of the current loop
it creates. The smaller the current loop, the lower the ESL. A
standard surface mount MLCC is rectangular in shape with
electrical terminations on its shorter sides. A Low Inductance
Chip Capacitor (LICC) sometimes referred to as Reverse
Geometry Capacitor (RGC) has its terminations on the longer
side of its rectangular shape.
The size of a current loop has the greatest impact on the ESL
characteristics of a surface mount capacitor. There is a
secondary method for decreasing the ESL of a capacitor.
This secondary method uses adjacent opposing current
loops to reduce ESL. The InterDigitated Capacitor (IDC)
utilizes both primary and secondary methods of reducing
inductance. The IDC architecture shrinks the distance
between terminations to minimize the current loop size, then
further reduces inductance by creating adjacent opposing
current loops.
When the distance between terminations is reduced, the size
of the current loop is reduced. Since the size of the current
loop is the primary driver of inductance, an 0306 with a
smaller current loop has significantly lower ESL then an 0603.
The reduction in ESL varies by EIA size, however, ESL is
typically reduced 60ꢀ or more with an LICC versus a
standard MLCC.
An IDC is one single capacitor with an internal structure that
has been optimized for low ESL. Similar to standard MLCC
versus LICCs, the reduction in ESL varies by EIA case size.
Typically, for the same EIA size, an IDC delivers an ESL that
is at least 80ꢀ lower than an MLCC.
REV 01
76
Low Inductance Capacitors
Introduction
LAND GRID ARRAY (LGA) CAPACITORS
LOW INDUCTANCE CHIP ARRAYS (LICA®)
Land Grid Array (LGA) capacitors are based on the first Low
ESL MLCC technology created to specifically address the
design needs of current day Power Delivery Networks (PDNs).
This is the 3rd low inductance capacitor technology
developed by AVX. LGA technology provides engineers with
new options. The LGA internal structure and manufacturing
technology eliminates the historic need for a device to be
physically small to create small current loops to minimize
inductance.
The LICA® product family is the result of a joint development
effort between AVX and IBM to develop a high performance
MLCC family of decoupling capacitors. LICA was introduced
in the 1980s and remains the leading choice of designers in
high performance semiconductor packages and high
reliability board level decoupling applications.
LICA® products are used in 99.999ꢀ uptime semiconductor
package applications on both ceramic and organic
substrates. The C4 solder ball termination option is the
perfect compliment to flip-chip packaging technology.
Mainframe class CPUs, ultimate performance multi-chip
modules, and communications systems that must have the
reliability of 5 9’s use LICA®.
LICA® products with either Sn/Pb or Pb-free solder balls are
used for decoupling in high reliability military and aerospace
applications. These LICA® devices are used for decoupling of
large pin count FPGAs, ASICs, CPUs, and other high power
ICs with low operating voltages.
The first family of LGA products are 2 terminal devices. A
2 terminal 0306 LGA delivers ESL performance that is equal
to or better than an 0306 8 terminal IDC. The 2 terminal 0805
LGA delivers ESL performance that approaches the 0508
8 terminal IDC. New designs that would have used 8 terminal
IDCs are moving to 2 terminal LGAs because the layout is
easier for a 2 terminal device and manufacturing yield is better
for a 2 terminal LGA versus an 8 terminal IDC.
LGA technology is also used in a 4 terminal family of products
that AVX is sampling and will formerly introduce in 2008.
Beyond 2008, there are new multi-terminal LGA product
families that will provide even more attractive options for PDN
designers.
When high reliability decoupling applications require the very
lowest ESL capacitors, LICA® products are the best option.
470 nF 0306 Impedance Comparison
1
0306 2T-LGA
0306 LICC
0306 8T-IDC
0603 MLCC
0.1
0.01
0.001
1
10
100
1000
Frequency (MHz)
Figure 2 MLCC, LICC, IDC, and LGA technologies deliver different levels of equivalent series inductance (ESL).
REV 01
77
Low Inductance Ceramic
Capacitors LICC
0306/0508/0612 RoHS Compliant
GENERAL DESCRIPTION
The key physical characteristic determining equivalent series
inductance (ESL) of a capacitor is the size of the current loop
it creates. The smaller the current loop, the lower the ESL.
A standard surface mount MLCC is rectangular in shape with
electrical terminations on its shorter sides. A Low Inductance
Chip Capacitor (LICC) sometimes referred to as Reverse
Geometry Capacitor (RGC) has its terminations on the longer
sides of its rectangular shape. The image on the right shows
the termination differences between an MLCC and an LICC.
When the distance between terminations is reduced, the size
of the current loop is reduced. Since the size of the current
loop is the primary driver of inductance, an 0306 with a
smaller current loop has significantly lower ESL then an
0603. The reduction in ESL varies by EIA size, however, ESL
is typically reduced 60ꢀ or more with an LICC versus a
LICC
MLCC
PERFORMANCE CHARACTERISTICS
Capacitance Tolerances K = 10ꢀ; M = 20ꢀ
standard MLCC.
AVX LICC products are available with a lead-free finish of
plated Nickel/Tin.
Operation
X7R = -55ꢁC to +125ꢁC
X5R = -55ꢁC to +85ꢁC
X7S = -55ꢁC to +125ꢁC
Temperature Range
Temperature Coefficient X7R, X5R = 15ꢀ; X7S = 22ꢀ
Voltage Ratings
4, 6.3, 10, 16, 25 VDC
Dissipation Factor
4V, 6.3V = 6.5ꢀ max; 10V = 5.0ꢀ max;
16V = 3.5ꢀ max; 25V = 3.0ꢀ max
Insulation Resistance
(@+25°C, RVDC)
100,000MΩ min, or 1,000MΩ per
μF min.,whichever is less
HOW TO ORDER
0612
Z
D
105
M
A
T
2
A*
Size
0306
0508
0612
Voltage
4 = 4V
6 = 6.3V
Z = 10V
Y = 16V
3 = 25V
5 = 50V
Dielectric
C = X7R
D = X5R
W = X6S
Z = X7S
Capacitance
Code (In pF)
2 Sig. Digits +
Number of Zeros
Capacitance
Tolerance
K = 10ꢀ
Failure Rate Terminations
Packaging
Available
2 = 7" Reel
4 = 13" Reel
Thickness
Thickness
mm (in)
0.56 (0.022)
0.76 (0.030)
1.02 (0.040)
1.27 (0.050)
A = N/A
T = Plated Ni
and Sn
M = 20ꢀ
*See the thickness tables on the next page.
NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.
TYPICAL IMPEDANCE CHARACTERISTICS
10
MLCC_1206
1
0.1
LICC_0612
0.01
0.001
1
10
100
1000
Frequency (MHz)
041416
78
Low Inductance Ceramic
Capacitors LICC
0306/0508/0612 RoHS Compliant
PHYSICAL DIMENSIONS AND
PAD LAYOUT
SIZE
0306
0508
0612
Packaging
Embossed
Embossed
Embossed
mm
(in.)
0.81 0.15
(0.032 0.006)
1.27 0.25
(0.050 0.010)
1.60 0.25
(0.063 0.010)
Length
mm
(in.)
1.60 0.15
2.00 0.25
3.20 0.25
Width
(0.063 0.006)
(0.080 0.010)
(0.126 0.010)
t
W
Cap Code WVDC4
4
6.3 10 16 25 6.3 10 16 25 50 6.3 10 16 25 50
102
222
332
472
682
103
153
223
333
473
683
104
154
224
334
474
684
105
155
225
335
475
Cap 0.001
(μF) 0.0022
0.0033
0.0047
0.0068
0.01
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
S
S
S
S
S
S
S
S
S
S
S
S
S
S
V
V
A
A
A
S
S
S
S
S
S
S
S
S
S
S
S
S
S
V
V
A
A
S
S
S
S
S
S
S
S
S
S
S
V
V
A
A
A
S
S
S
S
S
S
S
S
V
V
A
A
V
V
V
V
V
V
V
V
V
A
A
A
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
V
V
W
A
A
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
V
V
W
A
S
S
S
S
S
S
S
S
S
S
S
S
S
V
V
V
W
A
S
S
S
S
S
S
S
S
S
S
V
V
V
T
V
V
V
L
V
0.015
0.022
0.033
0.047
0.068
0.1
W
W
W
W
W
W
W
PHYSICAL DIMENSIONS
mm (in)
t
0.13 min.
(0.005 min.)
V
L
W
0.15
W
W
0.81 0.15
(0.032 0.006)
1.60 0.15
(0.063 0.006)
0.22
0306
0508
0612
0.33
1.27 0.25
(0.050 0.010)
2.00 0.25
(0.080 0.010)
0.13 min.
(0.005 min.)
0.47
0.68
1.60 0.25
(0.063 0.010)
3.20 0.25
(0.126 0.010)
0.13 min.
(0.005 min.)
1
A
1.5
2.2
T - See Range Chart for Thickness and Codes
3.3
4.7
685
106
6.8
10
PAD LAYOUT DIMENSIONS
mm (in)
A
B
C
0306
0508
0612
0.31 (0.012)
0.51 (0.020)
0.76 (0.030)
1.52 (0.060)
2.03 (0.080)
3.05 (0.120)
0.51 (0.020)
0.76 (0.030)
0.635 (0.025)
Solid = X7R
= X6S
= X5R
= X7S
mm (in.)
mm (in.)
mm (in.)
0306
0508
0612
Code Thickness
Code Thickness
Code Thickness
A
0.56 (0.022)
S
V
A
0.56 (0.022)
0.76 (0.030)
1.02 (0.040)
S
V
0.56 (0.022)
0.76 (0.030)
1.02 (0.040)
1.27 (0.050)
W
A
“B”
C
“A”
C
041416
79
Low Inductance Capacitors
with SnPb Terminations
LD16/LD17/LD18 Tin-Lead Termination “B”
GENERAL DESCRIPTION
The key physical characteristic determining equivalent
series inductance (ESL) of a capacitor is the size of the
current loop it creates. The smaller the current loop, the
lower the ESL.
A standard surface mount MLCC is rectangular in shape
with electrical terminations on its shorter sides. A Low
Inductance Chip Capacitor (LICC) sometimes referred to
as Reverse Geometry Capacitor (RGC) has its
terminations on the longer sides of its rectangular shape.
The image on the right shows the termination differences
between an MLCC and an LICC.
LICC
MLCC
When the distance between terminations is reduced, the
size of the current loop is reduced. Since the size of the
current loop is the primary driver of inductance, an 0306
with a smaller current loop has significantly lower ESL
then an 0603. The reduction in ESL varies by EIA size,
however, ESL is typically reduced 60ꢀ or more with an
LICC versus a standard MLCC.
PERFORMANCE CHARACTERISTICS
Capacitance Tolerances K = 10ꢀ; M = 20ꢀ
Operation
X7R = -55ꢁC to +125ꢁC
X5R = -55ꢁC to +85ꢁC
X7S = -55ꢁC to +125ꢁC
Temperature Range
AVX LICC products are available with a lead termination
for high reliability military and aerospace applications that
must avoid tin whisker reliability issues.
Temperature Coefficient X7R, X5R = 15ꢀ; X7S = 22ꢀ
Voltage Ratings
4, 6.3, 10, 16, 25 VDC
Dissipation Factor
4V, 6.3V = 6.5ꢀ max; 10V = 5.0ꢀ max;
16V = 3.5ꢀ max; 25V = 3.0ꢀ max
Not RoHS Compliant
Insulation Resistance
(@+25°C, RVDC)
100,000MΩ min, or 1,000MΩ per
μF min.,whichever is less
HOW TO ORDER
LD18
Z
D
105
M
A
B
2
A*
Size
Voltage
4 = 4V
6 = 6.3V
Z = 10V
Y = 16V
3 = 25V
5 = 50V
Dielectric
C = X7R
D = X5R
W = X6S
Capacitance
Code (In pF)
2 Sig. Digits +
Number of Zeros
Capacitance
Tolerance
K = 10ꢀ
Failure Rate Terminations
Packaging
Available
2 = 7" Reel
4 = 13" Reel
Thickness
Thickness
mm (in)
0.56 (0.022)
0.76 (0.030)
1.02 (0.040)
1.27 (0.050)
LD16 = 0306
LD17 = 0508
LD18 = 0612
A = N/A
B = 5ꢀ min lead
M = 20ꢀ
*See the thickness tables on the next page.
NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.
TYPICAL IMPEDANCE CHARACTERISTICS
10
MLCC_1206
1
0.1
LICC_0612
0.01
0.001
1
10
100
1000
Frequency (MHz)
041416
80
Low Inductance Capacitors
with SnPb Terminations
LD16/LD17/LD18 Tin-Lead Termination “B”
SIZE
LD16
(0306)
LD17
(0508)
LD18
(0612)
PHYSICAL DIMENSIONS AND
PAD LAYOUT
Packaging
Embossed
Embossed
Embossed
mm
(in.)
0.81 0.15
(0.032 0.006)
1.27 0.25
(0.050 0.010)
1.60 0.25
(0.063 0.010)
Length
mm
(in.)
1.60 0.15
(0.063 0.006)
2.00 0.25
(0.080 0.010)
3.20 0.25
(0.126 0.010)
Width
t
W
Cap Code
102
222
332
472
682
103
153
223
333
473
683
104
154
224
334
474
684
105
155
225
335
475
WVDC
6.3 10 16 25 6.3 10 16 25 50 6.3 10 16 25
50
V
Cap 0.001
(μF) 0.0022
0.0033
0.0047
0.0068
0.01
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
S
S
S
S
S
S
S
S
S
S
S
S
S
S
V
V
A
A
A
S
S
S
S
S
S
S
S
S
S
S
S
S
S
V
V
A
A
S
S
S
S
S
S
S
S
S
S
S
V
V
A
A
A
S
S
S
S
S
S
S
S
V
V
A
A
V
V
V
V
V
V
V
V
V
A
A
A
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
V
V
W
A
A
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
V
V
W
A
S
S
S
S
S
S
S
S
S
S
S
S
S
V
V
V
W
A
S
S
S
S
S
S
S
S
S
S
V
T
V
V
V
L
V
V
0.015
0.022
0.033
0.047
0.068
0.1
W
W
W
W
W
W
W
PHYSICAL DIMENSIONS
mm (in)
t
0.13 min.
(0.005 min.)
L
W
V
0.15
W
W
LD16
0.81 0.15
1.60 0.15
(0.063 0.006)
(0306) (0.032 0.006)
LD17 1.27 0.25
(0508) (0.050 0.010)
LD18 1.60 0.25
(0612) (0.063 0.010)
0.22
2.00 0.25
(0.080 0.010)
0.13 min.
(0.005 min.)
0.33
0.47
3.20 0.25
(0.126 0.010)
0.13 min.
(0.005 min.)
0.68
1
1.5
T - See Range Chart for Thickness and Codes
2.2
3.3
4.7
PAD LAYOUT DIMENSIONS
685
106
6.8
10
mm (in)
C
A
B
LD16
(0306)
0.31 (0.012)
1.52 (0.060)
0.51 (0.020)
Solid = X7R
= X6S
= X5R
LD17
0.51 (0.020)
0.76 (0.030)
2.03 (0.080)
3.05 (0.120)
0.76 (0.030)
mm (in.)
LD16
(0306)
mm (in.)
mm (in.)
(0508)
LD17
(0508)
Code Thickness
LD18
(0612)
Code Thickness
LD18
(0612)
0.635 (0.025)
Code Thickness
A
0.56 (0.022)
S
V
A
0.56 (0.022)
0.76 (0.030)
1.02 (0.040)
S
V
0.56 (0.022)
0.76 (0.030)
1.02 (0.040)
1.27 (0.050)
W
A
“B”
C
“A”
C
041416
81
IDC Low Inductance Capacitors (RoHS)
0306/0612/0508 IDC (InterDigitated Capacitors)
GENERAL DESCRIPTION
Inter-Digitated Capacitors (IDCs) are used for both semiconductor
package and board level decoupling. The equivalent series
inductance (ESL) of a single capacitor or an array of capacitors in
0612
parallel determines the response time of a Power Delivery Network
(PDN). The lower the ESL of a PDN, the faster the response time.
A designer can use many standard MLCCs in parallel to reduce
ESL or a low ESL Inter-Digitated Capacitor (IDC) device. These IDC
devices are available in versions with a maximum height of 0.95mm
+
–
+
–
or 0.55mm.
0508
IDCs are typically used on packages of semiconductor products
with power levels of 15 watts or greater. Inter-Digitated Capacitors
are used on CPU, GPU, ASIC, and ASSP devices produced on
0.13μ, 90nm, 65nm, and 45nm processes. IDC devices are used
on both ceramic and organic package substrates. These low ESL
surface mount capacitors can be placed on the bottom side or the
top side of a package substrate. The low profile 0.55mm maximum
height IDCs can easily be used on the bottom side of BGA
packages or on the die side of packages under a heat spreader.
+
–
+
–
0306
TYPICAL IMPEDANCE
10
IDCs are used for board level decoupling of systems with speeds of
300MHz or greater. Low ESL IDCs free up valuable board space by
reducing the number of capacitors required versus standard
MLCCs. There are additional benefits to reducing the number of
capacitors beyond saving board space including higher reliability
from a reduction in the number of components and lower
placement costs based on the need for fewer capacitors.
MLCC_1206
LICC_0612
1
0.1
IDC_0612
0.01
The Inter-Digitated Capacitor (IDC) technology was developed by
AVX. This is the second family of Low Inductance MLCC products
created by AVX. IDCs are a cost effective alternative to AVX’s first
generation low ESL family for high-reliability applications known as
LICA (Low Inductance Chip Array).
0.001
1
10
100
1000
Frequency (MHz)
AVX IDC products are available with a lead-free finish of plated
Nickel/Tin.
HOW TO ORDER
225
M
W
3
L
1
6
D
A
T
3
A
Capacitance Capacitance
Style
IDC
Low
Inductance
Number Voltage Dielectric
Failure Termination Packaging
Thickness
Max. Thickness
mm (in.)
A=Standard
S=0.55 (0.022)
Code (In pF)
Tolerance
Case
of
Rate
4 = 4V
C = X7R
D = X5R
Z = X7S
T = Plated Ni
and Sn
Available
1=7" Reel
3=13" Reel
Size
Terminals
1 = 8 Terminals
2 Sig. Digits + M = 20ꢀ
Number of
Zeros
A = N/A
6 = 6.3V
Z = 10V
Y = 16V
3 = 25V
2 = 0508
3 = 0612
4 = 0306
NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.
PERFORMANCE CHARACTERISTICS
Capacitance Tolerance
Operation
20ꢀ Preferred
Dielectric Strength
CTE (ppm/C)
No problems observed after 2.5 x RVDC
for 5 seconds at 50mA max current
X7R = -55ꢁC to +125ꢁC
X5R = -55ꢁC to +85ꢁC
X7S = -55ꢁC to +125ꢁC
15ꢀ (0VDC), 22ꢀ (X7S)
4, 6.3, 10, 16, 25 VDC
Temperature Range
12.0
Thermal Conductivity 4-5W/M K
Temperature Coefficient
Voltage Ratings
Terminations
Available
Plated Nickel and Solder
Dissipation Factor
≤ 6.3V = 6.5ꢀ max;
10V = 5.0ꢀ max;
≥ 16V = 3.5ꢀ max
Insulation Resistance
(@+25°C, RVDC)
100,000MΩ min, or 1,000MΩ per
μF min.,whichever is less
REV 01
82
IDC Low Inductance Capacitors (RoHS)
0306/0612/0508 IDC (InterDigitated Capacitors)
SIZE
W4 = 0306
W2 = Thin 0508
W2 = 0508
W3= Thin 0612
W3 = 0612
W3 = THICK 0612
Max.
mm
(in.)
0.55
0.55.
0.95
0.55
0.95
1.22
Thickness
(0.022)
(0.022)
(0.037)
(0.022)
(0.037)
(0.048)
WVDC
4
6.3
4
6.3
10
16
25
4
6.3
10
16
25
4
6.3
10
16
4
6.3
10
16
25
4
6.3
10
16
Cap
(μF)
0.010
0.022
0.033
0.047
0.068
0.10
0.22
0.33
0.47
0.68
1.0
1.5
2.2
3.3
Consult factory for
additional requirements
PHYSICAL DIMENSIONS AND PAD LAYOUT
= X7R
= X5R
= X7S
PAD LAYOUT
DIMENSIONS
PHYSICAL CHIP DIMENSIONS millimeters (inches)
SIZE
0306
W
L
BW
0.25 0.10
BL
0.20 0.10
P
SIZE
0306
A
0.38
B
0.89
C
1.27
D
0.20
E
0.40
1.60 0.20
0.82 0.10
0.40 0.05
(0.015 0.002)
(0.063 0.008) (0.032 0.006 (0.010 0.004) (0.008 0.004)
2.03 0.20 1.27 0.20 0.30 0.10 0.25 0.15
(0.080 0.008) (0.050 0.008) (0.012 0.004) (0.010 0.006)
3.20 0.20 1.60 0.20 0.50 0.10 0.25 0.15
(0.015) (0.035) (0.050) (0.008) (0.015)
0.64 1.27 1.91 0.28 0.50
(0.025) (0.050) (0.075) (0.011) (0.020)
0.89 1.65 2.54 0.45 0.80
(0.035) (0.065) (0.010) (0.018) (0.031)
0.50 0.05
(0.020 0.002)
0508
0612
0508
0612
0.80 0.10
(0.126 0.008) (0.063 0.008) (0.020 0.004) (0.010 0.006) (0.031 0.004)
REV 01
83
IDC Low Inductance Capacitors (SnPb)
0306/0612/0508 IDC with Sn/Pb Termination
GENERAL DESCRIPTION
Inter-Digitated Capacitors (IDCs) are used for both semiconductor
package and board level decoupling. The equivalent series
inductance (ESL) of a single capacitor or an array of capacitors in
0612
parallel determines the response time of a Power Delivery Network
(PDN). The lower the ESL of a PDN, the faster the response time.
A designer can use many standard MLCCs in parallel to reduce
ESL or a low ESL Inter-Digitated Capacitor (IDC) device. These IDC
devices are available in versions with a maximum height of 0.95mm
or 0.55mm.
+
–
+
–
0508
IDCs are typically used on packages of semiconductor products
+
–
+
–
with power levels of 15 watts or greater. Inter-Digitated Capacitors
are used on CPU, GPU, ASIC, and ASSP devices produced on
0.13μ, 90nm, 65nm, and 45nm processes. IDC devices are used
on both ceramic and organic package substrates. These low ESL
0306
surface mount capacitors can be placed on the bottom side or the
top side of a package substrate. The low profile 0.55mm maximum
height IDCs can easily be used on the bottom side of BGA
packages or on the die side of packages under a heat spreader.
TYPICAL IMPEDANCE
IDCs are used for board level decoupling of systems with speeds of
300MHz or greater. Low ESL IDCs free up valuable board space by
10
reducing the number of capacitors required versus standard
MLCCs. There are additional benefits to reducing the number of
MLCC_1206
LICC_0612
1
capacitors beyond saving board space including higher reliability
from a reduction in the number of components and lower
0.1
placement costs based on the need for fewer capacitors.
IDC_0612
The Inter-Digitated Capacitor (IDC) technology was developed by
AVX. This is the second family of Low Inductance MLCC products
created by AVX. IDCs are a cost effective alternative to AVX’s first
generation low ESL family for high-reliability applications known as
LICA (Low Inductance Chip Array).
0.01
0.001
1
10
100
1000
Frequency (MHz)
AVX IDC products are available with a lead termination for high
reliability military and aerospace applications that must avoid tin
whisker reliability issues.
Not RoHS Compliant
HOW TO ORDER
225
M
L
3
L
1
6
D
A
B
3
A
Capacitance Capacitance
Style
IDC
Low
Inductance
Number
of
Terminals
1 = 8 Terminals
Dielectric
C = X7R
D = X5R
Z = X7S
Failure Termination Packaging
Thickness
Max. Thickness
mm (in.)
A=Standard
S=0.55 (0.022)
Voltage
4 = 4V
6 = 6.3V
Z = 10V
Y = 16V
3 = 25V
Code (In pF)
Tolerance
Case
Rate
B = 5ꢀ min.
Lead
Available
1=7" Reel
3=13" Reel
Size
2 Sig. Digits + M = 20ꢀ
Number of
Zeros
A = N/A
2 = 0508
3 = 0612
4 = 0306
NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.
PERFORMANCE CHARACTERISTICS
Capacitance Tolerance
Operation
20ꢀ Preferred
Dielectric Strength
CTE (ppm/C)
No problems observed after 2.5 x RVDC
for 5 seconds at 50mA max current
X7R = -55ꢁC to +125ꢁC
X5R = -55ꢁC to +85ꢁC
X7S = -55ꢁC to +125ꢁC
15ꢀ (0VDC), 22ꢀ (X7S)
4, 6.3, 10, 16, 25 VDC
Temperature Range
12.0
Thermal Conductivity 4-5W/M K
Temperature Coefficient
Voltage Ratings
Terminations
Available
Plated Nickel and Solder
Dissipation Factor
≤ 6.3V = 6.5ꢀ max;
10V = 5.0ꢀ max;
≥ 16V = 3.5ꢀ max
Insulation Resistance
(@+25°C, RVDC)
100,000MΩ min, or 1,000MΩ per
μF min.,whichever is less
REV 01
84
IDC Low Inductance Capacitors (SnPb)
0306/0612/0508 IDC with Sn/Pb Termination
SIZE
W4 = 0306
W2 = Thin 0508
W2 = 0508
W3= Thin 0612
W3 = 0612
W3 = THICK 0612
Max.
mm
(in.)
0.55
0.55.
0.95
0.55
0.95
1.22
Thickness
(0.022)
(0.022)
(0.037)
(0.022)
(0.037)
(0.048)
WVDC
4
6.3
4
6.3
10
16
25
4
6.3
10
16
25
4
6.3
10
16
4
6.3
10
16
25
4
6.3
10
16
Cap
(μF)
0.010
0.022
0.033
0.047
0.068
0.10
0.22
0.33
0.47
0.68
1.0
1.5
2.2
3.3
Consult factory for
additional requirements
PHYSICAL DIMENSIONS AND PAD LAYOUT
= X7R
= X5R
= X7S
PAD LAYOUT
DIMENSIONS
PHYSICAL CHIP DIMENSIONS millimeters (inches)
SIZE
0306
W
L
BW
0.25 0.10
BL
0.20 0.10
P
SIZE
0306
A
0.38
B
0.89
C
1.27
D
0.20
E
0.40
1.60 0.20
0.82 0.10
0.40 0.05
(0.015 0.002)
(0.063 0.008) (0.032 0.006 (0.010 0.004) (0.008 0.004)
2.03 0.20 1.27 0.20 0.30 0.10 0.25 0.15
(0.080 0.008) (0.050 0.008) (0.012 0.004) (0.010 0.006)
3.20 0.20 1.60 0.20 0.50 0.10 0.25 0.15
(0.015) (0.035) (0.050) (0.008) (0.015)
0.64 1.27 1.91 0.28 0.50
(0.025) (0.050) (0.075) (0.011) (0.020)
0.89 1.65 2.54 0.45 0.80
(0.035) (0.065) (0.010) (0.018) (0.031)
0.50 0.05
(0.020 0.002)
0508
0612
0508
0612
0.80 0.10
(0.126 0.008) (0.063 0.008) (0.020 0.004) (0.010 0.006) (0.031 0.004)
REV 01
85
LGA Low Inductance Capacitors
0204/0306 Land Grid Array
Land Grid Array (LGA) capacitors are the latest family of low inductance MLCCs from AVX.
These new LGA products are the third low inductance family developed by AVX. The in-
novative LGA technology sets a new standard for low inductance MLCC performance.
Our initial 2 terminal versions of LGA technology deliver the performance of an 8 terminal
IDC low inductance MLCC with a number of advantages including:
• Simplified layout of 2 large solder pads compared to 8 small pads for IDCs
• Opportunity to reduce PCB or substrate contribution to system ESL by using multi-
ple parallel vias in solder pads
• Advanced FCT manufacturing process used to create uniformly flat terminations on
the capacitor that resist “tombstoning”
• Better solder joint reliability
APPLICATIONS
Semiconductor Packages
• Microprocessors/CPUs
• Graphics Processors/GPUs
• Chipsets
Board Level Device Decoupling
• Frequencies of 300 MHz or more
• ICs drawing 15W or more
• Low voltages
• FPGAs
• High speed buses
• ASICs
0306 2 TERMINAL LGA COMPARISON WITH 0306 8 TERMINAL IDC
1
0.1
0.01
0.001
1
10
100
1000
Frequency (MHz)
051316
86
LGA Low Inductance Capacitors
0204/0306 Land Grid Array
SIZE
LG12 (0204)
0.50 (0.020)
1.00 (0.039)
X7S (Z)
LG22 (0306)
0.76 (0.030)
1.60 (0.063)
Length
Width
mm (in.)
mm (in.)
Temp. Char.
Working Voltage
X5R (D)
X6S (W)
X7R (C)
X5R (D)
X7S (Z)
X6S (W)
6.3
(6)
4
(4)
6.3
(6)
4
(4)
6.3
4
(4)
10
(Z)
6.3
(6)
4
(4)
6.3
(6)
4
(4)
6.3
(6)
4
(4)
6.3
(6)
4
(4)
(6)
Cap (μF)
0.010 (103)
0.022 (223)
0.047 (473)
0.100 (104)
0.220 (224)
0.330 (334)
0.470 (474)
1.000 (105)
2.200 (225)
= X7R
= X5R
= X7S
= X6S
HOW TO ORDER
LG
1
2
6
Z
104
M
A
T
2
S
1
Style Case Number of Working Temperature Coded
Cap
Termination Termination Packaging
Thickness
Number of
Size
Terminals Voltage Characteristic Cap Tolerance
Style
100ꢀ Sn*
Tape & Reel S = 0.55mm Capacitors
1 = 0204
2 = 0306
2
4 = 4V
6 = 6.3V
Z = 10V
C = X7R
D = X5R
Z = X7S
W = X6S
M = 20ꢀ A = “U” Land
2 = 7" Reel
max
*Contact factory for
other termination
finishes
4 = 13" Reel
Reverse
Geometry LGA
LG12, LG22
BL
L
T
BL
BW
W
L
PART DIMENSIONS
mm (inches)
Series
L
W
T
BW
BL
0.5 0.05
(0.020 0.002)
1.00 0.10
(0.039 0.004)
0.50 0.05
(0.020 0.002)
0.8 0.10
(0.031 0.004)
0.13 0.08
(0.005 0.003)
LG12 (0204)
0.76 0.10
(0.030 0.004)
1.60 0.10
(0.063 0.004)
0.50 0.05
(0.020 0.002)
1.50 0.10
(0.059 0.004)
0.28 0.08
(0.011 0.003)
LG22 (0306)
RECOMMENDED SOLDER PAD DIMENSIONS mm (inches)
PL
Series
PL
PW1
G
LG12 (0204)
0.50 (0.020)
1.00 (0.039)
0.20 (0.008)
G
LG22 (0306)
0.65 (0.026)
1.50 (0.059)
0.20 (0.008)
PW1
051316
87
LGA Low Inductance Capacitors
0204/0306 Land Grid Array – Tin/Lead Termination “B”
SIZE
PG12 (0204)
0.50 (0.020)
1.00 (0.039)
X7S (Z)
PG22 (0306)
0.76 (0.030)
1.60 (0.063)
Length
Width
mm (in.)
mm (in.)
Temp. Char.
Working Voltage
X5R (D)
X6S (W)
X7R (C)
X5R (D)
X7S (Z)
X6S (W)
6.3
(6)
4
(4)
6.3
(6)
4
(4)
6.3
4
(4)
10
(Z)
6.3
(6)
4
(4)
6.3
(6)
4
(4)
6.3
(6)
4
(4)
6.3
(6)
4
(4)
(6)
Cap (μF)
0.010 (103)
0.022 (223)
0.047 (473)
0.100 (104)
0.220 (224)
0.330 (334)
0.470 (474)
1.000 (105)
2.200 (225)
= X7R
= X5R
= X7S
= X6S
HOW TO ORDER
PG
1
2
6
Z
104
M
A
B
2
S
1
Style Case Number of Working Temperature Coded
Cap
Termination Termination Packaging
Thickness
Number of
Size
Terminals Voltage Characteristic Cap Tolerance
Style
5ꢀ Min Lead Tape & Reel S = 0.55mm Capacitors
1 = 0204
2 = 0306
2
4 = 4V
6 = 6.3V
Z = 10V
C = X7R
D = X5R
Z = X7S
W = X6S
M = 20ꢀ A = “U” Land
2 = 7" Reel
4 = 13" Reel
max
Not RoHS Compliant
Reverse
Geometry LGA
PG12, PG22
BL
L
T
BL
BW
W
L
PART DIMENSIONS
mm (inches)
Series
L
W
T
BW
BL
0.5 0.05
(0.020 0.002)
1.00 0.10
(0.039 0.004)
0.50 0.05
(0.020 0.002)
0.8 0.10
(0.031 0.004)
0.13 0.08
(0.005 0.003)
PG12 (0204)
0.76 0.10
(0.030 0.004)
1.60 0.10
(0.063 0.004)
0.50 0.05
(0.020 0.002)
1.50 0.10
(0.059 0.004)
0.28 0.08
(0.011 0.003)
PG22 (0306)
RECOMMENDED SOLDER PAD DIMENSIONS mm (inches)
PL
Series
PL
PW1
G
PG12 (0204)
0.50 (0.020)
1.00 (0.039)
0.20 (0.008)
G
PG22 (0306)
0.65 (0.026)
1.50 (0.059)
0.20 (0.008)
PW1
051316
88
AT Series
High Temperature MLCC – 200ºC & 250°C Rated
Present military specifications, as well as a majority of commercial
applications, require a maximum operating temperature of 125ꢁC.
However, the emerging market for high temperature electronics demands
capacitors operating reliably at temperatures beyond 125ꢁC. AVX’s high
temperature chip capacitor product line, has been extended with the
BME C0G chip. All AT chips have verified capabilities of long term
operation up to 250ꢁC for applications in both military and commercial
businesses. These capacitors demonstrate high volumetric efficiency,
high insulation resistance and low ESR/ESL for the most demanding
applications, such as “down-hole” oil exploration and aerospace
programs.
HOW TO ORDER
AT10
3
T
104
K
A
T
2
A
AVX
Voltage Temperature Capacitance Code Capacitance Test Level
Termination
Packaging
2 = 7" Reel
4 = 13" Reel
9 = Bulk
Special
Code
A = Standard
Style
Code
Coefficient
PME
(2 significant digits
+ no. of zeros)
101 = 100pF
102 = 1nF
Tolerance
J = 5ꢀ
K = 10ꢀ
M = 20ꢀ
A = Standard 1 = Pd/Ag
AT03 = 0603 16V = Y
AT05 = 0805 25V = 3 C0G 250ꢁC = A
AT06 = 1206 50V = 5 C0G 200ꢁC = 2
AT10 = 1210
AT12 = 1812
AT14 = 2225
T = 100ꢀ Sn Plated
(RoHS Compliant)
7 = Ni/Au Plated
(For 250ꢁC BME
C0G Only)
VHT 250ꢁC = T
VHT 200ꢁC = 4
BME
103 = 10nF
104 = 100nF
105 = 1μF
C0G 250ꢁC = 5
C0G 200ꢁC = 3
ELECTRICAL SPECIFICATIONS
Temperature Coefficient
Insulation Resistance 25°C (MIL-STD-202, Method 302)
PME C0G 0 30ppm/ꢁC, -55C to 250ꢁC
BME C0G 0 30ppm/ꢁC, -55C to 200ꢁC
See TCC Plot for +250ꢁC
100GΩ or 1000MΩ-μF (whichever is less)
Insulation Resistance 125°C (MIL-STD-202, Method 302)
10GΩ or 100MΩ-μF (whichever is less)
VHT:
T
15ꢀ, -55ꢁC to +150ꢁC
See TCC Plot for +250ꢁC
Insulation Resistance 200°C (MIL-STD-202, Method 302)
1GΩ or 10MΩ-μF (whichever is less)
Capacitance Test (MIL-STD-202, Method 305)
25ꢁC, 1.0 0.2 Vrms (open circuit voltage) @ 1kHz
Insulation Resistance 250°C (MIL-STD-202, Method 302)
100MΩ or 1MΩ-μF (whichever is less)
Dissipation factor 25°C
C0G: 0.15ꢀ Max at 1.0 0.2 Vrms (open circuit voltage) @ 1kHz
VHT: 2.5ꢀ Max at 1.0 0.2 Vrms (open circuit voltage) @ 1kHz
Direct Withstanding Voltage 25°C (Flash Test)
250ꢀ rated voltage for 5 seconds with 50mA max charging current
DIMENSIONS
millimeters (inches)
Size
AT03 = 0603
1.60 0.15
AT05 = 0805
AT06 = 1206
AT10 = 1210
AT12 = 1812
AT14 = 2225
(L) Length
2.01 0.20
3.20 0.20
3.20 0.20
4.50 0.30
5.72 0.25
(0.063 0.006) (0.079 0.008) (0.126 0.008) (0.126 0.008) (0.177 0.012) (0.225 0.010)
0.81 0.15 1.25 0.20 1.60 0.20 2.50 0.20 3.20 0.20 6.35 0.25
(0.032 0.006) (0.049 0.008) (0.063 0.008) (0.098 0.008) (0.126 0.008) (0.250 0.010)
(W) Width
(T) Thickness
Max.
1.02
(0.040)
1.30
(0.051)
1.52
(0.060)
1.70
(0.067)
2.54
(0.100)
2.54
(0.100)
(t) terminal min.
0.25 (0.010)
0.25 (0.010)
0.75 (0.030)
0.25 (0.010)
0.75 (0.030)
0.25 (0.010)
0.75 (0.030)
0.25 (0.010)
1.02 (0.040)
0.25 (0.010)
1.02 (0.040)
max. 0.75 (0.030)
080416
89
AT Series
High Temperature MLCC – 200ºC & 250°C Rated
PERFORMANCE CHARACTERISTICS
Typical Temperature Coefficient of Capacitance (VHT Dielectric)
Typical Temperature Coefficient of Capacitance (C0G Dielectric)
1.5
15
1
BME
-13.75
-42.5
-71.25
-100
0.5
0
+30ppm/°C
-30ppm/°C
PME
-0.5
-1
-50
-25
0
25
50
75
100
125
150
175
200
225
250
-50
-25
0
25
50
75
100
125
150
175
200
225
250
Temperature (°C)
Temperature (°C)
Typical Voltage Coefficient of Capacitance (VHT Dielectric)
Typical Voltage Coefficient of Capacitance (C0G Dielectric)
1
5
0.8
0.6
0.4
0.2
0
Legend:
Capacitor’s Rated
Voltage
0
-5
16VDC
25VDC
50VDC
100VDC
200VDC
-10
-15
-20
-0.2
-0.4
-0.6
-0.8
-1
0
10
20
30
40
50
60
70
80
90
100
0
10
20
30
40
50
60
70
80
90
100
Percentage of Rated Voltage
Percentage of Rated Voltage
Typical RC vs Temperature (VHT Dielectric)
Typical RC vs Temperature (C0G Dielectric)
1000000
100000
10000
10000
1000
100
10
1000
100
10
1
1
25
50
75
100
125
150
175
200
225
250
25
50
75
100
125
150
175
200
225
250
Temperature (°C)
080416
90
AT Series
High Temperature MLCC – 200ºC & 250°C Rated
RELIABILITY
250°C Life Test @ 2x Rated Voltage (VHT Dielectric)
250°C Life Test @ 2x Rated Voltage (C0G Dielectric)
1.1
0.825
0.55
0.275
0
48000
36000
24000
12000
AT05YT104
AT103T104
AT123T334
AT143T105
AT143A473
AT123A123
0
0
250
500
750
1000
0
250
500
750
1000
Time (hrs)
Time (hrs)
VHT - Failure Rate @ 90% Confidence Level (%/1000 hours)
C0G - Failure Rate @ 90% Confidence Level (%/1000 hours)
Temperature (°C)
50% Rated Voltage
100% Rated Voltage
Temperature (°C)
50% Rated Voltage
100% Rated Voltage
200
0.002
0.017
200
0.006
0.047
250
0.026
0.210
250
0.074
0.590
*Typical 1210, 1812, 2225 Failure Rate Analysis based on 250°C testing and
voltage ratings specified on the following page.
*Typical 1812 and 2225 Failure Rate Analysis based on 250°C testing and volt-
age ratings specified on the following page.
FREQUENCY RESPONSE
Impedance Frequency Response (C0G Dielectric)
Impedance Frequency Response (VHT Dielectric)
1E+06
1E+05
AT143A473
AT05YT104
AT123A123
AT123T334
AT143T105
1E+05
1E+04
1E+03
1E+04
1E+03
1E+02
1E+01
1E+00
1E-01
1E-02
1E+02
1E+01
1E+00
1E-01
1E-02
1E+01
1E+02
1E+03
1E+04
1E+05
1E+06
1E+07
1E+08
1E+01
1E+02
1E+03
1E+04
1E+05
1E+06
1E+07
1E+08
Frequency (Hz)
ESR Frequency Response (C0G Dielectric)
Frequency (Hz)
ESR Frequency Response (VHT Dielectric)
1E+03
1E+02
1E+01
1E+00
1E-01
1E-02
1E+03
AT143A473
AT123A123
AT05YT104
AT123T334
AT143T105
1E+02
1E+01
1E+00
1E-01
1E-02
1E-03
1E+01
1E+02
1E+03
1E+04
1E+05
1E+06
1E+07
1E+08
1E+01
1E+02
1E+03
1E+04
1E+05
1E+06
1E+07
1E+08
Frequency (Hz)
Frequency (Hz)
080416
91
AT Series
High Temperature MLCC – 200ºC & 250°C Rated
CAPACITANCE RANGE
PREFERRED SIZES ARE SHADED
Temp. Coefficient: 4
Temp. Coefficient: T
VHT
VHT
200ºC Rated
250ºC Rated
Case Size AT03 = 0603 AT05 = 0805 AT06 = 1206 AT10 = 1210 AT12 = 1812 AT14 = 2225
Case Size AT03 = 0603 AT05 = 0805 AT06 = 1206 AT10 = 1210 AT12 = 1812 AT14 = 2225
Soldering
Reflow/Wave
Reflow/Wave
Reflow/Wave
Reflow Only
Reflow Only
Reflow Only
Soldering
Reflow/Wave
Reflow/Wave
Reflow/Wave
Reflow Only
Reflow Only
Reflow Only
(L) Length
mm
1.60 0.15
2.01 0.20
3.20 0.20
3.20 0.20
4.50 0.30
5.72 0.25
(L) Length
mm
1.60 0.15
2.01 0.20
3.20 0.20
3.20 0.20
4.50 0.30
5.72 0.25
(in.)
(0.063 0.006)
(0.079 0.008)
(0.126 0.008)
(0.126 0.008)
(0.177 0.012)
(0.225 0.010)
(in.)
(0.063 0.006)
(0.079 0.008)
(0.126 0.008)
(0.126 0.008)
(0.177 0.012)
(0.225 0.010)
(W) Width
mm
(in.)
0.81 0.15
(0.032 0.006)
1.25 0.20
(0.049 0.008)
1.60 0.20
(0.063 0.008)
2.50 0.20
(0.098 0.008)
3.20 0.20
(0.126 0.008)
6.35 0.25
(0.250 0.010)
(W) Width
mm
(in.)
0.81 0.15
(0.032 0.006)
1.25 0.20
(0.049 0.008)
1.60 0.20
(0.063 0.008)
2.50 0.20
(0.098 0.008)
3.20 0.20
(0.126 0.008)
6.35 0.25
(0.250 0.010)
(T) Thickness mm
(in.)
1.02
(0.040)
1.30
(0.051)
1.52
(0.060)
1.70
(0.067)
2.54
(0.100)
2.54
(0.100)
(T) Thickness mm
(in.)
1.02
(0.040)
1.30
(0.051)
1.52
(0.060)
1.70
(0.067)
2.54
(0.100)
2.54
(0.100)
(t) Terminal
min
max
0.25 (0.010)
0.75 (0.030)
0.25 (0.010)
0.75 (0.030)
0.25 (0.010)
0.75 (0.030)
0.25 (0.010)
0.75 (0.030)
0.25 (0.010)
1.02 (0.040)
0.25 (0.010)
1.02 (0.040)
(t) Terminal
min
max
0.25 (0.010)
0.75 (0.030)
0.25 (0.010)
0.75 (0.030)
0.25 (0.010)
0.75 (0.030)
0.25 (0.010)
0.75 (0.030)
0.25 (0.010)
1.02 (0.040)
0.25 (0.010)
1.02 (0.040)
Rated Temp. (ºC)
Temp. Coefficeint
Voltage (V)
200
4
200
4
200
4
200
4
200
4
200
4
Rated Temp. (ºC)
Temp. Coefficeint
Voltage (V)
250
T
250
T
250
T
250
T
250
T
250
T
25
25
50
25
50
25
50
50
50
16
16
25
16
25
16
25
25
25
Cap 1000 102
(pF) 1200 122
1500 152
Cap 1000 102
(pF) 1200 122
1500 152
1800 182
1800 182
2200 222
2200 222
2700 272
2700 272
3300 332
3300 332
3900 392
3900 392
4700 472
4700 472
5600 562
5600 562
6800 682
6800 682
8200 822
8200 822
Cap 0.010 103
(μF) 0.012 123
0.015 153
0.018 183
0.022 223
0.027 273
0.033 333
0.039 393
0.047 473
0.056 563
0.068 683
0.082 823
0.100 104
0.120 124
0.150 154
0.180 184
0.220 224
0.270 274
0.330 334
0.390 394
0.470 474
0.560 564
0.680 684
0.820 824
1.000 105
Voltage (V)
Cap 0.010 103
(μF) 0.012 123
0.015 153
0.018 183
0.022 223
0.027 273
0.033 333
0.039 393
0.047 473
0.056 563
0.068 683
0.082 823
0.100 104
0.120 124
0.150 154
0.180 184
0.220 224
0.270 274
0.330 334
0.390 394
0.470 474
0.560 564
0.680 684
0.820 824
1.000 105
Voltage (V)
25
25
50
25
50
25
50
50
50
16
16
25
16
25
16
25
25
25
Rated Temp. (ºC)
200
200
200
200
200
200
Rated Temp. (ºC)
250
250
250
250
250
250
Case Size AT03 = 0603 AT05 = 0805 AT06 = 1206 AT10 = 1210 AT12 = 1812 AT14 = 2225
Case Size AT03 = 0603 AT05 = 0805 AT06 = 1206 AT10 = 1210 AT12 = 1812 AT14 = 2225
Voltage rating per table. Capacitance values specified at 25ºC, derate capacitance value based on TCC and VCC Plots on page 90.
NOTE: Contact factory for non-specified capacitance values.
080416
92
AT Series
High Temperature MLCC – 200ºC & 250°C Rated
CAPACITANCE RANGE
PREFERRED SIZES ARE SHADED
Temp. Coefficient: 3
Temp. Coefficient: 5
BME C0G
BME C0G (Ni/Au)
200ºC Rated
250ºC Rated
Case Size
Soldering
AT03 = 0603
AT05 = 0805
AT06 = 1206
Case Size
Soldering
AT03 = 0603
AT05 = 0805
AT06 = 1206
Reflow/Wave
Reflow/Wave
Reflow/Wave
Reflow/Wave
Reflow/Wave
Reflow/Wave
(L) Length
mm
(in.)
1.60 0.15
2.01 0.20
3.20 0.20
(L) Length
mm
1.60 0.15
2.01 0.20
3.20 0.20
(0.063 0.006)
(0.079 0.008)
(0.126 0.008)
(in.)
(0.063 0.006)
(0.079 0.008)
(0.126 0.008)
(W) Width
mm
(in.)
0.81 0.15
(0.032 0.006)
1.25 0.20
(0.049 0.008)
1.60 0.20
(0.063 0.008)
(W) Width
mm
(in.)
0.81 0.15
(0.032 0.006)
1.25 0.20
(0.049 0.008)
1.60 0.20
(0.063 0.008)
(T) Thickness mm
(in.)
1.02
(0.040)
1.30
(0.051)
1.52
(0.060)
(T) Thickness mm
(in.)
1.02
(0.040)
1.30
(0.051)
1.52
(0.060)
(t) Terminal
min
max
0.25 (0.010)
0.75 (0.030)
0.25 (0.010)
0.75 (0.030)
0.25 (0.010)
0.75 (0.030)
(t) Terminal
min
max
0.25 (0.010)
0.75 (0.030)
0.25 (0.010)
0.75 (0.030)
0.25 (0.010)
0.75 (0.030)
Rated Temp. (ºC)
Temp. Coefficeint
Voltage (V)
200
3
200
3
200
3
Rated Temp. (ºC)
Temp. Coefficeint
Voltage (V)
250
5
250
5
250
5
25
50
25
50
25
50
25
25
25
Cap
pF
39 390
47 470
Cap
pF
39 390
47 470
56 560
56 560
68 680
68 680
82 820
82 820
100 101
120 121
150 151
180 181
220 221
270 271
330 331
390 391
470 471
560 561
680 681
820 821
1000 102
1200 122
1500 152
1800 182
2200 222
2700 272
3300 332
3900 392
4700 472
5600 562
6800 682
8200 822
100 101
120 121
150 151
180 181
220 221
270 271
330 331
390 391
470 471
560 561
680 681
820 821
1000 102
1200 122
1500 152
1800 182
2200 222
2700 272
3300 332
3900 392
4700 472
5600 562
6800 682
8200 822
Cap 0.010 103
μF 0.012 123
0.015 153
0.018 183
0.022 223
0.027 273
0.033 333
0.039 393
0.047 473
0.056 563
0.068 683
0.082 823
0.100 104
Voltage (V)
Cap 0.010 103
μF 0.012 123
0.015 153
0.018 183
0.022 223
0.027 273
0.033 333
0.039 393
0.047 473
0.056 563
0.068 683
0.082 823
0.100 104
Voltage (V)
25
200
50
25
50
25
50
25
25
25
Rated Temp. (ºC)
200
200
200
200
200
Rated Temp. (ºC)
250
250
250
Case Size
AT03 = 0603
AT05 = 0805
AT06 = 1206
Case Size
AT03 = 0603
AT05 = 0805
AT06 = 1206
Voltage rating per table. Capacitance values specified at 25ºC, derate capacitance value based on TCC and VCC Plots on page 90.
NOTE: Contact factory for non-specified capacitance values.
080416
93
AT Series
High Temperature MLCC – 200ºC & 250°C Rated
CAPACITANCE RANGE
PREFERRED SIZES ARE SHADED
Temp. Coefficient: 2
Temp. Coefficient: A
PME C0G
PME C0G
200ºC Rated
250ºC Rated
Case Size AT05 = 0805 AT06 = 1206 AT10 = 1210 AT12 = 1812 AT14 = 2225
Case Size AT05 = 0805 AT06 = 1206 AT10 = 1210 AT12 = 1812 AT14 = 2225
Soldering
Reflow/Wave
Reflow/Wave
Reflow Only
Reflow Only
Reflow Only
Soldering
Reflow/Wave
Reflow/Wave
Reflow Only
Reflow Only
Reflow Only
(L) Length
mm
2.01 0.20
3.20 0.20
3.20 0.20
4.50 0.30
2.75 0.25
(L) Length
mm
2.01 0.20
3.20 0.20
3.20 0.20
4.50 0.30
2.75 0.25
(in.)
(0.079 0.008)
(0.126 0.008)
(0.126 0.008)
(0.177 0.012)
(0.225 0.010)
(in.)
(0.079 0.008)
(0.126 0.008)
(0.126 0.008)
(0.177 0.012)
(0.225 0.010)
(W) Width
mm
(in.)
1.25 0.20
(0.049 0.008)
1.60 0.20
(0.063 0.008)
2.50 0.20
(0.098 0.008)
3.20 0.20
(0.126 0.008)
6.35 0.25
(0.250 0.010)
(W) Width
mm
(in.)
1.25 0.20
(0.049 0.008)
1.60 0.20
(0.063 0.008)
2.50 0.20
(0.098 0.008)
3.20 0.20
(0.126 0.008)
6.35 0.25
(0.250 0.010)
(T) Thickness mm
(in.)
1.30
(0.051)
1.52
(0.060)
1.70
(0.067)
2.54
(0.100)
2.54
(0.100)
(T) Thickness mm
(in.)
1.30
(0.051)
1.52
(0.060)
1.70
(0.067)
2.54
(0.100)
2.54
(0.100)
(t) Terminal
min
max
0.25 (0.010)
0.75 (0.030)
0.25 (0.010)
0.75 (0.030)
0.25 (0.010)
0.75 (0.030)
0.25 (0.010)
1.02 (0.040)
0.25 (0.010)
1.02 (0.040)
(t) Terminal
min
max
0.25 (0.010)
0.75 (0.030)
0.25 (0.010)
0.75 (0.030)
0.25 (0.010)
0.75 (0.030)
0.25 (0.010)
1.02 (0.040)
0.25 (0.010)
1.02 (0.040)
Rated Temp. (ºC)
Temp. Coefficeint
Voltage (V)
200
2
50
200
2
50
200
2
50
200
2
50
200
2
50
Rated Temp. (ºC)
Temp. Coefficeint
Voltage (V)
250
A
25
250
A
25
250
A
25
250
A
25
250
A
25
Cap
(pF)
100 101
120 121
150 151
180 181
220 221
270 271
330 331
390 391
470 471
560 561
680 681
820 821
1000 102
1200 122
1500 152
1800 182
2200 222
2700 272
3300 332
3900 392
4700 472
5600 562
6800 682
8200 822
Cap
(pF)
100 101
120 121
150 151
180 181
220 221
270 271
330 331
390 391
470 471
560 561
680 681
820 821
1000 102
1200 122
1500 152
1800 182
2200 222
2700 272
3300 332
3900 392
4700 472
5600 562
6800 682
8200 822
Cap 0.010 103
(μF) 0.012 123
0.015 153
0.018 183
0.022 223
0.027 273
0.033 333
0.039 393
0.047 473
0.056 563
0.068 683
0.082 823
0.100 104
Voltage (V)
Cap 0.010 103
(μF) 0.012 123
0.015 153
0.018 183
0.022 223
0.027 273
0.033 333
0.039 393
0.047 473
0.056 563
0.068 683
0.082 823
0.100 104
Voltage (V)
50
50
50
50
50
25
25
25
25
25
Rated Temp. (ºC)
200
200
200
200
200
Rated Temp. (ºC)
250
250
250
250
250
Case Size AT05 = 0805 AT06 = 1206 AT10 = 1210 AT12 = 1812 AT14 = 2225
Case Size AT05 = 0805 AT06 = 1206 AT10 = 1210 AT12 = 1812 AT14 = 2225
Voltage rating per table. Capacitance values specified at 25ºC, derate capacitance value based on TCC and VCC Plots on page 90.
NOTE: Contact factory for non-specified capacitance values.
080416
94
High Voltage MLC Chips
For 600V to 5000V Applications
High value, low leakage and small size are difficult parameters to obtain
in capacitors for high voltage systems. AVX special high voltage MLC chip
capacitors meet these performance characteristics and are designed for
applications such as snubbers in high frequency power converters,
resonators in SMPS, and high voltage couplingꢀdc blocking. These high
voltage chip designs exhibit low ESRs at high frequencies.
Larger physical sizes than normally encountered chips are used to make
high voltage MLC chip products. Special precautions must be taken in
applying these chips in surface mount assemblies. The temperature
gradient during heating or cooling cycles should not exceed 4ºC per
second. The preheat temperature must be within 50ºC of the peak
temperature reached by the ceramic bodies through the soldering process.
Chip sizes 1210 and larger should be reflow soldered only. Capacitors may
require protective surface coating to prevent external arcing.
For 1825, 2225 and ±640 sizes, AVX offers leaded version in either
thru-hole or SMT configurations (for details see section on high voltage
leaded MLC chips).
NEW 630V RANGE
HOW TO ORDER
1808
A
A
271
K
A
1
2
A
AVX
Voltage
Temperature Capacitance Code Capacitance Test Level
Termination*
Packaging
Special
Code
Style 600Vꢀ6±0V = C
Coefficient (2 significant digits
Tolerance A = Standard 1 = PdꢀAg
1 or 2 = 7" Reel**
0805
1206
1210
1808
1812
1825
2220
2225
±640
***
1000V = A NPO (C0G) = A + no. of zeros)
C0G:J = ±5ꢁ
K = ±10ꢁ
T = Plated
± or 4 = 1±" Reel A = Standard
1500V = S
2000V = G
2500V = W
±000V = H
4000V = J
5000V = K
X7R = C
Examples:
10 pF = 100
Ni and Sn
(RoHS Compli-
ant)
M = ±20ꢁ
100 pF = 101 X7R:K = ±10ꢁ
1,000 pF = 102
22,000 pF = 22±
220,000 pF = 224
1 µF =105
M = ±20ꢁ
Z = +80ꢁ,
-20ꢁ
*Note: Terminations with 5ꢁ minimum lead (Pb) is available, see pages 100 and 101 for LD style.
Leaded terminations are available, see pages 102-106.
Notes: Capacitors with X7R dielectrics are not intended for applications across AC supply mains or AC line filtering with polarity reversal. Contact plant for recommendations.
Contact factory for availability of Termination and Tolerance options for Specific Part Numbers.
** The ±640 Style is not available on 7" Reels.
*** AVX offers nonstandard chip sizes. Contact factory for details.
DIMENSIONS
millimeters (inches)
SIZE
0805
2.10 ± 0.20
1206
±.±0 ± 0.±0
1210*
±.±0 ± 0.40
1808*
4.60 ± 0.50
1812*
4.60 ± 0.50
1825*
4.60 ± 0.50
2220*
5.70 ± 0.50
2225*
3640*
(L) Length
5.72 ± 0.25
9.14 ± 0.25
(0.08± ± 0.008) (0.1±0 ± 0.012) (0.1±0 ± 0.016) (0.181 ± 0.020) (0.181 ± 0.020) (0.181 ± 0.020) (0.224 ± 0.020) (0.225 ± 0.010) (0.±60 ± 0.010)
+0.±0
(W) Width
1.25 ± 0.20
(0.049 ±0.008) (0.06±
1.60
2.50 ± 0.±0
2.00 ± 0.20
±.20 ± 0.±0
6.±0 ± 0.40
5.00 ± 0.40
6.±5 ± 0.25
10.2 ± 0.25
-0.10
+0.012
-0.004
)
(0.098 ± 0.012) (0.079 ± 0.008) (0.126 ± 0.012) (0.248 ± 0.016) (0.197 ± 0.016) (0.250 ± 0.010) (0.400 ± 0.010)
(T) Thickness
Max.
1.±5
1.80
(0.071)
0.60 ± 0.20
2.80
2.20
2.80
±.40
±.40
2.54
2.54
(0.05±)
(0.110)
(0.087)
(0.110)
(0.1±4)
(0.1±4)
(0.100)
(0.100)
(t) terminal min.
0.50 ± 0.20
0.75 ± 0.±5
0.75 ± 0.±5
0.75 ± 0.±5
0.75 ± 0.±5
0.85 ± 0.±5
0.85 ± 0.±5
0.76 (0.0±0)
max. (0.020 ± 0.008) (0.024 ± 0.008) (0.0±0 ± 0.014) (0.0±0 ± 0.014) (0.0±0 ± 0.014) (0.0±0 ± 0.014) (0.0±± ± 0.014) (0.0±± ± 0.014) 1.52 (0.060)
*Reflow Soldering Only
101±17
95
High Voltage MLC Chips
For 600V to 5000V Applications
NP0 (C0G)ꢀDielectric
Performance Characteristics
Capacitance Range
10 pF to 0.100 µF (25/C, 1.0 ±0.2 Vrms at 1kHz, for ≤ 1000 pF use 1 MHz)
Capacitance Tolerances
Dissipation Factor
Operating Temperature Range
Temperature Characteristic
Voltage Ratings
Insulation Resistance (+25/C, at 500 VDC)
Insulation Resistance (+125/C, at 500 VDC)
Dielectric Strength
±5ꢁ, ±10ꢁ, ±20ꢁ
0.1ꢁ max. (+25/C, 1.0 ±0.2 Vrms, 1kHz, for ≤ 1000 pF use 1 MHz)
-55/C to +125/C
0 ±±0 ppmꢀ/C (0 VDC)
600, 6±0, 1000, 1500, 2000, 2500, ±000, 4000 & 5000 VDC (+125/C)
100K MΩ min. or 1000 MΩ - µF min., whichever is less
10K MΩ min. or 100 MΩ - µF min., whichever is less
Minimum 120ꢁ rated voltage for 5 seconds at 50 mA max. current
NP0 (C0G) CAPACITANCE RANGE – PREFERRED SIZES ARE SHADED
Case Size
Soldering
0805
1206
1210
1808
1812
ReflowꢀWave
ReflowꢀWave
Reflow Only
Reflow Only
Reflow Only
(L) Length
mm
(in.)
2.10 ± 0.20
±.±0 ± 0.±0
±.±0 ± 0.40
4.60 ± 0.50
4.60 ± 0.50
(0.085 ± 0.008)
(0.1±0 ± 0.012)
(0.1±0 ± 0.016)
(0.181 ± 0.020)
(0.177 ± 0.012)
(W) Width
mm
1.25 ± 0.20
1.60 +0.±0ꢀ-0.10
2.50 ± 0.±0
2.00 ± 0.20
±.20 ± 0.±0
(in.)
mm
(in.)
(0.049 ± 0.008)
(0.06± +0.012ꢀ-0.004)
(0.098 ± 0.012)
(0.079 ± 0.008)
(0.126 ± 0.008)
(T) Thickness
(t) Terminal
1.±5
1.80
2.80
2.20
2.80
(0.05±)
(0.071)
(0.110)
(0.087)
(0.100)
min
0.50 ± 0.20
0.60 ± 0.20
0.75 ± 0.±5
0.75 ± 0.±5
0.75 ± 0.±5
max
(0.020 ± 0.008)
(0.024 ± 0.008)
(0.0±0 ± 0.014)
(0.0±0 ± 0.014)
(0.0±0 ± 0.014)
Voltage (V)
600 6±0 1000 600 6±0 1000 1500 2000 600 6±0 1000 1500 2000 ±000 600 6±0 1000 1500 2000 2500 ±000 4000 600 6±0 1000 1500 2000 2500 ±000 4000
Cap (pF)
.5 0R5
1.0 1R0
1.2 1R2
1.5 1R5
1.8 1R8
2.2 2R2
2.7 2R7
±.± ±R±
±.9 ±R9
4.7 4R7
5.6 5R6
6.8 6R8
8.2 8R2
10 100
12 120
15 150
18 180
22 220
27 270
±± ±±0
±9 ±90
47 470
56 560
68 680
82 820
100 101
120 121
150 151
180 181
220 221
270 271
±±0 ±±1
±90 ±91
470 471
560 561
680 681
750 751
820 821
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
X
X
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
X
X
C
C
C
C
C
C
C
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
X
X
C
C
C
C
C
C
C
C
C
C
C
C
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
C
C
C
C
C
C
E
E
E
E
E
E
E
E
E
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
M
M
M
M
C
C
E
E
E
E
E
E
E
E
E
E
E
E
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
M
M
M
C
C
C
C
E
E
E
E
E
E
E
E
E
E
E
E
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
D
D
D
C
C
C
C
E
E
E
E
E
E
E
E
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
M
M
M
C
C
C
C
E
E
E
E
E
E
E
E
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
F
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
F
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
F
C
C
C
C
C
C
C
C
C
C
C
C
E
E
F
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
F
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
F
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
E
E
E
E
E
E
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
C
C
C
C
C
C
C
C
C
C
E
M
M
M
M
M
M
M
M
M
M
M
M
C
C
C
E
D
D
D
D
D
D
D
D
D
C
C
C
C
C
E
E
E
E
E
E
E
E
F
M
M
M
M
M
M
M
M
M
C
C
C
C
C
E
E
E
E
E
E
E
E
E
E
E
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
G
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
E
E
E
E
E
E
E
E
E
F
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
E
E
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
F
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
F
C
C
C
C
C
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
E
F
F
G
G
G
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
F
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
F
E
E
E
E
E
E
E
E
E
F
F
F
F
G
G
F
C
F
F
F
F
F
F
F
F
E
F
F
F
F
F
F
E
F
F
F
F
F
F
E
F
F
F
F
F
F
E
F
F
F
F
F
F
F
F
E
F
F
F
F
F
F
F
F
E
F
F
F
F
F
F
F
F
E
F
F
E
E
E
F
F
F
G
G
G
G
G
G
G
G
E
G
G
F
F
F
F
F
E
F
E
E
E
F
F
1000 102
1200 122
E
F
F
F
E
F
F
F
F
E
F
1500 152
F
G
G
F
F
F
1800 182
G
G
G
G
G
F
F
F
F
2200 222
F
E
E
F
G
G
2700 272
F
±±00 ±±2
F
±900 ±92
F
4700 472
G
G
5600 562
6800 682
8200 822
E
F
Cap (µF) 0.010 10±
0.012 12±
0.015 15±
0.018 18±
0.022 22±
0.027 27±
0.0±± ±±±
0.047 47±
0.056 56±
0.068 68±
0.100 104
0.12 124
0.15 154
0.18 184
0.22 224
0.27 274
0.±± ±±4
Voltage (V)
Case Size
F
G
F
G
G
F
G
G
F
G
G
600 6±0 1000 600 6±0 1000 1500 2000 600 6±0 1000 1500 2000 ±000 600 6±0 1000 1500 2000 2500 ±000 4000 600 6±0 1000 1500 2000 2500 ±000 4000
0805 1206 1210 1808 1812
NOTE: Contact factory for non-specified capacitance values
Letter
Max.
A
C
E
F
G
X
7
0.81±
1.448
1.80±4
(0.071)
2.2098
(0.087)
2.794
0.940
(0.0±7)
±.±0
Thickness (0.0±2)
(0.057)
(0.110)
(0.1±0)
101±17
96
High Voltage MLC Chips
For 600V to 5000V Applications
NP0 (C0G) CAPACITANCE RANGE – PREFERRED SIZES ARE SHADED
Case Size
Soldering
1825
2220
2225
3640
Reflow Only
Reflow Only
Reflow Only
Reflow Only
(L) Length
mm
4.60 ± 0.50
5.70 ± 0.50
5.70 ± 0.50
9.14 ± 0.25
(in.)
(0.181 ± 0.020)
(0.224 ± 0.020)
(0.225 ± 0.010)
(0.±60 ± 0.010)
(W) Width
mm
(in.)
6.±0 ± 0.40
5.00 ± 0.40
6.±0 ± 0.40
10.2 ± 0.25
(0.248 ± 0.016)
(0.197 ± 0.016)
(0.250 ± 0.010)
(0.400 ± 0.010)
(T) Thickness mm
(in.)
(t) Terminal
±.40
(0.1±4)
0.75 ± 0.±5
±.40
(0.1±4)
0.85 ± 0.±5
±.40
(0.100)
0.85 ± 0.±5
2.54
(0.100)
0.76 (0.0±0)
1.52 (0.060)
min
max
(0.0±0 ± 0.014)
(0.0±± ± 0.014)
(0.0±± ± 0.014)
Voltage (V)
600 6±0 1000 1500 2000 2500 ±000 4000 600 6±0 1000 1500 2000 2500 ±000 4000 5000 600 6±0 1000 1500 2000 2500 ±000 4000 5000 600 6±0 1000 1500 2000 2500 ±000 4000 5000
Cap (pF) 1.5 1R5
1.8 1R8
2.2 2R2
2.7 2R7
±.± ±R±
±.9 ±R9
4.7 4R7
5.6 5R6
6.8 6R8
8.2 8R2
10 100
12 120
15 150
18 180
22 220
27 270
±± ±±0
±9 ±90
47 470
56 560
68 680
82 820
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
G
F
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
G
E
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
G
G
G
G
G
G
G
G
G
G
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
G
G
G
G
G
G
G
G
G
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
G
7
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
G
7
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
G
7
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
F
G
G
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
F
G
G
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
F
G
G
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
E
F
F
G
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
G
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
F
F
F
100 101
120 121
150 151
180 181
220 221
270 271
±±0 ±±1
±90 ±91
470 471
560 561
680 681
750 751
820 821
1000 102
1200 122
1500 152
1800 182
2200 222
2700 272
±±00 ±±2
±900 ±92
4700 472
5600 562
6800 682
8200 822
Cap (µF)0.010 10±
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
F
F
F
G
G
G
F
F
F
G
G
G
F
F
F
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
F
F
F
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
F
F
G
G
G
G
G
G
G
G
0.012 12±
0.015 15±
0.018 18±
0.022 22±
0.027 227
0.0±± ±±±
0.0±9 ±9±
0.047 47±
0.056 56±
0.068 68±
0.100 104
Voltage (V)
E
E
E
E
F
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
F
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
600 6±0 1000 1500 2000 2500 ±000 4000 600 6±0 1000 1500 2000 2500 ±000 4000 5000 600 6±0 1000 1500 2000 2500 ±000 4000 5000 600 6±0 1000 1500 2000 2500 ±000 4000 5000
Case Size
1825
2220
2225
3640
NOTE: Contact factory for non-specified capacitance values
Letter
Max.
A
C
E
F
G
2.794
(0.110)
X
7
0.81±
1.448
1.80±4
(0.071)
2.2098
(0.087)
0.940
(0.0±7)
±.±0
Thickness (0.0±2)
(0.057)
(0.1±0)
101±17
97
High Voltage MLC Chips
For 600V to 5000V Applications
X7RꢀDielectric
Performance Characteristics
Capacitance Range
10 pF to 0.82 µF (25/C, 1.0 ±0.2 Vrms at 1kHz)
Capacitance Tolerances
Dissipation Factor
Operating Temperature Range
Temperature Characteristic
Voltage Ratings
Insulation Resistance (+25/C, at 500 VDC)
Insulation Resistance (+125/C, at 500 VDC)
Dielectric Strength
±10ꢁ% ±20ꢁ% +80ꢁ, -20ꢁ
2.5ꢁ max. (+25/C, 1.0 ±0.2 Vrms, 1kHz)
-55/C to +125/C
±15ꢁ (0 VDC)
600, 6±0, 1000, 1500, 2000, 2500, ±000, 4000 & 5000 VDC (+125/C)
100K MΩ min. or 1000 MΩ - µF min., whichever is less
10K MΩ min. or 100 MΩ - µF min., whichever is less
Minimum 120ꢁ rated voltage for 5 seconds at 50 mA max. current
X7R CAPACITANCE RANGE – PREFERRED SIZES ARE SHADED
Case Size
Soldering
0805
1206
1210
1808
1812
ReflowꢀWave
ReflowꢀWave
Reflow Only
Reflow Only
Reflow Only
(L) Length
mm
2.10 ± 0.20
±.±0 ± 0.±0
±.±0 ± 0.40
4.60 ± 0.50
4.60 ± 0.50
(in.)
(0.085 ± 0.008)
(0.1±0 ± 0.012)
(0.1±0 ± 0.016)
(0.181 ± 0.020)
(0.177 ± 0.012)
(W) Width
mm
(in.)
mm
(in.)
1.25 ± 0.20
1.60 +0.±0ꢀ-0.10
2.50 ± 0.±0
2.00 ± 0.20
±.20 ± 0.±0
(0.049 ± 0.008)
(0.06± +0.012ꢀ-0.004)
(0.098 ± 0.012)
(0.079 ± 0.008)
(0.126 ± 0.008)
(T) Thickness
(t) Terminal
1.±5
(0.05±)
1.80
(0.071)
2.80
(0.110)
2.20
(0.087)
2.80
(0.100)
min
max
0.50 ± 0.20
(0.020 ± 0.008)
0.60 ± 0.20
(0.024 ± 0.008)
0.75 ± 0.±5
(0.0±0 ± 0.014)
0.75 ± 0.±5
(0.0±0 ± 0.014)
0.75 ± 0.±5
(0.0±0 ± 0.014)
Voltage (V)
Cap (pF)
600
6±0 1000 600
6±0 1000 1500 2000 600
6±0 1000 1500 2000 600
6±0 1000 1500 2000 2500 ±000 4000 600
6±0 1000 1500 2000 2500 ±000 4000
100 101
120 121
150 151
180 181
220 221
270 271
±±0 ±±1
±90 ±91
470 471
560 561
680 681
750 751
820 821
1000 102
1200 122
1500 152
1800 182
2200 222
2700 272
±±00 ±±2
±900 ±92
4700 472
5600 562
6800 682
8200 822
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
C
C
C
C
C
C
C
C
C
C
C
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
X
X
X
X
X
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
E
E
E
E
E
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
F
F
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
F
F
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
F
F
F
F
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
F
F
G
G
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
F
F
F
F
F
F
F
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
F
F
F
F
F
F
F
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
E
E
E
E
E
E
E
E
E
E
E
F
F
F
F
F
F
F
E
E
E
E
E
E
E
E
E
E
E
F
F
F
E
E
E
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
F
F
G
G
E
E
F
E
E
F
F
F
F
F
F
F
F
F
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
F
F
F
F
G
G
G
G
G
G
G
G
G
Cap (µF) 0.010 10±
0.015 15±
0.018 18±
0.022 22±
0.027 27±
0.0±± ±±±
0.0±9 ±9±
0.047 47±
0.056 56±
0.068 68±
0.082 82±
0.100 104
0.150 154
0.220 224
0.270 274
0.±±0 ±±4
0.±90 ±94
0.470 474
0.560 564
0.680 684
0.820 824
1.000 105
Voltage (V)
F
G
G
G
G
G
G
600
6±0 1000 600
6±0 1000 1500 2000 600
6±0 1000 1500 2000 600
6±0 1000 1500 2000 2500 ±000 4000 600
6±0 1000 1500 2000 2500 ±000 4000
Case Size
0805
1206
1210
1808
1812
NOTE: Contact factory for non-specified capacitance values
Letter
Max.
A
C
E
F
G
2.794
(0.110)
X
7
0.81±
1.448
1.80±4
(0.071)
2.2098
(0.087)
0.940
(0.0±7)
±.±0
Thickness (0.0±2)
(0.057)
(0.1±0)
101±17
98
High Voltage MLC Chips
For 600V to 5000V Applications
X7R CAPACITANCE RANGE
PREFERRED SIZES ARE SHADED
Case Size
Soldering
1825
2220
2225
3640
Reflow Only
Reflow Only
Reflow Only
Reflow Only
(L) Length
mm
4.60 ± 0.50
5.70 ± 0.50
5.70 ± 0.50
9.14 ± 0.25
(in.)
(0.181 ± 0.020)
(0.224 ± 0.020)
(0.225 ± 0.010)
(0.±60 ± 0.010)
(W) Width
mm
(in.)
6.±0 ± 0.40
5.00 ± 0.40
6.±0 ± 0.40
10.2 ± 0.25
(0.248 ± 0.016)
(0.197 ± 0.016)
(0.250 ± 0.010)
(0.400 ± 0.010)
(T) Thickness mm
(in.)
(t) Terminal
±.40
(0.1±4)
0.75 ± 0.±5
±.40
(0.1±4)
0.85 ± 0.±5
±.40
(0.100)
2.54
(0.100)
0.76 (0.0±0)
1.52 (0.060)
min
0.85 ± 0.±5
(0.0±± ± 0.014)
max
(0.0±0 ± 0.014)
(0.0±± ± 0.014)
Voltage (V)
600 6±0 1000 1500 2000 2500 ±000 4000 600 6±0 1000 1500 2000 2500 ±000 4000 5000 600 6±0 1000 1500 2000 2500 ±000 4000 5000 600 6±0 1000 1500 2000 2500 ±000 4000 5000
Cap (pF) 100 101
120 121
150 151
180 181
220 221
270 271
±±0 ±±1
±90 ±91
470 471
560 561
680 681
750 751
820 821
1000 102
1200 122
1500 152
1800 182
2200 222
2700 272
±±00 ±±2
±900 ±92
4700 472
5600 562
6800 682
8200 822
Cap (µF)0.010 10±
0.015 15±
0.018 18±
0.022 22±
0.027 27±
0.0±± ±±±
0.0±9 ±9±
0.047 47±
0.056 56±
0.068 68±
0.082 82±
0.100 104
0.150 154
0.220 224
0.270 274
0.±±0 ±±4
0.±90 ±94
0.470 474
0.560 564
0.680 684
0.820 824
1.000 105
Voltage (V)
Case Size
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
G
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
G
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
G
G
G
F
F
F
F
F
F
F
F
F
F
F
F
F
F
G
G
G
G
F
F
F
F
F
F
F
F
F
F
G
G
G
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
G
G
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
G
G
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
G
G
G
G
G
F
F
F
F
F
F
G
G
G
G
G
G
G
G
G
G
G
G
G
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
G
G
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
G
G
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
G
G
G
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
G
G
G
G
G
F
F
F
F
F
F
F
F
F
F
F
F
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
G
G
G
G
G
G
G
G
G
P
G
G
G
G
G
G
G
F
F
G
G
G
G
G
F
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
F
F
G
G
G
G
G
G
G
G
G
600 6±0 1000 1500 2000 2500 ±000 4000 600 6±0 1000 1500 2000 2500 ±000 4000 5000 600 6±0 1000 1500 2000 2500 ±000 4000 5000 600 6±0 1000 1500 2000 2500 ±000 4000 5000
1825
2220
2225
3640
NOTE: Contact factory for non-specified capacitance values
Letter
Max.
A
C
E
F
G
2.794
(0.110)
X
7
0.81±
1.448
1.80±4
(0.071)
2.2098
(0.087)
0.940
(0.0±7)
±.±0
Thickness (0.0±2)
(0.057)
(0.1±0)
101±17
99
High Voltage MLC Chips
Tin/Lead Termination “B”
For 600V to 5000V Applications
AVX Corporation will support those customers for commercial and military Multi-
layer Ceramic Capacitors with a termination consisting of 5ꢀ minimum lead. This
termination is indicated by the use of a “B” in the 12th position of the AVX Cata-
log Part Number. This fulfills AVX’s commitment to providing a full range of prod-
ucts to our customers. AVX has provided in the following pages, a full range of
values that we are offering in this “B” termination.
Larger physical sizes than normally encountered chips are used to make high volt-
age MLC chip product. Special precautions must be taken in applying these chips
in surface mount assemblies. The temperature gradient during heating or cooling
cycles should not exceed 4ºC per second. The preheat temperature must be
within 50ºC of the peak temperature reached by the ceramic bodies through the
soldering process. Chip sizes 1210 and larger should be reflow soldered only. Ca-
pacitors may require protective surface coating to prevent external arcing.
For 1825, 2225 and 3640 sizes, AVX offers leaded version in either thru-hole or
SMT configurations (for details see section on high voltage leaded MLC chips).
NEW 630V RANGE
HOW TO ORDER
LD08
A
A
271
K
A
B
1
A
AVX
Voltage
600V/630V = C
1000V = A
1500V = S
2000V = G
2500V = W
3000V = H
4000V = J
Temperature Capacitance Code
Capacitance
Tolerance
Test
Termination
Packaging Special Code
Style
Coefficient
C0G = A
X7R = C
(2 significant digits
+ no. of zeros)
Examples:
Level
B = 5ꢀ Min Pb
2 = 7" Reel** A = Standard
LD05 - 0805
LD06 - 1206
LD10 - 1210
LD08 - 1808
LD12 - 1812
LD13 - 1825
LD20 - 2220
LD14 - 2225
LD40 - 3640
***
C0G: J = 5ꢀ
A = Standard X = FLEXITERM® 4 = 13" Reel
K = 10ꢀ
M = 20ꢀ
X7R: K = 10ꢀ
M = 20ꢀ
with 5ꢀ min.
Pb*
10 pF = 100
100 pF = 101
1,000 pF = 102
22,000 pF = 223
220,000 pF = 224
1 μF =105
Z = +80ꢀ, -20ꢀ
5000V = K
Notes: Capacitors with X7R dielectrics are not intended for applications across AC supply mains or AC line filtering with polarity reversal. Contact plant for recommendations.
Contact factory for availability of Termination and Tolerance options for Specific Part Numbers.
*
FLEXITERM is not available in the LD40 Style
Not RoHS Compliant
** The LD40 Style is not available on 7" Reels.
*** AVX offers nonstandard chip sizes. Contact factory for details.
DIMENSIONS
millimeters (inches)
SIZE
LD05 (0805)
LD06 (1206)
LD10* (1210) LD08* (1808) LD12* (1812) LD13* (1825) LD20* (2220) LD14* (2225) LD40* (3640)
(L) Length
2.10 0.20
3.30 0.30
3.30 0.40 4.60 0.50 4.60 0.50 4.60 0.50 5.70 0.50 5.70 0.50 9.14 0.25
(0.083 0.008) (0.130 0.012) (0.130 0.016) (0.181 0.020) (0.181 0.020) (0.181 0.020) (0.224 0.020) (0.224 0.020) (0.360 0.010)
+0.30
(W) Width
1.25 0.20
(0.049 0.008) (0.063
1.60
2.50 0.30
2.00 0.20
3.20 0.30
6.30 0.40
5.00 0.40
6.30 0.40
10.2 0.25
-0.10
+0.012
-0.004
)
(0.098 0.012) (0.079 0.008) (0.126 0.012) (0.248 0.016) (0.197 0.016) (0.248 0.016) (0.400 0.010)
(T) Thickness
Max.
1.35
(0.053)
1.80
(0.071)
0.60 0.20
2.80
(0.110)
2.20
(0.087)
2.80
(0.110)
3.40
(0.134)
3.40
(0.134)
3.40
(0.134)
2.54
(0.100)
(t) terminal min.
0.50 0.20
0.75 0.35
0.75 0.35
0.75 0.35
0.75 0.35
0.85 0.35
0.85 0.35
0.76 (0.030)
max. (0.020 0.008) (0.024 0.008) (0.030 0.014) (0.030 0.014) (0.030 0.014) (0.030 0.014) (0.033 0.014) (0.033 0.014) 1.52 (0.060)
* Reflow soldering only.
Performance of SMPS capacitors can be simulated by downloading SpiCalci software program - http://www.avx.com/SpiApps/default.asp#spicalci
Custom values, ratings and configurations are also available.
011916
100
High Voltage MLC Chips
Tin/Lead Termination “B”
For 600V to 5000V Applications
C0G Dielectric
Performance Characteristics
Capacitance Range
10 pF to 0.047 μF
(25ꢁC, 1.0 0.2 Vrms at 1kHz, for ≤ 1000 pF use 1 MHz)
Capacitance Tolerances
5ꢀ, 10ꢀ, 20ꢀ
Dissipation Factor
0.1ꢀ max. (+25ꢁC, 1.0 0.2 Vrms, 1kHz, for ≤ 1000 pF use 1 MHz)
-55ꢁC to +125ꢁC
Operating Temperature Range
Temperature Characteristic
Voltage Ratings
Insulation Resistance (+25ꢁC, at 500 VDC)
Insulation Resistance (+125ꢁC, at 500 VDC)
Dielectric Strength
0
30 ppm/ꢁC (0 VDC)
600, 630, 1000, 1500, 2000, 2500, 3000, 4000 & 5000 VDC (+125ꢁC)
100K MΩ min. or 1000 MΩ - μF min., whichever is less
10K MΩ min. or 100 MΩ - μF min., whichever is less
Minimum 120ꢀ rated voltage for 5 seconds at 50 mA max. current
HIGH VOLTAGE C0G CAPACITANCE VALUES
VOLTAGE LD05 (0805) LD06 (1206) LD10 (1210) LD08 (1808) LD12 (1812) LD13 (1825) LD20 (2220) LD14 (2225) LD40 (3640)
min.
max.
min.
max.
min.
max.
min.
max.
min.
max.
min.
max.
min.
max.
min.
max.
10pF
330pF
10pF
180pF
—
10 pF
1200 pF
10 pF
560 pF
10 pF
270 pF
10 pF
120 pF
—
100 pF
2700 pF
10 pF
1500 pF
10 pF
680 pF
10 pF
270 pF
—
100 pF
3300 pF
100 pF
2200 pF
10 pF
820 pF
10 pF
330 pF
10 pF
180 pF
10 pF
120 pF
10 pF
47 pF
—
100 pF
5600 pF
100 pF
3300 pF
10 pF
1000 pF
0.012 μF
100 pF
8200 pF
100 pF
4700 pF
100 pF
1800 pF
10 pF
1000 pF
0.012 μF
1000 pF
0.010 μF
100 pF
4700 pF
100 pF
2200 pF
100 pF
1500 pF
10 pF
1000 pF
0.018 μF
1000 pF
0.010 μF
100 pF
5600 pF
100 pF
2700 pF
100 pF
1800 pF
10 pF
1000 pF
0.047 μF
1000 pF
0.022 μF
100 pF
600/630
1000
1500
2000
2500
3000
4000
5000
—
1800 pF
10 pF
0.010 μF
100 pF
—
—
1000 pF
10 pF
6800 pF
100 pF
—
—
—
—
470 pF
10 pF
1200 pF
10 pF
3900 pF
100 pF
—
—
—
—
—
—
330 pF
10 pF
820 pF
10 pF
1000 pF
10 pF
1200 pF
10 pF
2700 pF
100 pF
—
—
—
—
—
—
150 pF
—
330 pF
—
470 pF
10 pF
220 pF
560 pF
10 pF
270 pF
1200 pF
10 pF
—
—
—
—
—
—
—
—
—
820 pF
X7R Dielectric
Performance Characteristics
Capacitance Range
Capacitance Tolerances
Dissipation Factor
Operating Temperature Range
Temperature Characteristic
Voltage Ratings
Insulation Resistance (+25ꢁC, at 500 VDC)
Insulation Resistance (+125ꢁC, at 500 VDC)
Dielectric Strength
10 pF to 0.56 μF (25ꢁC, 1.0 0.2 Vrms at 1kHz)
10ꢀ; 20ꢀ; +80ꢀ, -20ꢀ
2.5ꢀ max. (+25ꢁC, 1.0 0.2 Vrms, 1kHz)
-55ꢁC to +125ꢁC
15ꢀ (0 VDC)
600, 630, 1000, 1500, 2000, 2500, 3000, 4000 & 5000 VDC (+125ꢁC)
100K MΩ min. or 1000 MΩ - μF min., whichever is less
10K MΩ min. or 100 MΩ - μF min., whichever is less
Minimum 120ꢀ rated voltage for 5 seconds at 50 mA max. current
HIGH VOLTAGE X7R MAXIMUM CAPACITANCE VALUES
VOLTAGE
0805
1206
1210
1808
1812
1825
2220
2225
3640
min.
100pF
6800pF
100pF
1500pF
—
1000 pF
0.022 μF
100 pF
6800 pF
100 pF
2700 pF
10 pF
1500 pF
—
1000 pF
0.056 μF
1000 pF
0.015 μF
100 pF
5600 pF
100 pF
3300 pF
—
1000 pF
0.068 μF
1000 pF
0.018 μF
100 pF
6800 pF
100 pF
3300 pF
10 pF
1000 pF
0.120 μF
1000 pF
0.039 μF
100 pF
0.015 μF
100 pF
8200 pF
10 pF
0.010 μF
0.270 μF
1000 pF
0.100 μF
1000 pF
0.056 μF
100 pF
0.022 μF
100 pF
0.015 μF
100 pF
0.010 μF
—
0.010 μF
0.270 μF
1000 pF
0.120 μF
1000 pF
0.056 μF
1000 pF
0.027 μF
100 pF
0.018 μF
100 pF
0.012 μF
—
0.010 μF
0.330 μF
1000 pF
0.150 μF
1000 pF
0.068 μF
1000 pF
0.033 μF
100 pF
0.022 μF
100 pF
0.015 μF
—
0.010 μF
0.560 μF
0.010 μF
0.220 μF
1000 pF
0.100 μF
1000 pF
0.027 μF
1000 pF
0.022 μF
1000 pF
0.018 μF
100 pF
600/630
1000
1500
2000
2500
3000
4000
5000
max.
min.
max.
min.
max.
min.
max.
min.
max.
min.
max.
min.
max.
min.
max.
—
—
—
—
—
—
—
2200 pF
10 pF
5600 pF
10 pF
—
—
—
—
—
—
1800 pF
—
3900 pF
—
—
—
—
—
—
—
—
—
—
—
—
6800 pF
100 pF
3300 pF
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
011916
101
High Voltage MLC Chips FLEXITERM®
For 600V to 5000V Applications
High value, low leakage and small size are difficult parameters to obtain in ca-
pacitors for high voltage systems. AVX special high voltage MLC chips capacitors
meet these performance characteristics and are designed for applications such
as snubbers in high frequency power converters, resonators in SMPS, and high
voltage coupling/DC blocking. These high voltage chip designs exhibit low ESRs
at high frequencies.
To make high voltage chips, larger physical sizes than are normally encountered
are necessary. These larger sizes require that special precautions be taken in
applying these chips in surface mount assemblies. In response to this, and to fol-
low from the success of the FLEXITERM® range of low voltage parts, AVX is de-
lighted to offer a FLEXITERM® high voltage range of capacitors, FLEXITERM®.
The FLEXITERM® layer is designed to enhance the mechanical flexure and tem-
perature cycling performance of a standard ceramic capacitor, giving customers
a solution where board flexure or temperature cycle damage are concerns.
HOW TO ORDER
1808
A
C
272
K
A
Z
1
A
AVX
Style
0805
1206
1210
1808
1812
1825
2220
2225
***
Voltage
Temperature Capacitance Code Capacitance
Test Level
Termination*
Z = FLEXITERM®
100ꢀ Tin
Packaging
Special
Code
600V/630V = C Coefficient
(2 significant digits
+ no. of zeros)
Examples:
Tolerance
C0G: J = 5ꢀ
K = 10ꢀ
2 = 7" Reel
1000V = A
1500V = S
2000V = G
2500V = W
3000V = H
4000V = J
5000V = K
C0G = A
X7R = C
4 = 13" Reel A = Standard
(RoHS Compliant)
10 pF = 100
M = 20ꢀ
100 pF = 101 X7R: K = 10ꢀ
1,000 pF = 102
22,000 pF = 223
220,000 pF = 224
1 μF =105
M = 20ꢀ
Z = +80ꢀ,
-20ꢀ
Notes: Capacitors with X7R dielectrics are not intended for applications across AC supply mains or AC line filtering with polarity reversal. Contact plant for recommendations.
Contact factory for availability of Termination and Tolerance options for Specific Part Numbers.
*** AVX offers nonstandard chip sizes. Contact factory for details.
DIMENSIONS
millimeters (inches)
SIZE
0805
1206
1210*
1808*
1812*
1825*
2220*
2225*
(L) Length
2.10 0.20
(0.083 0.008)
3.30 0.30
(0.130 0.012)
3.30 0.40
(0.130 0.016)
4.60 0.50
(0.181 0.020)
4.60 0.50
(0.181 0.020)
4.60 0.50
(0.181 0.020)
5.70 0.50
(0.224 0.020)
5.70 0.50
(0.224 0.020)
+0.30
(W) Width
1.25 0.20
(0.049 0.008)
1.60
(0.063
2.50 0.30
(0.098 0.012)
2.00 0.20
(0.079 0.008)
3.20 0.30
(0.126 0.012)
6.30 0.40
(0.248 0.016)
5.00 0.40
(0.197 0.016)
6.30 0.40
(0.248 0.016)
-0.10
+0.012
-0.004
)
(T) Thickness
Max.
1.35
(0.053)
1.80
(0.071)
2.80
(0.110)
2.20
(0.087)
2.80
(0.110)
3.40
(0.134)
3.40
(0.134)
3.40
(0.134)
(t) terminal min.
0.50 0.20
0.60 0.20
(0.024 0.008)
0.75 0.35
(0.030 0.014)
0.75 0.35
(0.030 0.014)
0.75 0.35
(0.030 0.014)
0.75 0.35
(0.030 0.014)
0.85 0.35
(0.033 0.014)
0.85 0.35
(0.033 0.014)
max. (0.020 0.008)
*Reflow Soldering Only
Performance of SMPS capacitors can be simulated by downloading SpiCalci software program - http://www.avx.com/SpiApps/default.asp#spicalci
Custom values, ratings and configurations are also available.
011916
102
High Voltage MLC Chips FLEXITERM®
For 600V to 5000V Applications
NP0 (C0G) Dielectric
Performance Characteristics
Capacitance Range
10 pF to 0.100 μF (+25ꢁC, 1.0 0.2 Vrms, 1kHz)
5ꢀ, 10ꢀ, 20ꢀ
0.1ꢀ max. (+25ꢁC, 1.0 0.2 Vrms, 1kHz)
-55ꢁC to +125ꢁC
Capacitance Tolerances
Dissipation Factor
Operating Temperature Range
Temperature Characteristic
Voltage Ratings
Insulation Resistance (+25ꢁC, at 500 VDC)
Insulation Resistance (+125ꢁC, at 500 VDC)
Dielectric Strength
0
30 ppm/ꢁC (0 VDC)
600, 630, 1000, 1500, 2000, 2500, 3000, 4000 & 5000 VDC (+125ꢁC)
100K MΩ min. or 1000 MΩ - μF min., whichever is less
10K MΩ min. or 100 MΩ - μF min., whichever is less
Minimum 120ꢀ rated voltage for 5 seconds at 50 mA max. current
NP0 (C0G) CAPACITANCE RANGE
PREFERRED SIZES ARE SHADED
Case Size
0805
1206
1210
1808
1812
Soldering
Reflow/Wave
Reflow/Wave
Reflow Only
Reflow Only
Reflow Only
(L) Length
(W) Width
mm
2.10 0.20
3.30 0.30
3.30 0.40
4.60 0.50
4.60 0.50
(in.)
(0.083 0.008)
1.25 0.20
(0.049 0.008)
(0.130 0.012)
1.60 +0.30/-0.10
(0.063 +0.012/-0.004)
(0.130 0.016)
2.50 0.30
(0.098 0.012)
(0.181 0.020)
2.00 0.20
(0.079 0.008)
(0.181 0.020)
3.20 0.30
(0.126 0.012)
mm
(in.)
(T) Thickness
(t) Terminal
mm
(in.)
min
max
1.35
1.80
2.80
2.20
2.80
(0.053)
(0.071)
(0.110)
(0.087)
(0.110)
0.50 0.20
(0.020 0.008)
0.60 0.20
(0.024 0.008)
0.75 0.35
(0.030 0.014)
0.75 0.35
(0.030 0.014)
0.75 0.35
(0.030 0.014)
Voltage (V)
Cap (pF)
600
630 1000 600
630 1000 1500 2000 600
630 1000 1500 2000 600
630 1000 1500 2000 2500 3000 4000 600
630 1000 1500 2000 2500 3000 4000
1.5 1R5
1.8 1R8
2.2 2R2
2.7 2R7
3.3 3R3
3.9 3R9
4.7 4R7
5.6 5R6
6.8 6R8
8.2 8R2
10 100
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
X
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
C
C
C
C
C
C
E
E
E
E
E
E
E
E
E
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
C
C
C
C
C
C
E
E
E
E
E
E
E
E
E
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
M
M
M
C
C
C
C
E
E
E
E
E
E
E
E
E
E
E
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
D
D
D
C
C
C
C
E
E
E
E
E
E
E
E
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
D
D
D
C
C
C
C
E
E
E
E
E
E
E
E
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
F
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
F
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
F
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
F
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
F
A
A
A
A
A
A
A
A
A
A
A
X
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
E
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
E
D
D
D
D
D
D
D
D
D
D
D
D
C
C
C
E
E
E
E
E
E
E
E
E
D
D
D
D
D
D
D
D
D
C
C
C
C
C
E
E
E
E
E
E
E
E
F
D
D
D
D
D
D
D
D
D
C
C
C
C
C
E
E
E
E
E
E
E
E
F
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
E
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
E
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
E
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
E
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
F
F
F
F
F
F
F
F
F
E
E
F
F
G
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
F
F
F
F
F
F
F
F
E
F
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
F
F
F
F
F
F
F
F
E
F
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
F
F
F
F
F
F
F
G
G
G
G
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
F
F
F
F
F
F
F
G
G
G
G
E
E
E
E
E
E
E
E
E
F
F
F
F
G
G
12 120
15 150
18 180
22 220
27 270
33 330
39 390
47 470
56 560
68 680
82 820
100 101
120 121
150 151
180 181
220 221
270 271
330 331
390 391
470 471
560 561
680 681
750 751
820 821
1000 102
1200 122
1500 152
1800 182
2200 222
2700 272
3300 332
3900 392
4700 472
5600 562
6800 682
8200 822
X
X
X
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
G
G
G
G
F
F
F
E
E
E
G
G
F
F
F
E
E
E
E
E
E
E
E
E
E
F
E
F
F
G
G
F
G
G
E
E
E
E
E
E
F
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
Cap (μF) 0.010 103
0.012 123
0.015 153
0.018 183
0.022 223
0.033 333
0.047 473
0.056 563
0.068 683
0.100 104
Voltage (V)
E
E
F
F
G
G
G
G
600
630 1000 600
630 1000 1500 2000 600
630 1000 1500 2000 600
630 1000 1500 2000 2500 3000 4000 600
630 1000 1500 2000 2500 3000 4000
Case Size
0805
1206
1210
1808
1812
011916
103
High Voltage MLC Chips FLEXITERM®
For 600V to 5000V Applications
NP0 (C0G) CAPACITANCE RANGE
PREFERRED SIZES ARE SHADED
Case Size
Soldering
1825
2220
2225
Reflow Only
Reflow Only
Reflow Only
(L) Length
mm
4.60 0.50
5.70 0.50
5.72 0.25
(in.)
(0.181 0.020)
(0.224 0.020)
(0.225 0.010)
(W) Width
mm
(in.)
6.30 0.40
(0.248 0.016)
5.00 0.40
(0.197 0.016)
6.35 0.25
(0.250 0.010)
(T) Thickness mm
(in.)
3.40
(0.134)
3.40
(0.134)
2.54
(0.100)
(t) Terminal
min
max
0.75 0.35
(0.030 0.014)
0.85 0.35
(0.033 0.014)
0.85 0.35
Voltage (V)
600 630 1000 1500 2000 2500 3000 4000 600 630 1000 1500 2000 2500 3000 4000 5000 600 630 1000 1500 2000 2500 3000 4000 5000
Cap (pF) 1.5 1R5
1.8 1R8
2.2 2R2
2.7 2R7
3.3 3R3
3.9 3R9
4.7 4R7
5.6 5R6
6.8 6R8
8.2 8R2
10 100
12 120
15 150
18 180
22 220
27 270
33 330
39 390
47 470
56 560
68 680
82 820
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
E
E
E
E
E
E
E
E
F
F
F
F
F
F
F
F
F
F
F
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
G
G
G
G
G
G
G
G
G
G
F
F
F
100 101
120 121
150 151
180 181
220 221
270 271
330 331
390 391
470 471
560 561
680 681
750 751
820 821
1000 102
1200 122
1500 152
1800 182
2200 222
2700 272
3300 332
3900 392
4700 472
5600 562
6800 682
8200 822
Cap (μF) 0.010 103
G
G
G
G
G
G
G
G
G
G
F
F
F
G
G
G
F
F
F
G
G
G
F
F
F
G
G
G
F
F
F
G
G
G
E
F
F
F
G
F
F
F
F
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
F
F
G
G
G
G
G
G
G
G
F
F
G
G
F
F
G
G
F
F
G
G
F
G
F
G
F
G
F
G
F
G
F
G
0.012 123
0.015 153
0.018 183
0.022 223
0.033 333
0.047 473
0.056 563
0.068 683
0.100 104
Voltage (V)
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
600 630 1000 1500 2000 2500 3000 4000 600 630 1000 1500 2000 2500 3000 4000 5000 600 630 1000 1500 2000 2500 3000 4000 5000
Case Size
1825
2220
2225
NOTE: Contact factory for non-specified capacitance values
Letter
Max.
Thickness (0.032)
A
0.813
C
1.448
(0.057)
E
F
G
X
1.8034
(0.071)
2.2098
(0.087)
2.794
(0.110)
0.940
(0.037)
011916
104
High Voltage MLC Chips FLEXITERM®
For 600V to 5000V Applications
X7R Dielectric
Performance Characteristics
Capacitance Range
Capacitance Tolerances
Dissipation Factor
Operating Temperature Range
Temperature Characteristic
Voltage Ratings
Insulation Resistance (+25ꢁC, at 500 VDC)
Insulation Resistance (+125ꢁC, at 500 VDC)
Dielectric Strength
10 pF to 0.82 μF (25ꢁC, 1.0 0.2 Vrms at 1kHz)
10ꢀ; 20ꢀ; +80ꢀ, -20ꢀ
2.5ꢀ max. (+25ꢁC, 1.0 0.2 Vrms, 1kHz)
-55ꢁC to +125ꢁC
15ꢀ (0 VDC)
600, 630, 1000, 1500, 2000, 2500, 3000, 4000 & 5000 VDC (+125ꢁC)
100K MΩ min. or 1000 MΩ - μF min., whichever is less
10K MΩ min. or 100 MΩ - μF min., whichever is less
Minimum 120ꢀ rated voltage for 5 seconds at 50 mA max. current
X7R CAPACITANCE RANGE
PREFERRED SIZES ARE SHADED
Case Size
Soldering
0805
1206
1210
1808
1812
Reflow/Wave
Reflow/Wave
Reflow Only
Reflow Only
Reflow Only
(L) Length
mm
2.10 0.20
3.30 0.30
3.30 0.40
4.60 0.50
4.60 0.50
(in.)
(0.083 0.008)
(0.130 0.012)
(0.130 0.016)
(0.181 0.020)
(0.181 0.020)
(W) Width
mm
(in.)
1.25 0.20
(0.049 0.008)
1.60 +0.30/-0.10
(0.063 +0.012/-0.004)
2.50 0.30
(0.098 0.012)
2.00 0.20
(0.079 0.008)
3.20 0.30
(0.126 0.012)
(T) Thickness
(t) Terminal
mm
(in.)
min
max
1.35
1.80
2.80
2.20
2.80
(0.053)
(0.071)
(0.110)
(0.087)
(0.110)
0.50 0.20
(0.020 0.008)
0.60 0.20
(0.024 0.008)
0.75 0.35
(0.030 0.014)
0.75 0.35
(0.030 0.014)
0.75 0.35
(0.030 0.014)
Voltage (V)
Cap (pF)
600
630 1000 600
630 1000 1500 2000 600
630 1000 1500 2000 600
630 1000 1500 2000 2500 3000 4000 600
630 1000 1500 2000 2500 3000 4000
100 101
120 121
150 151
180 181
220 221
270 271
330 331
390 391
470 471
560 561
680 681
750 751
820 821
1000 102
1200 122
1500 152
1800 182
2200 222
2700 272
3300 332
3900 392
4700 472
5600 562
6800 682
8200 822
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
C
C
C
C
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
E
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
F
F
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
F
F
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
F
F
F
F
F
F
F
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
F
F
F
F
F
F
F
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
E
E
E
E
E
E
E
E
E
E
E
F
F
F
F
F
F
F
E
E
E
E
E
E
E
E
E
E
E
F
F
F
E
E
E
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
E
E
E
E
F
F
F
F
F
F
F
F
F
F
G
G
G
G
G
G
G
G
G
G
G
G
G
G
F
F
G
G
G
F
F
F
F
G
G
G
G
G
G
G
G
G
Cap (μF) 0.010 103
0.015 153
0.018 183
0.022 223
0.027 273
0.033 333
0.039 393
0.047 473
0.056 563
0.068 683
0.082 823
0.100 104
0.150 154
0.220 224
0.270 274
0.330 334
0.390 394
0.470 474
0.560 564
0.680 684
0.820 824
1.000 105
Voltage (V)
F
E
E
G
G
G
G
G
G
E
E
E
E
E
E
F
F
F
F
F
F
G
G
G
G
600
630 1000 600
630 1000 1500 2000 600
630 1000 1500 2000 600
630 1000 1500 2000 2500 3000 4000 600
630 1000 1500 2000 2500 3000 4000
Case Size
0805
1206
1210
1808
1812
011916
105
High Voltage MLC Chips FLEXITERM®
For 600V to 5000V Applications
X7R CAPACITANCE RANGE
PREFERRED SIZES ARE SHADED
Case Size
1825
2220
2225
Soldering
Reflow Only
Reflow Only
Reflow Only
(L) Length
(W) Width
mm
4.60 0.50
5.70 0.50
5.72 0.25
(in.)
mm
(in.)
(0.181 0.020)
6.30 0.40
(0.248 0.016)
(0.224 0.020)
5.00 0.40
(0.197 0.016)
(0.225 0.010)
6.35 0.25
(0.250 0.010)
(T) Thickness mm
(in.)
3.40
(0.134)
3.40
(0.134)
2.54
(0.100)
(t) Terminal
min
max
0.75 0.35
(0.030 0.014)
0.85 0.35
(0.033 0.014)
0.85 0.35
Voltage (V)
600 630 1000 1500 2000 2500 3000 4000 600 630 1000 1500 2000 2500 3000 4000 5000 600 630 1000 1500 2000 2500 3000 4000 5000
Cap (pF) 100 101
120 121
150 151
180 181
220 221
270 271
330 331
390 391
470 471
560 561
680 681
750 751
820 821
1000 102
1200 122
1500 152
1800 182
2200 222
2700 272
3300 332
3900 392
4700 472
5600 562
6800 682
8200 822
Cap (μF) 0.010 103
0.015 153
0.018 183
0.022 223
0.027 273
0.033 333
0.039 393
0.047 473
0.056 563
0.068 683
0.082 823
0.100 104
0.150 154
0.220 224
0.270 274
0.330 334
0.390 394
0.470 474
0.560 564
0.680 684
0.820 824
1.000 105
Voltage (V)
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
G
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
G
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
G
G
G
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
G
G
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
G
G
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
G
G
G
G
G
F
F
F
F
F
F
G
G
G
G
G
G
G
G
G
G
G
G
G
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
G
G
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
G
G
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
G
G
G
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
G
G
G
G
G
G
G
G
G
P
G
G
G
G
G
G
G
G
G
G
G
G
G
G
F
F
G
G
G
G
G
F
F
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
F
F
F
F
G
G
G
G
G
G
G
G
G
G
G
G
G
G
600 630 1000 1500 2000 2500 3000 4000 600 630 1000 1500 2000 2500 3000 4000 5000 600 630 1000 1500 2000 2500 3000 4000 5000
Case Size
1825
2220
2225
NOTE: Contact factory for non-specified capacitance values
Letter
Max.
Thickness (0.032)
A
0.813
C
1.448
(0.057)
E
F
G
P
X
1.8034
(0.071)
2.2098
(0.087)
2.794
(0.110)
3.048
(0.120)
0.940
(0.037)
011916
106
High Voltage MLC Chip Capacitors
For 600V to 3000V Automotive Applications – AEC-Q200
Modern automotive electronics could require components capable to work with high
voltage (e.g. xenon lamp circuits or power converters in hybrid cars). AVX offer high
voltage ceramic capacitors qualified according to AEC-Q200 standard.
High value, low leakage and small size are difficult parameters to obtain in capacitors
for high voltage systems. AVX special high voltage MLC chip capacitors meet these
performance characteristics and are designed for applications such as snubbers in
high frequency power converters, resonators in SMPS, and high voltage coupling / dc
blocking. These high voltage chip designs exhibit low ESRs at high frequencies.
Due to high voltage nature, larger physical dimensions are necessary. These larger
sizes require special precautions to be taken in applying of MLC chips. The
temperature gradient during heating or cooling cycles should not exceed 4ºC per
second. The preheat temperature must be within 50ºC of the peak temperature
reached by the ceramic bodies through the soldering process. Chip sizes 1210 and
larger should be reflow soldered only. Capacitors may require protective surface
coating to prevent external arcing.
To improve mechanical and thermal resistance, AVX recommend to use flexible
terminations system - FLEXITERM®.
HOW TO ORDER
1210
C
C
223
K
4
T
1
A
AVX
Voltage
Dielectric Capacitance Code Capacitance Failure Rate
Termination
Packaging
Special
Code
Style C = 630V
C = X7R
(2 significant digits
+ no. of zeros)
e.g. 103 = 10nF
(223 = 22nF)
Tolerance
J = 5ꢀ
K = 10ꢀ
M = 20ꢀ
4 = Automotive T = Plated Ni/Sn 1 or 2 = 7" Reel
1206
1210
1808 G = 2000V
1812 W = 2500V
2220
A = 1000V
S = 1500V
Z = FLEXITERM®
A = Standard
3 or 4 = 13" Reel
H = 3000V
*AVX offers nonstandard case sizes. Contact factory for details.
Notes: Capacitors with X7R dielectrics are not intended for applications across AC supply mains or AC line filtering with polarity reversal.
Please contact AVX for recommendations.
CHIP DIMENSIONS DESCRIPTION (See capacitance range chart on page 109)
L
L = Length
W
W = Width
T = Thickness
t = Terminal
T
t
t
X7R DIELECTRIC PERFORMANCE CHARACTERISTICS
Parameter/Test
Specification Limits
Measuring Conditions
Operating Temperature Range
-55ꢁC to +125ꢁC
Temperature Cycle Chamber
Capacitance
Dissipation Factor
Capacitance Tolerance
within specified tolerance
2.5ꢀ max.
5ꢀ (J), 10ꢀ (K), 20ꢀ (M)
Freq.: 1kHz 10ꢀ
Voltage: 1.0Vrm s 0.2Vrms
T = +25ꢁC, V = 0Vdc
Temperature Characteristics
X7R = 15ꢀ
Vdc = 0V, T = (-55ꢁC to +125ꢁC)
T = +25ꢁC, V = 500Vdc
T = +125ꢁC, V = 500Vdc
(t ≥ 120 sec, I ≤ 50mA)
100GΩ min. or 1000MΩ • ꢂF min. (whichever is less)
10GΩ min. or 100MΩ • ꢂF min. (whichever is less)
Insulation Resistance
120ꢀ of rated voltage
t ≤ 5 sec, I ≤ 50mA
Dielectric Strength
No breakdown or visual defect
062216
107
High Voltage MLC Chip Capacitors
For 600V to 3000V Automotive Applications – AEC-Q200
X7R CAPACITANCE RANGE
PREFERRED SIZES ARE SHADED
Case Size
Soldering
1206
1210
1808
1812
2220
Reflow/Wave
Reflow Only
Reflow Only
Reflow Only
Reflow Only
(L) Length
mm
3.20 0.20
3.20 0.20
4.57 0.25
4.50 0.30
5.70 0.40
(in.)
(0.126 0.008)
(0.126 0.008)
(0.180 0.010)
(0.177 0.012)
(0.224 0.016)
(W) Width
mm
(in.)
1.60 0.20
(0.063 0.008)
2.50 0.20
(0.098 0.008)
2.03 0.25
(0.080 0.010)
3.20 0.20
(0.126 0.008)
5.00 0.40
(0.197 0.016)
(T) Thickness
(t) Terminal
mm
(in.)
min
max
1.52
1.70
2.03
2.54
3.30
(0.060)
(0.067)
(0.080)
(0.100)
(0.130)
0.25 (0.010)
0.75 (0.030)
0.25 (0.010)
0.75 (0.030)
0.25 (0.010)
1.02 (0.040)
0.25 (0.010)
1.02 (0.040)
0.25 (0.010)
1.02 (0.040)
Voltage (V)
630 1000 1500 2000 2500 630 1000 1500 2000 630 1000 1500 2000 2500 3000 630 1000 1500 2000 2500 3000 630 1000 1500 2000
Cap (pF)
100 101
120 121
150 151
180 181
220 221
270 271
330 331
390 391
470 471
560 561
680 681
820 821
1000 102
1200 122
1500 152
1800 182
2200 222
2700 272
3300 332
3900 392
4700 472
5600 562
6800 682
8200 822
0.01 103
0.012 123
0.015 153
0.018 183
0.022 223
0.027 273
0.033 333
0.039 393
0.047 473
0.056 563
0.068 683
0.082 823
0.100 104
0.120 124
0.150 154
Cap (μF)
Voltage (V)
630 1000 1500 2000 2500 630 1000 1500 2000 630 1000 1500 2000 2500 3000 630 1000 1500 2000 2500 3000 630 1000 1500 2000
Case Size
1206
1210
1808
1812
2220
NOTE: Contact factory for non-specified capacitance values
062216
108
MIL-PRF-55681/Chips
Part Number Example
CDR01 thru CDR06
MILITARY DESIGNATION PER MIL-PRF-55681
Part Number Example
CDR01 BP 101
B
K
S
M
L
W
D
t
MIL Style
Voltage-temperature
Limits
Capacitance
T
Rated Voltage
Capacitance Tolerance
Termination Finish
Failure Rate
NOTE: Contact factory for availability of Termination and Tolerance Options for
Specific Part Numbers.
MIL Style: CDR01, CDR02, CDR03, CDR04, CDR05,
Termination Finish:
CDR06
M = Palladium silver
N = Silver-nickel-gold
S = Solder coated final with a minimum of 4 percent lead
T = Silver
U = Base metallization-barrier metal-solder coated
(tin/lead alloy, with a minimum of 4 percent lead)
W = Base metallization-barrier metal-tinned
(tin or tin/lead alloy)
Y = Base metallization-barrier metal-tin (100 percent)
Z = Base metallization-barrier metal-tinned
(tin/lead alloy, with a minimum of 4 percent lead)
Voltage Temperature Limits:
BP = 0 30 ppm/ꢁC without voltage; 0 30 ppm/ꢁC with
rated voltage from -55ꢁC to +125ꢁC
BX = 15ꢀ without voltage; +15 –25ꢀ with rated voltage
from -55ꢁC to +125ꢁC
Capacitance: Two digit figures followed by multiplier
(number of zeros to be added) e.g., 101 = 100 pF
Rated Voltage: A = 50V, B = 100V
*See MIL-PRF-55681 Specification for more details
Capacitance Tolerance: J 5ꢀ, K 10ꢀ, M 20ꢀ
Failure Rate Level: M = 1.0ꢀ, P = .1ꢀ, R = .01ꢀ,
S = .001ꢀ
Packaging: Bulk is standard packaging. Tape and reel
per RS481 is available upon request.
Not RoHS Compliant
CROSS REFERENCE: AVX/MIL-PRF-55681/CDR01 THRU CDR06*
Thickness (T)
D
Termination Band (t)
Per
AVX
Length (L)
Width (W)
MIL-PRF-55681 Style
Min.
Max.
.055
.055
.080
.080
Min.
.030
—
Max.
—
Min.
.010
.010
.010
.010
Max.
—
CDR01
CDR02
CDR03
CDR04
0805 .080 .015 .050 .015 .022
1805 .180 .015 .050 .015 .022
1808 .180 .015 .080 .018 .022
1812 .180 .015 .125 .015 .022
—
.030
.030
.030
—
—
—
—
+.020
-.015
+.020
-.015
CDR05
1825 .180
.250
.020
.080
.080
—
—
—
—
.010
.010
.030
.030
CDR06
2225 .225 .020 .250 .020 .020
*For CDR11, 12, 13, and 14 see AVX Microwave Chip Capacitor Catalog
109
MIL-PRF-55681/Chips
Military Part Number Identification
CDR01 thru CDR06
CDR01 thru CDR06 to MIL-PRF-55681
Military
Type
Designation
Rated temperature WVDC
and voltage-
temperature limits
Military
Type
Designation
Rated temperature WVDC
and voltage-
temperature limits
Capacitance Capacitance
Capacitance Capacitance
in pF
tolerance
in pF
tolerance
AVX Style 0805/CDR01
AVX Style 1808/CDR03
CDR01BP100B---
CDR01BP120B---
CDR01BP150B---
CDR01BP180B---
CDR01BP220B---
10
12
15
18
22
J,K
J
J,K
J
BP
BP
BP
BP
BP
100
100
100
100
100
CDR03BP331B---
CDR03BP391B---
CDR03BP471B---
CDR03BP561B---
CDR03BP681B---
330
390
470
560
680
J,K
J
J,K
J
BP
BP
BP
BP
BP
100
100
100
100
100
J,K
J,K
CDR01BP270B---
CDR01BP330B---
CDR01BP390B---
CDR01BP470B---
CDR01BP560B---
27
33
39
47
56
J
J,K
J
J,K
J
BP
BP
BP
BP
BP
100
100
100
100
100
CDR03BP821B--
CDR03BP102B---
CDR03BX123B--
CDR03BX153B---
CDR03BX183B---
820
1000
12,000
15,000
18,000
J
J,K
K
K,M
K
BP
BP
BX
BX
BX
100
100
100
100
100
CDR01BP680B---
CDR01BP820B---
CDR01BP101B---
CDR01B--121B---
CDR01B--151B---
68
82
100
120
150
J,K
J
J,K
J,K
J,K
BP
BP
BP
BP,BX
BP,BX
100
100
100
100
100
CDR03BX223B---
CDR03BX273B---
CDR03BX333B---
CDR03BX393A---
CDR03BX473A---
22,000
27,000
33,000
39,000
47,000
K,M
K
K,M
K
BX
BX
BX
BX
BX
100
100
100
50
K,M
50
CDR01B--181B---
CDR01BX221B---
CDR01BX271B---
CDR01BX331B---
CDR01BX391B---
180
220
270
330
390
J,K
K,M
K
K,M
K
BP,BX
BX
BX
BX
BX
100
100
100
100
100
CDR03BX563A---
CDR03BX683A---
56,000
68,000
K
K,M
BX
BX
50
50
AVX Style 1812/CDR04
CDR04BP122B---
CDR04BP152B---
CDR04BP182B---
CDR04BP222B---
CDR04BP272B---
1200
1500
1800
2200
2700
J
J,K
J
J,K
J
BP
BP
BP
BP
BP
100
100
100
100
100
CDR01BX471B---
CDR01BX561B---
CDR01BX681B---
CDR01BX821B---
CDR01BX102B---
470
560
680
820
1000
K,M
K
K,M
K
BX
BX
BX
BX
BX
100
100
100
100
100
K,M
CDR04BP332B---
CDR04BX393B---
CDR04BX473B---
CDR04BX563B---
CDR04BX823A---
3300
J,K
K
K,M
K
BP
BX
BX
BX
BX
100
100
100
100
50
CDR01BX122B---
CDR01BX152B---
CDR01BX182B---
CDR01BX222B---
CDR01BX272B---
1200
1500
1800
2200
2700
K
K,M
K
K,M
K
BX
BX
BX
BX
BX
100
100
100
100
100
39,000
47,000
56,000
82,000
K
CDR04BX104A---
CDR04BX124A---
CDR04BX154A---
CDR04BX184A---
100,000
120,000
150,000
180,000
K,M
K
K,M
K
BX
BX
BX
BX
50
50
50
50
CDR01BX332B---
CDR01BX392A---
CDR01BX472A---
3300
3900
4700
K,M
K
K,M
BX
BX
BX
100
50
50
AVX Style 1805/CDR02
AVX Style 1825/CDR05
CDR02BP221B---
CDR02BP271B---
CDR02BX392B---
CDR02BX472B---
CDR02BX562B---
220
270
3900
4700
5600
J,K
J
K
K,M
K
BP
BP
BX
BX
BX
100
100
100
100
100
CDR05BP392B---
CDR05BP472B---
CDR05BP562B---
CDR05BX683B---
CDR05BX823B---
3900
4700
5600
68,000
82,000
J,K
J,K
J,K
K,M
K
BP
BP
BP
BX
BX
100
100
100
100
100
CDR02BX682B---
CDR02BX822B---
CDR02BX103B---
CDR02BX123A---
CDR02BX153A---
6800
8200
10,000
12,000
15,000
K,M
K
K,M
K
BX
BX
BX
BX
BX
100
100
100
50
CDR05BX104B---
CDR05BX124B---
CDR05BX154B---
CDR05BX224A---
CDR05BX274A---
100,000
120,000
150,000
220,000
270,000
K,M
K
K,M
K,M
K
BX
BX
BX
BX
BX
100
100
100
50
K,M
50
50
CDR02BX183A---
CDR02BX223A---
18,000
22,000
K
K,M
BX
BX
50
50
CDR05BX334A---
330,000
K,M
BX
50
Add appropriate failure rate
Add appropriate termination finish
Capacitance Tolerance
AVX Style 2225/CDR06
CDR06BP682B---
CDR06BP822B---
CDR06BP103B---
CDR06BX394A---
CDR06BX474A---
6800
8200
10,000
390,000
470,000
J,K
J,K
J,K
K
BP
BP
BP
BX
BX
100
100
100
50
K,M
50
Add appropriate failure rate
Add appropriate termination finish
Capacitance Tolerance
110
MIL-PRF-55681/Chips
Part Number Example
CDR31 thru CDR35
MILITARY DESIGNATION PER MIL-PRF-55681
Part Number Example
(example) CDR31 BP 101
B
K
S
M
L
W
D
t
MIL Style
Voltage-temperature
Limits
Capacitance
T
Rated Voltage
Capacitance Tolerance
Termination Finish
Failure Rate
NOTE: Contact factory for availability of Termination and Tolerance Options for
Specific Part Numbers.
MIL Style: CDR31, CDR32, CDR33, CDR34, CDR35
Termination Finish:
Termination Finish:
Voltage Temperature Limits:
BP = 0 30 ppm/ꢁC without voltage; 0 30 ppm/ꢁC with
rated voltage from -55ꢁC to +125ꢁC
M = Palladium silver
N = Silver-nickel-gold
S = Solder coated final with a minimum of 4 percent lead
T = Silver
U = Base metallization-barrier metal-solder coated
(tin/lead alloy, with a minimum of 4 percent lead)
W = Base metallization-barrier metal-tinned
(tin or tin/lead alloy)
BX = 15ꢀ without voltage; +15 –25ꢀ with rated voltage
from -55ꢁC to +125ꢁC
Capacitance: Two digit figures followed by multiplier
(number of zeros to be added) e.g., 101 = 100 pF
Y = Base metallization-barrier metal-tin (100 percent)
Z = Base metallization-barrier metal-tinned
(tin/lead alloy, with a minimum of 4 percent lead)
Rated Voltage: A = 50V, B = 100V
Capacitance Tolerance: B .10 pF, C .25 pF, D .5
pF, F 1ꢀ, J 5ꢀ, K 10ꢀ,
*See MIL-PRF-55681 Specification for more details
M
20ꢀ
Failure Rate Level: M = 1.0ꢀ, P = .1ꢀ, R = .01ꢀ,
S = .001ꢀ
Packaging: Bulk is standard packaging. Tape and reel
per RS481 is available upon request.
Not RoHS Compliant
CROSS REFERENCE: AVX/MIL-PRF-55681/CDR31 THRU CDR35
Thickness (T)
D
Termination Band (t)
Per MIL-PRF-55681 AVX
Length (L) Width (W)
(Metric Sizes)
Style
(mm)
(mm)
Max. (mm)
Min. (mm) Max. (mm) Min. (mm)
CDR31
CDR32
CDR33
CDR34
CDR35
0805
1206
1210
1812
1825
2.00
3.20
3.20
4.50
4.50
1.25
1.60
2.50
3.20
6.40
1.3
1.3
1.5
1.5
1.5
.50
—
—
—
—
.70
.70
.70
.70
.70
.30
.30
.30
.30
.30
111
MIL-PRF-55681/Chips
Military Part Number Identification CDR31
CDR31 to MIL-PRF-55681/7
Military
Type
Designation 1/
Rated temperature WVDC
and voltage-
temperature limits
Military
Type
Designation 1/
Rated temperature WVDC
and voltage-
temperature limits
Capacitance Capacitance
in pF tolerance
Capacitance Capacitance
in pF tolerance
AVX Style 0805/CDR31 (BP)
AVX Style 0805/CDR31 (BP) cont’d
CDR31BP1R0B---
CDR31BP1R1B---
CDR31BP1R2B---
CDR31BP1R3B---
CDR31BP1R5B---
1.0
1.1
1.2
1.3
1.5
B,C
B,C
B,C
B,C
B,C
BP
BP
BP
BP
BP
100
100
100
100
100
CDR31BP101B---
CDR31BP111B---
CDR31BP121B---
CDR31BP131B---
CDR31BP151B---
100
110
120
130
150
F,J,K
F,J,K
F,J,K
F,J,K
F,J,K
BP
BP
BP
BP
BP
100
100
100
100
100
CDR31BP1R6B---
CDR31BP1R8B---
CDR31BP2R0B---
CDR31BP2R2B---
CDR31BP2R4B---
1.6
1.8
2.0
2.2
2.4
B,C
B,C
B,C
B,C
B,C
BP
BP
BP
BP
BP
100
100
100
100
100
CDR31BP161B---
CDR31BP181B---
CDR31BP201B---
CDR31BP221B---
CDR31BP241B---
160
180
200
220
240
F,J,K
F,J,K
F,J,K
F,J,K
F,J,K
BP
BP
BP
BP
BP
100
100
100
100
100
CDR31BP2R7B---
CDR31BP3R0B---
CDR31BP3R3B---
CDR31BP3R6B---
CDR31BP3R9B---
2.7
3.0
3.3
3.6
3.9
B,C,D
B,C,D
B,C,D
B,C,D
B,C,D
BP
BP
BP
BP
BP
100
100
100
100
100
CDR31BP271B---
CDR31BP301B---
CDR31BP331B---
CDR31BP361B---
CDR31BP391B---
270
300
330
360
390
F,J,K
F,J,K
F,J,K
F,J,K
F,J,K
BP
BP
BP
BP
BP
100
100
100
100
100
CDR31BP4R3B---
CDR31BP4R7B---
CDR31BP5R1B---
CDR31BP5R6B---
CDR31BP6R2B---
4.3
4.7
5.1
5.6
6.2
B,C,D
B,C,D
B,C,D
B,C,D
B,C,D
BP
BP
BP
BP
BP
100
100
100
100
100
CDR31BP431B---
CDR31BP471B---
CDR31BP511A---
CDR31BP561A---
CDR31BP621A---
430
470
510
560
620
F,J,K
F,J,K
F,J,K
F,J,K
F,J,K
BP
BP
BP
BP
BP
100
100
50
50
50
CDR31BP6R8B---
CDR31BP7R5B---
CDR31BP8R2B---
CDR31BP9R1B---
CDR31BP100B---
6.8
7.5
8.2
9.1
10
B,C,D
B,C,D
B,C,D
B,C,D
F,J,K
BP
BP
BP
BP
BP
100
100
100
100
100
CDR31BP681A---
680
F,J,K
BP
50
AVX Style 0805/CDR31 (BX)
CDR31BX471B---
CDR31BX561B---
CDR31BX681B---
CDR31BX821B---
CDR31BX102B---
470
560
680
820
1,000
K,M
K,M
K,M
K,M
K,M
BX
BX
BX
BX
BX
100
100
100
100
100
CDR31BP110B---
CDR31BP120B---
CDR31BP130B---
CDR31BP150B---
CDR31BP160B---
11
12
13
15
16
F,J,K
F,J,K
F,J,K
F,J,K
F,J,K
BP
BP
BP
BP
BP
100
100
100
100
100
CDR31BX122B---
CDR31BX152B---
CDR31BX182B---
CDR31BX222B---
CDR31BX272B---
1,200
1,500
1,800
2,200
2,700
K,M
K,M
K,M
K,M
K,M
BX
BX
BX
BX
BX
100
100
100
100
100
CDR31BP180B---
CDR31BP200B---
CDR31BP220B---
CDR31BP240B---
CDR31BP270B---
18
20
22
24
27
F,J,K
F,J,K
F,J,K
F,J,K
F,J,K
BP
BP
BP
BP
BP
100
100
100
100
100
CDR31BX332B---
CDR31BX392B---
CDR31BX472B---
CDR31BX562A---
CDR31BX682A---
3,300
3,900
4,700
5,600
6,800
K,M
K,M
K,M
K,M
K,M
BX
BX
BX
BX
BX
100
100
100
50
CDR31BP300B---
CDR31BP330B---
CDR31BP360B---
CDR31BP390B---
CDR31BP430B---
30
33
36
39
43
F,J,K
F,J,K
F,J,K
F,J,K
F,J,K
BP
BP
BP
BP
BP
100
100
100
100
100
50
CDR31BX822A---
CDR31BX103A---
CDR31BX123A---
CDR31BX153A---
CDR31BX183A---
8,200
10,000
12,000
15,000
18,000
K,M
K,M
K,M
K,M
K,M
BX
BX
BX
BX
BX
50
50
50
50
50
CDR31BP470B---
CDR31BP510B---
CDR31BP560B---
CDR31BP620B---
CDR31BP680B---
47
51
56
62
68
F,J,K
F,J,K
F,J,K
F,J,K
F,J,K
BP
BP
BP
BP
BP
100
100
100
100
100
CDR31BP750B---
CDR31BP820B---
CDR31BP910B---
75
82
91
F,J,K
F,J,K
F,J,K
BP
BP
BP
100
100
100
Add appropriate failure rate
Add appropriate termination finish
Capacitance Tolerance
Add appropriate failure rate
Add appropriate termination finish
Capacitance Tolerance
1/ The complete part number will include additional symbols to indicate capacitance
tolerance, termination and failure rate level.
112
MIL-PRF-55681/Chips
Military Part Number Identification CDR32
CDR32 to MIL-PRF-55681/8
Military
Type
Designation 1/
Rated temperature WVDC
and voltage-
temperature limits
Military
Type
Designation 1/
Rated temperature WVDC
and voltage-
temperature limits
Capacitance Capacitance
in pF tolerance
Capacitance Capacitance
in pF tolerance
AVX Style 1206/CDR32 (BP)
AVX Style 1206/CDR32 (BP) cont’d
CDR32BP1R0B---
CDR32BP1R1B---
CDR32BP1R2B---
CDR32BP1R3B---
CDR32BP1R5B---
1.0
1.1
1.2
1.3
1.5
B,C
B,C
B,C
B,C
B,C
BP
BP
BP
BP
BP
100
100
100
100
100
CDR32BP101B---
CDR32BP111B---
CDR32BP121B---
CDR32BP131B---
CDR32BP151B---
100
110
120
130
150
F,J,K
F,J,K
F,J,K
F,J,K
F,J,K
BP
BP
BP
BP
BP
100
100
100
100
100
CDR32BP1R6B---
CDR32BP1R8B---
CDR32BP2R0B---
CDR32BP2R2B---
CDR32BP2R4B---
1.6
1.8
2.0
2.2
2.4
B,C
B,C
B,C
B,C
B,C
BP
BP
BP
BP
BP
100
100
100
100
100
CDR32BP161B---
CDR32BP181B---
CDR32BP201B---
CDR32BP221B---
CDR32BP241B---
160
180
200
220
240
F,J,K
F,J,K
F,J,K
F,J,K
F,J,K
BP
BP
BP
BP
BP
100
100
100
100
100
CDR32BP2R7B---
CDR32BP3R0B---
CDR32BP3R3B---
CDR32BP3R6B---
CDR32BP3R9B---
2.7
3.0
3.3
3.6
3.9
B,C,D
B,C,D
B,C,D
B,C,D
B,C,D
BP
BP
BP
BP
BP
100
100
100
100
100
CDR32BP271B---
CDR32BP301B---
CDR32BP331B---
CDR32BP361B---
CDR32BP391B---
270
300
330
360
390
F,J,K
F,J,K
F,J,K
F,J,K
F,J,K
BP
BP
BP
BP
BP
100
100
100
100
100
CDR32BP4R3B---
CDR32BP4R7B---
CDR32BP5R1B---
CDR32BP5R6B---
CDR32BP6R2B---
4.3
4.7
5.1
5.6
6.2
B,C,D
B,C,D
B,C,D
B,C,D
B,C,D
BP
BP
BP
BP
BP
100
100
100
100
100
CDR32BP431B---
CDR32BP471B---
CDR32BP511B---
CDR32BP561B---
CDR32BP621B---
430
470
510
560
620
F,J,K
F,J,K
F,J,K
F,J,K
F,J,K
BP
BP
BP
BP
BP
100
100
100
100
100
CDR32BP6R8B---
CDR32BP7R5B---
CDR32BP8R2B---
CDR32BP9R1B---
CDR32BP100B---
6.8
7.5
8.2
9.1
10
B,C,D
B,C,D
B,C,D
B,C,D
F,J,K
BP
BP
BP
BP
BP
100
100
100
100
100
CDR32BP681B---
CDR32BP751B---
CDR32BP821B---
CDR32BP911B---
CDR32BP102B---
680
750
820
910
1,000
F,J,K
F,J,K
F,J,K
F,J,K
F,J,K
BP
BP
BP
BP
BP
100
100
100
100
100
CDR32BP110B---
CDR32BP120B---
CDR32BP130B---
CDR32BP150B---
CDR32BP160B---
11
12
13
15
16
F,J,K
F,J,K
F,J,K
F,J,K
F,J,K
BP
BP
BP
BP
BP
100
100
100
100
100
CDR32BP112A---
CDR32BP122A---
CDR32BP132A---
CDR32BP152A---
CDR32BP162A---
1,100
1,200
1,300
1,500
1,600
F,J,K
F,J,K
F,J,K
F,J,K
F,J,K
BP
BP
BP
BP
BP
50
50
50
50
50
CDR32BP180B---
CDR32BP200B---
CDR32BP220B---
CDR32BP240B---
CDR32BP270B---
18
20
22
24
27
F,J,K
F,J,K
F,J,K
F,J,K
F,J,K
BP
BP
BP
BP
BP
100
100
100
100
100
CDR32BP182A---
CDR32BP202A---
CDR32BP222A---
1,800
2,000
2,200
F,J,K
F,J,K
F,J,K
BP
BP
BP
50
50
50
AVX Style 1206/CDR32 (BX)
CDR32BP300B---
CDR32BP330B---
CDR32BP360B---
CDR32BP390B---
CDR32BP430B---
30
33
36
39
43
F,J,K
F,J,K
F,J,K
F,J,K
F,J,K
BP
BP
BP
BP
BP
100
100
100
100
100
CDR32BX472B---
CDR32BX562B---
CDR32BX682B---
CDR32BX822B---
CDR32BX103B---
4,700
5,600
6,800
8,200
10,000
K,M
K,M
K,M
K,M
K,M
BX
BX
BX
BX
BX
100
100
100
100
100
CDR32BP470B---
CDR32BP510B---
CDR32BP560B---
CDR32BP620B---
CDR32BP680B---
47
51
56
62
68
F,J,K
F,J,K
F,J,K
F,J,K
F,J,K
BP
BP
BP
BP
BP
100
100
100
100
100
CDR32BX123B---
CDR32BX153B---
CDR32BX183A---
CDR32BX223A---
CDR32BX273A---
12,000
15,000
18,000
22,000
27,000
K,M
K,M
K,M
K,M
K,M
BX
BX
BX
BX
BX
100
100
50
50
50
CDR32BP750B---
CDR32BP820B---
CDR32BP910B---
75
82
91
F,J,K
F,J,K
F,J,K
BP
BP
BP
100
100
100
CDR32BX333A---
CDR32BX393A---
33,000
39,000
K,M
K,M
BX
BX
50
50
Add appropriate failure rate
Add appropriate termination finish
Capacitance Tolerance
Add appropriate failure rate
Add appropriate termination finish
Capacitance Tolerance
1/ The complete part number will include additional symbols to indicate capacitance
tolerance, termination and failure rate level.
113
MIL-PRF-55681/Chips
Military Part Number Identification CDR33/34/35
CDR33/34/35 to MIL-PRF-55681/9/10/11
Military
Type
Designation 1/
Rated temperature WVDC
and voltage-
temperature limits
Military
Type
Designation 1/
Rated temperature WVDC
and voltage-
temperature limits
Capacitance Capacitance
in pF tolerance
Capacitance Capacitance
in pF tolerance
AVX Style 1210/CDR33 (BP)
AVX Style 1812/CDR34 (BX)
CDR33BP102B---
CDR33BP112B---
CDR33BP122B---
CDR33BP132B---
CDR33BP152B---
1,000
1,100
1,200
1,300
1,500
F,J,K
F,J,K
F,J,K
F,J,K
F,J,K
BP
BP
BP
BP
BP
100
100
100
100
100
CDR34BX273B---
CDR34BX333B---
CDR34BX393B---
CDR34BX473B---
CDR34BX563B---
27,000
33,000
39,000
47,000
56,000
K,M
K,M
K,M
K,M
K,M
BX
BX
BX
BX
BX
100
100
100
100
100
CDR33BP162B---
CDR33BP182B---
CDR33BP202B---
CDR33BP222B---
CDR33BP242A---
1,600
1,800
2,000
2,200
2,400
F,J,K
F,J,K
F,J,K
F,J,K
F,J,K
BP
BP
BP
BP
BP
100
100
100
100
50
CDR34BX104A---
CDR34BX124A---
CDR34BX154A---
CDR34BX184A---
100,000
120,000
150,000
180,000
K,M
K,M
K,M
K,M
BX
BX
BX
BX
50
50
50
50
CDR33BP272A---
CDR33BP302A---
CDR33BP332A---
2,700
3,000
3,300
F,J,K
F,J,K
F,J,K
BP
BP
BP
50
50
50
AVX Style 1825/CDR35 (BP)
CDR35BP472B---
CDR35BP512B---
CDR35BP562B---
CDR35BP622B---
CDR35BP682B---
4,700
5,100
5,600
6,200
6,800
F,J,K
F,J,K
F,J,K
F,J,K
F,J,K
BP
BP
BP
BP
BP
100
100
100
100
100
AVX Style 1210/CDR33 (BX)
CDR33BX153B---
CDR33BX183B---
CDR33BX223B---
CDR33BX273B---
CDR33BX393A---
15,000
18,000
22,000
27,000
39,000
K,M
K,M
K,M
K,M
K,M
BX
BX
BX
BX
BX
100
100
100
100
50
CDR35BP752B---
CDR35BP822B---
CDR35BP912B---
CDR35BP103B---
CDR35BP113A---
7,500
8,200
9,100
10,000
11,000
F,J,K
F,J,K
F,J,K
F,J,K
F,J,K
BP
BP
BP
BP
BP
100
100
100
100
50
CDR33BX473A---
CDR33BX563A---
CDR33BX683A---
CDR33BX823A---
CDR33BX104A---
47,000
56,000
68,000
82,000
100,000
K,M
K,M
K,M
K,M
K,M
BX
BX
BX
BX
BX
50
50
50
50
50
CDR35BP123A---
CDR35BP133A---
CDR35BP153A---
CDR35BP163A---
CDR35BP183A---
12,000
13,000
15,000
16,000
18,000
F,J,K
F,J,K
F,J,K
F,J,K
F,J,K
BP
BP
BP
BP
BP
50
50
50
50
50
AVX Style 1812/CDR34 (BP)
CDR35BP203A---
CDR35BP223A---
20,000
22,000
F,J,K
F,J,K
BP
BP
50
50
CDR34BP222B---
CDR34BP242B---
CDR34BP272B---
CDR34BP302B---
CDR34BP332B---
2,200
2,400
2,700
3,000
3,300
F,J,K
F,J,K
F,J,K
F,J,K
F,J,K
BP
BP
BP
BP
BP
100
100
100
100
100
AVX Style 1825/CDR35 (BX)
CDR35BX563B---
CDR35BX683B---
CDR35BX823B---
CDR35BX104B---
CDR35BX124B---
56,000
68,000
82,000
100,000
120,000
K,M
K,M
K,M
K,M
K,M
BX
BX
BX
BX
BX
100
100
100
100
100
CDR34BP362B---
CDR34BP392B---
CDR34BP432B---
CDR34BP472B---
CDR34BP512A---
3,600
3,900
4,300
4,700
5,100
F,J,K
F,J,K
F,J,K
F,J,K
F,J,K
BP
BP
BP
BP
BP
100
100
100
100
50
CDR35BX154B---
CDR35BX184A---
CDR35BX224A---
CDR35BX274A---
CDR35BX334A---
150,000
180,000
220,000
270,000
330,000
K,M
K,M
K,M
K,M
K,M
BX
BX
BX
BX
BX
100
50
50
50
50
CDR34BP562A---
CDR34BP622A---
CDR34BP682A---
CDR34BP752A---
CDR34BP822A---
5,600
6,200
6,800
7,500
8,200
F,J,K
F,J,K
F,J,K
F,J,K
F,J,K
BP
BP
BP
BP
BP
50
50
50
50
50
CDR35BX394A---
CDR35BX474A---
390,000
470,000
K,M
K,M
BX
BX
50
50
CDR34BP912A---
CDR34BP103A---
9,100
10,000
F,J,K
F,J,K
BP
BP
50
50
Add appropriate failure rate
Add appropriate termination finish
Capacitance Tolerance
Add appropriate failure rate
Add appropriate termination finish
Capacitance Tolerance
1/ The complete part number will include additional symbols to indicate capacitance
tolerance, termination and failure rate level.
114
MQ Series – Medical Grade MLCC
General Specifications
GENERAL DESCRIPTION
AVX offers a wide variety of medically qualified passive components.
Medical devices require the utmost reliability with respect to the
components incorporated into the designs. Advanced design
qualification requirements, in-process controls and requirements and
lot acceptance testing are implemented to ensure these components
will meet the superior reliability levels of a life supporting application.
AVX medical MLCC reliability documents provide an advanced level
of designing, manufacturing, testing and qualification that places AVX
as the top supplier and industry leader of medically qualified MLCCs.
AVX MQ series of medically qualified ceramic capacitors are available
in EIA case sizes ranging from 0402 to 2225, at typical voltage
ratings between 4 – 200 Vdc with various termination options
including Sn, SnPb solder, and Au.
APPLICATIONS
FEATURES
• Implantable cardioverter-defibrillator (ICD)
• Pacemakers
• Neuromodulation
• 0402 to 2225 case sizes
• Voltage range from 4v to 100v
• Capacitance up to 100ꢂF
• Class I & II dielectric materials
• Tight tolerances on Class I dielectric materials
• Various terminations
• Customer specific requirements, screening, & testing
HOW TO ORDER
MQ02
A
100
J
G
T
3
A
Z
Size
Dielectric
Code
Capacitance
Code (In pF)
(2 significant
digits + number
of zeros)
for values <10pF:
letter R denotes
decimal point.
Example:
Capacitance
Tolerance
Medical
Grade
Termination
Finish
Packaging
1 = 7" Reel
2 = 7" Reel
(0402 only)
3 = 13" Reel
4 = 13" Reel
(0402 only)
6 = Waffle
Special
Code
Rated
Voltage
4 = 4V
6 = 6.3V
Z = 10V
Y = 16v
3 = 25V
5 = 50V
1 = 100V
MQ02 = 0402
MQ03 = 0603
MQ05 = 0805
MQ06 = 1206
MQ10 = 1210
MQ12 = 1812
MQ13 = 1825
MQ14 = 2225
A = NP0 (C0G)
C = X7R
B = 0.1pF
C = 0.25pF
D = 0.5pF
F = 1ꢀ (≥10pF)
G = 2ꢀ (≥10pF)
J = 5ꢀ
A = Standard
T = Plated Ni & Sn
J = 60/40 Sn/Pb
B = 5ꢀ min Pb
Plated Solder
7 = Gold Plated
Contact AVX
for others
Z = X7S
D = X5R
K = 10ꢀ
M = 20ꢀ
68pF = 680
N = 30ꢀ
8.2pF = 8R2
050516
115
MQ Series – Medical Grade MLCC
NP0 (C0G) – Capacitance & Voltage Range
PREFERRED SIZES ARE SHADED
SIZE
0402
0603
0805
1206
1210
1812
1825
2225
Soldering
Packaging
Reflow Only
All Paper
Reflow/Wave
All Embossed
Reflow/Wave
All Embossed
Reflow/Wave
All Embossed
Reflow Only
Reflow Only
Reflow Only
All Embossed
Reflow Only
All Embossed
All Embossed
All Embossed
mm
(in.)
1.00 0.10
1.60 0.15
2.01 0.20
3.20 0.20
3.20 0.20
4.50 0.30
4.50 0.30
5.72 0.25
(L) Length
((0.040 0.004)
(0.063 0.006)
(0.079 0.008)
(0.126 0.008)
(0.126 0.008)
(0.177 0.012)
(0.177 0.012)
(0.225 0.010)
mm
(in.)
0.50 0.10
(0.020 0.004)
0.81 0.15
(0.032 0.006)
1.25 0.20
(0.049 0.008)
1.60 0.20
(0.063 0.008)
2.50 0.20
(0.098 0.008)
3.20 0.20
(0.126 0.008)
6.40 0.40
(0.252 0.016)
6.35 0.25
(0.250 0.010)
(W) Width
mm
(in.)
0.25 0.15
(0.010 0.006)
0.35 0.15
(0.037)
0.50 0.25
(0.020 0.010)
0.50 0.25
(0.020 0.010)
0.50 0.25
(0.020 0.010)
0.61 0.36
(0.024 0.014)
0.61 0.36
(0.024 0.014)
0.64 0.39
(0.025 0.015)
(t) Terminal
Maximum
Thickness
mm
(in.)
0.56
(0.022)
0.94
(0.014 0.006)
1.52
(0.060)
1.78
(0.070)
1.78
(0.070)
2.79
(0.110)
2.79
(0.110)
2.79
(0.110)
WVDC
0.5
1.0
16
25
50
6.3
16
25
50
100
16
25
50
100
16
25
50
100
25
50
100
25
50
100
50
100
25
50
100
Cap
(pF)
1.2
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10
12
15
18
22
27
33
39
47
56
68
82
100
120
150
180
220
270
330
390
470
560
680
820
1000
1200
1500
1800
2200
2700
3300
3900
4700
5600
6800
8200
10000
WVDC
16
25
50
6.3
16
25
50
100
16
25
50
100
16
25
50
100
25
50
100
25
50
100
50
100
25
50
100
SIZE
0402
0603
0805
1206
1210
1812
1825
2225
050516
116
MQ Series – Medical Grade MLCC
NP0 (C0G) – General Specifications
TYPICAL ELECTRICAL CHARACTERISTICS
Temperature Coefficient
⌬ Capacitance vs. Frequency
Variation of Impedance with Cap Value
Impedance vs. Frequency
0805 - C0G (NP0)
Insulation Resistance vs. Temperature
10 pF vs. 100 pF vs. 1000 pF
Insulation Resistance vs Temperature
10,000
1,000
100
0
40
60
80
100
20
0
Temperature °C
Variation of Impedance with Ceramic Formulation
Impedance vs. Frequency
1000 pF - C0G (NP0) vs. X7R
0805
Variation of Impedance with Chip Size
Impedance vs. Frequency
1000 pF - C0G (NP0)
050516
117
MQ Series – Medical Grade MLCC
NP0 (C0G) – Specifications & Test Methods
Parameter/Test
Operating Temperature Range
Capacitance
NP0 Specification Limits
-55ºC to +125ºC
Within specified tolerance
<30 pF: Q≥ 400+20 x Cap Value
≥30 pF: Q≥ 1000
Measuring Conditions
Temperature Cycle Chamber
Freq.: 1.0 MHz 10ꢀ for cap ≤ 1000 pF
1.0 kHz 10ꢀ for cap > 1000 pF
Voltage: 1.0Vrms .2V
Q
100,000MΩ or 1000MΩ - μF,
whichever is less
Charge device with rated voltage for
120 5 secs @ room temp/humidity
Charge device with 250ꢀ of rated voltage for
1-5 seconds, with charge and discharge
current limited to 50 mA (max)
Deflection: 2mm
Insulation Resistance
Dielectric Strength
No breakdown or visual defects
Appearance
Capacitance
Variation
No defects
Test Time: 30 seconds
5ꢀ or .5 pF, whichever is greater
Resistance to
Flexure
Q
Meets Initial Values (As Above)
≥ Initial Value x 0.3
Stresses
Insulation
Resistance
≥ 85ꢀ of each terminal should be covered
with fresh solder
No defects, <25ꢀ leaching of either end terminal
Dip device in eutectic solder at 245 5ºC
for 5.0 0.5 seconds
Solderability
Appearance
Capacitance
Variation
≤
2.5ꢀ or .25 pF, whichever is greater
MIL-STD-202 / Method 210 / Condition J
(Reflow Mounting plus 1 Reflow Cycle
@ 235ꢁC 5ꢁC)
Resistance to
Solder Heat
Q
Meets Initial Values (As Above)
Insulation
Resistance
Appearance
Capacitance
Variation
Meets Initial Values (As Above)
No visual defects
Step 1: -55ºC 2º
Step 2: Room Temp
30 3 minutes
≤ 3 minutes
≤
3.0ꢀ or .0.3 pF, whichever is greater
Thermal
Shock
Q
Meets Initial Values (As Above)
Meets Initial Values (As Above)
Step 3: +125ºC 2º
Step 4: Room Temp
30 3 minutes
≤ 3 minutes
Insulation
Resistance
Dielectric
Repeat for 5 cycles and measure after
24 hours at room temperature
Meets Initial Values (As Above)
No visual defects
Strength
Appearance
Capacitance
Variation
≤
3.0ꢀ or 0.3 pF, whichever is greater
Load in test chamber set at 125ꢁC 2ꢁC
for 1000 hours (+48, -0)
≥ 30 pF:
≥10 pF, <30 pF:
<10 pF:
Q≥ 350
Q≥ 275 +5C/2
Q≥ 200 +10C
with twice rated voltage applied.
Q
Load Life
Remove from test chamber and stabilize at room
temperature before measuring.
Insulation
Resistance
Dielectric
Strength
≥ Initial Value x 0.3 (See Above)
Meets Initial Values (As Above)
No visual defects
Load in a test chamber set at 85ꢁC 2ꢁC/85ꢀ 5ꢀ
relative humidity for 1000 hours (+48, -0) with rated
voltage applied.
Appearance
Load
Humidity
Insulation
Resistance
≥ Initial Value x 0.3 (See Above)
Remove from chamber and stabilize at room
temperature before measuring.
050516
118
MQ Series – Medical Grade MLCC
X7R/X7S – General Specifications
PREFERRED SIZES ARE SHADED
SIZE
0402
0603
0805
1206
1210
1812 1825
2225
Soldering
Reflow Only
All Paper
Reflow/Wave
All Embossed
Reflow/Wave
All Embossed
Reflow/Wave
All Embossed
Reflow Only
Reflow Only Reflow Only
All Embossed All Embossed
4.50 0.30
(0.177 0.012) (0.177 0.012)
3.20 0.20 6.40 0.40
(0.126 0.008) (0.252 0.016)
0.61 0.36 0.61 0.36
(0.024 0.014) (0.024 0.014)
Reflow Only
Packaging
mm
(L) Length
(in.)
mm
(W) Width
(in.)
mm
(t) Terminal
(in.)
All Embossed
All Embossed
1.00 0.10
1.60 0.15
2.01 0.20
3.20 0.20
3.20 0.20
4.50 0.30
5.72 0.25
((0.040 0.004)
0.50 0.10
(0.020 0.004)
0.25 0.15
(0.010 0.006)
(0.063 0.006)
0.81 0.15
(0.032 0.006)
0.35 0.15
(0.037)
(0.079 0.008)
1.25 0.20
(0.049 0.008)
0.50 0.25
(0.020 0.010)
(0.126 0.008)
1.60 0.20
(0.063 0.008)
0.50 0.25
(0.020 0.010)
(0.126 0.008)
(0.225 0.010)
2.50 0.20
(0.098 0.008)
0.50 0.25
(0.020 0.010)
6.35 0.25
(0.250 0.010)
0.64 0.39
(0.025 0.015)
Maximum
Thickness
mm
(in.)
0.56
(0.022)
0.94
(0.014 0.006)
1.52
(0.060)
1.78
(0.070)
1.78
(0.070)
2.79
(0.110)
2.79
(0.110)
2.79
(0.110)
WVDC
100
150
10
16
25
50
6.3
10
16
25
50
100
6.3
10
16
25
50
100
6.3
10
16
25
50
100
10
16
25
50
100
50
100
50
100
16
25
50
100
Cap
(pF)
220
330
470
680
1000
1500
2200
3300
4700
6800
0.010
0.015
0.022
0.033
0.047
0.068
0.10
0.15
0.22
0.33
0.47
0.68
1.0
Cap
(ꢂF)
1.5
2.2
3.3
4.7
10
WVDC
10
16
25
50
6.3
10
16
25
50
100
6.3
10
16
25
50
100
6.3
10
16
25
50
100
10
16
25
50
100
50
100
50
100
16
25
50
100
SIZE
0402
0603
0805
1206
1210
1812 1825
2225
These values are produced with X7S temperature coefficient code
050516
119
MQ Series – Medical Grade MLCC
X7R/X7S – General Specifications
TYPICAL ELECTRICAL CHARACTERISTICS
X7R Dielectric
Typical Temperature Coefficient
⌬ Capacitance vs. Frequency
Variation of Impedance with Cap Value
Impedance vs. Frequency
1,000 pF vs. 10,000 pF - X7R
0805
Insulation Resistance vs. Temperature
Variation of Impedance with Chip Size
Impedance vs. Frequency
100,000 pF - X7R
Variation of Impedance with Chip Size
Impedance vs. Frequency
10,000 pF -X7R
120
050516
MQ Series – Medical Grade MLCC
X7R/X7S – Specifications & Test Methods
Parameter/Test
Operating Temperature Range
Capacitance
NP0 Specification Limits
-55ºC to +125ºC
Measuring Conditions
Temperature Cycle Chamber
Within specified tolerance
≤ 2.5ꢀ for ≥ 50V DC rating
≤ 3.0ꢀ for 25V & 35V DC rating
≤ 12.5ꢀ for 16V DC rating and lower
Contact factory for DF by PN
100,000MΩ or 1000MΩ - μF,
whichever is less
Frequency: 1.0kHz 10ꢀ
Voltage: 1.0Vrms 0.2V
Dissipation Factor
Charge device with rated voltage for
120 5 secs @ room temp/humidity
Charge device with 250ꢀ of rated voltage for
1-5 seconds, with charge and discharge
current limited to 50 mA (max)
Insulation Resistance
Dielectric Strength
No breakdown or visual defects
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
No defects
Deflection: 2mm
Test Time: 30 seconds
≤
12ꢀ
Resistance to
Flexure
Meets Initial Values (As Above)
≥ Initial Value x 0.3
Stresses
≥ 85ꢀ of each terminal should be covered
with fresh solder
No defects, <25ꢀ leaching of either end terminal
Dip device in eutectic solder at 245 5ºC
for 5.0 0.5 seconds
Solderability
Appearance
Capacitance
Variation
≤
7.5ꢀ
MIL-STD-202 / Method 210 / Condition J
(Reflow Mounting plus 1 Reflow Cycle
@ 235ꢁC 5ꢁC)
Resistance to
Solder Heat
Dissipation
Factor
Meets Initial Values (As Above)
Insulation
Resistance
Appearance
Capacitance
Variation
Meets Initial Values (As Above)
No visual defects
Step 1: -55ºC 2º
Step 2: Room Temp
30 3 minutes
≤ 3 minutes
≤
7.5ꢀ
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
Appearance
Capacitance
Variation
Dissipation
Factor
Thermal
Shock
Meets Initial Values (As Above)
Meets Initial Values (As Above)
Step 3: +125ºC 2º
Step 4: Room Temp
30 3 minutes
≤ 3 minutes
Repeat for 5 cycles and measure after
24 hours at room temperature
Meets Initial Values (As Above)
No visual defects
≤
12.5ꢀ
Load in test chamber set at 125ꢁC 2ꢁC
for 1000 hours (+48, -0)
with twice rated voltage applied.
Load Life
≤ initial value x 2.0 (see above)
Insulation
Resistance
Dielectric
Strength
Remove from test chamber and stabilize at room
temperature before measuring.
≥ Initial Value x 0.3 (See Above)
Meets Initial Values (As Above)
No visual defects
Load in a test chamber set at 85ꢁC 2ꢁC/85ꢀ 5ꢀ
relative humidity for 1000 hours (+48, -0) with rated
voltage applied.
Appearance
Load
Humidity
Insulation
Resistance
≥ Initial Value x 0.3 (See Above)
Remove from chamber and stabilize at room
temperature before measuring.
121
050516
MQ Series – Medical Grade MLCC
X5R – Capacitance & Voltage Range
PREFERRED SIZES ARE SHADED
SIZE
0402
0603
0805
1206
1210
1812
Soldering
Reflow Only
All Paper
Reflow/Wave
All Embossed
Reflow/Wave
All Embossed
Reflow/Wave
All Embossed
Reflow Only
Reflow Only
Packaging
mm
(L) Length
(in.)
All Embossed
All Embossed
1.00 0.10
1.60 0.15
2.01 0.20
3.20 0.20
3.20 0.20
4.50 0.30
(0.040 0.004)
(0.063 0.006)
(0.079 0.008)
(0.126 0.008)
(0.126 0.008)
(0.177 0.012)
mm
(W) Width
(in.)
0.50 0.10
(0.020 0.004)
0.81 0.15
(0.032 0.006)
1.25 0.20
(0.049 0.008)
1.60 0.20
(0.063 0.008)
2.50 0.20
(0.098 0.008)
3.20 0.20
(0.126 0.008)
mm
(t) Terminal
(in.)
0.25 0.15
(0.010 0.006)
0.35 0.15
(0.037)
0.50 0.25
(0.020 0.010)
0.50 0.25
(0.020 0.010)
0.50 0.25
(0.020 0.010)
0.61 0.36
(0.024 0.014)
Maximum
Thickness
mm
(in.)
0.56
(0.022)
0.94
(0.014 0.006)
1.52
(0.060)
1.78
(0.070)
1.78
(0.070)
2.79
(0.110)
WVDC
0.01
0.015
0.022
0.033
0.047
0.068
0.1
4
6.3
10
16
25
50
4
6.3
10
16
25
50
6.3
10
16
25
50
6.3
10
16
25
50
4
6.3
10
16
25
50
6.3
10
25
50
Cap
(ꢂF)
0.15
0.22
0.33
0.47
0.68
1.0
1.5
2.2
3.3
4.7
10
22
47
100
WVDC
4
6.3
10
16
25
50
4
6.3
10
16
25
50
6.3
10
16
25
50
6.3
10
16
25
50
4
6.3
10
16
25
50
6.3
10
25
50
SIZE
0402
0603
0805
1206
1210
1812
TYPICAL ELECTRICAL CHARACTERISTICS
Temperature Coefficient
Insulation Resistance vs. Temperature
Insulation Resistance vs Temperature
10,000
1,000
100
20
15
10
5
0
-5
-10
-15
-20
0
-60 -40
-20
0
+20 +40 +60 +80
0
20
40
60
80
100
120
Temperature °C
Temperature °C
122
050516
MQ Series – Medical Grade MLCC
X5R – Specifications & Test Methods
Parameter/Test
Operating Temperature Range
Capacitance
X5R Specification Limits
-55ºC to +85ºC
Measuring Conditions
Temperature Cycle Chamber
Within specified tolerance
≤ 2.5ꢀ for ≥ 50V DC rating
≤ 3.0ꢀ for 25V, 35V DC rating
≤ 12.5ꢀ Max. for 16V DC rating and lower
Contact Factory for DF by PN
10,000MΩ or 500MΩ - μF,
whichever is less
Freq.: 1.0 kHz 10ꢀ
Voltage: 1.0Vrms .2V
For Cap > 10 μF, 0.5Vrms @ 120Hz
Dissipation Factor
Charge device with rated voltage for
120 5 secs @ room temp/humidity
Charge device with 150ꢀ of rated voltage for
1-5 seconds, w/charge and discharge current
limited to 50 mA (max)
Insulation Resistance
Dielectric Strength
No breakdown or visual defects
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
No defects
Deflection: 2mm
Test Time: 30 seconds
≤
12ꢀ
Resistance to
Flexure
Meets Initial Values (As Above)
≥ Initial Value x 0.3
Stresses
≥ 85ꢀ of each terminal should be covered
with fresh solder
No defects, <25ꢀ leaching of either end terminal
Dip device in eutectic solder at 245 5ºC
for 5.0 0.5 seconds
Solderability
Appearance
Capacitance
Variation
≤
7.5ꢀ
MIL-STD-202 / Method 210 / Condition J
(Reflow Mounting plus 1 Reflow Cycle
@ 235ꢁC 5ꢁC)
Dissipation
Factor
Insulation
Resistance
Appearance
Capacitance
Variation
Resistance to
Solder Heat
Meets Initial Values (As Above)
Meets Initial Values (As Above)
No visual defects
Step 1: -55ºC 2º
Step 2: Room Temp
30 3 minutes
≤ 3 minutes
≤
7.5ꢀ
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
Appearance
Capacitance
Variation
Dissipation
Factor
Thermal
Shock
Meets Initial Values (As Above)
Meets Initial Values (As Above)
Step 3: +85ºC 2º
Step 4: Room Temp
30 3 minutes
≤ 3 minutes
Repeat for 5 cycles and measure after
24 2 hours at room temperature
Meets Initial Values (As Above)
No visual defects
≤
12.5ꢀ
Load in test chamber set at 85ꢁC 2ꢁC
for 1000 hours (+48, -0)
≤ Initial Value x 2.0 (See Above)
≥ Initial Value x 0.3 (See Above)
with twice rated voltage applied.
Load Life
Insulation
Resistance
Dielectric
Strength
Remove from test chamber and stabilize at room
temperature before measuring.
Meets Initial Values (As Above)
No visual defects
Appearance
Load in a test chamber set at 85ꢁC 2ꢁC/85ꢀ 5ꢀ
relative humidity for 1000 hours (+48, -0) with rated
voltage applied.
Load
Humidity
Insulation
Resistance
≥ Initial Value x 0.3 (See Above)
Remove from chamber and stabilize at room
temperature before measuring.
123
050516
MM Series – MLCC for Medical Applications
General Specifications
The AVX MM series is a multi-layer ceramic capacitor designed for
use in medical applications other than implantable/life support.
These components have the design & change control expected for
medical devices and also offer enhanced LAT including reliability
testing and 100ꢀ inspection.
APPLICATIONS
Implantable, Non-Life Supporting Medical Devices
• e.g. implanted temporary cardiac monitor, insulin pumps
External, Life Supporting Medical Devices
• e.g. heart pump external controller
External Devices
• e.g. patient monitoring, diagnostic equipment
HOW TO ORDER
MM02
A
100
J
C
T
2
A
Z
Size
Dielectric
Code
A = NP0 (C0G)
C = X7R
Capacitance
Code (In pF)
(2 significant
digits + number
of zeros)
for values <10pF:
letter R denotes
decimal point.
Example:
Capacitance
Tolerance
Failure Rate
C = Standard
Range
Termination
Finish
T = Plated Ni & Sn
(NP0 only)
Z = Flexiterm
(X7R only)
Packaging
2 = 7" Reel
Special
Code
Rated
MM02 = 0402
Voltage
MM03 = 0603
MM05 = 0805
MM06 = 1206
MM10 = 1210
MM08 = 1808
MM12 = 1812
MM20 = 2220
B = 0.1pF
4 = 13" Reel
A = Standard
Z = 10V
Y = 16V
3 = 25V
5 = 50V
1 = 100V
2 = 200V
V = 250V
7 = 500V
C = 0.25pF
D = 0.5pF
F = 1ꢀ (≥10pF)
G = 2ꢀ (≥10pF)
J = 5ꢀ
K = 10ꢀ
M = 20ꢀ
*Contact AVX
for others
*Contact AVX
for others
W
L
᭢
68pF = 680
8.2pF = 8R2
T
᭢
t
COMMERCIAL VS MM SERIES PROCESS COMPARISON
Commercial
MM Series
Standard part numbers; no restriction on
who purchases these parts
Minimum ceramic thickness of 0.020"
on all X7R product
Specific series part number, used to control
supply of product
Administrative
Design
Minimum ceramic thickness of 0.029" (0.74mm)
Side & end margins = 0.004" min
Cover layers = 0.003" min
Dicing
Side & end margins = 0.003" min
Lot Qualification
Destructive Physical
Analysis (DPA)
As per EIA RS469
Increased sample plan – stricter criteria
Visual/Cosmetic Quality
Standard process and inspection
100% inspection
Increased sampling for accelerated
wave solder on X7R and NP0 followed
by lot by lot reliability testing
Standard sampling for accelerated wave
solder on X7R dielectrics
Application Robustness
AVX will qualify and notify customers before
making any change to the following materials
or processes:
• Dielectric formulation, type, or supplier
• Metal formulation, type, or supplier
• Termination material formulation, type, or supplier
• Manufacturing equipment type
• Quality testing regime including sample size and
accept/ reject criteria
Required to inform customer of changes in:
• form
• fit
Design/Change Control
• function
124
113016
MM Series – MLCC for Medical Applications
NP0 (C0G) – Specifications & Test Methods
Parameter/Test
Operating Temperature Range
Capacitance
NP0 Specification Limits
-55ºC to +125ºC
Within specified tolerance
<30 pF: Q≥ 400+20 x Cap Value
≥30 pF: Q≥ 1000
Measuring Conditions
Temperature Cycle Chamber
Freq.: 1.0 MHz 10ꢀ for cap ≤ 1000 pF
1.0 kHz 10ꢀ for cap > 1000 pF
Voltage: 1.0Vrms .2V
Q
100,000MΩ or 1000MΩ - μF,
whichever is less
Charge device with rated voltage for
60 5 secs @ room temp/humidity
Charge device with 300ꢀ of rated voltage for
1-5 seconds, w/charge and discharge current
limited to 50 mA (max)
Insulation Resistance
Dielectric Strength
No breakdown or visual defects
Note: Charge device with 150ꢀ of rated
voltage for 500V devices.
Appearance
Capacitance
Variation
No defects
Deflection: 2mm
Test Time: 30 seconds
5ꢀ or .5 pF, whichever is greater
Resistance to
Flexure
Q
Meets Initial Values (As Above)
≥ Initial Value x 0.3
Stresses
Insulation
Resistance
≥ 95ꢀ of each terminal should be covered
with fresh solder
No defects, <25ꢀ leaching of either end terminal
Dip device in eutectic solder at 230 5ºC
for 5.0 0.5 seconds
Solderability
Appearance
Capacitance
Variation
≤
≤
≤
2.5ꢀ or .25 pF, whichever is greater
Dip device in eutectic solder at 260ºC for 60
seconds. Store at room temperature for 24
hours before measuring electrical properties.
2
Resistance to
Solder Heat
Q
Meets Initial Values (As Above)
Meets Initial Values (As Above)
Insulation
Resistance
Dielectric
Meets Initial Values (As Above)
No visual defects
Strength
Appearance
Capacitance
Variation
Step 1: -55ºC 2º
Step 2: Room Temp
30 3 minutes
≤ 3 minutes
2.5ꢀ or .25 pF, whichever is greater
Thermal
Shock
Q
Meets Initial Values (As Above)
Meets Initial Values (As Above)
Step 3: +125ºC 2º
Step 4: Room Temp
30 3 minutes
≤ 3 minutes
Insulation
Resistance
Dielectric
Repeat for 5 cycles and measure after
24 hours at room temperature
Meets Initial Values (As Above)
No visual defects
Strength
Appearance
Capacitance
Variation
3.0ꢀ or .3 pF, whichever is greater
Charge device with twice rated voltage in
test chamber set at 125ºC 2ºC
for 1000 hours (+48, -0).
≥ 30 pF:
≥10 pF, <30 pF:
<10 pF:
Q≥ 350
Q≥ 275 +5C/2
Q≥ 200 +10C
Q
Load Life
(C=Nominal Cap)
Insulation
Resistance
Dielectric
Remove from test chamber and stabilize at
room temperature for 24 hours
before measuring.
≥ Initial Value x 0.3 (See Above)
Meets Initial Values (As Above)
No visual defects
Strength
Appearance
Capacitance
Variation
≤
5.0ꢀ or .5 pF, whichever is greater
Store in a test chamber set at 85ºC 2ºC/
85ꢀ 5ꢀ relative humidity for 1000 hours
(+48, -0) with rated voltage applied.
≥ 30 pF:
≥10 pF, <30 pF:
<10 pF:
Q≥ 350
Q≥ 275 +5C/2
Q≥ 200 +10C
Load
Q
Humidity
Insulation
Resistance
Dielectric
Strength
Remove from chamber and stabilize at
room temperature for 24 2 hours
before measuring.
≥ Initial Value x 0.3 (See Above)
Meets Initial Values (As Above)
125
113016
MM Series – MLCC for Medical Applications
NP0/C0G Capacitance Range
PREFERRED SIZES ARE SHADED
SIZE
0603
0805
1206
WVDC
16
25
50
100
16
25
50
100
16
25
50
100
Cap 0.5
(pF) 1.0
1.2
0R5
1R0
1R2
1R5
1R8
2R2
2R7
3R3
3R9
4R7
5R6
6R8
8R2
100
120
150
180
220
270
330
390
470
560
680
820
101
121
151
181
221
271
331
391
471
561
681
821
102
122
152
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10
12
15
18
22
27
33
39
47
56
68
82
100
120
150
180
220
270
330
390
470
560
680
820
1000
1200
1500
WVDC
16
25
50
100
16
25
50
100
16
25
50
100
SIZE
0603
0805
1206
126
113016
MM Series – MLCC for Medical Applications
X7R Specifications and Test Methods
Parameter/Test
Operating Temperature Range
Capacitance
X7R Specification Limits
-55ºC to +125ºC
Measuring Conditions
Temperature Cycle Chamber
Within specified tolerance
≤ 10ꢀ for ≥ 50V DC rating
≤ 12.5ꢀ for 25V DC rating
≤ 12.5ꢀ for 25V and 16V DC rating
≤ 12.5ꢀ for ≤ 10V DC rating
100,000MΩ or 1000MΩ - μF,
whichever is less
Freq.: 1.0 kHz 10ꢀ
Voltage: 1.0Vrms .2V
Dissipation Factor
Charge device with rated voltage for
120 5 secs @ room temp/humidity
Charge device with 300ꢀ of rated voltage for
1-5 seconds, w/charge and discharge current
limited to 50 mA (max)
Insulation Resistance
Dielectric Strength
No breakdown or visual defects
Note: Charge device with 150ꢀ of rated
voltage for 500V devices.
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
No defects
Deflection: 2mm
Test Time: 30 seconds
≤
12ꢀ
Resistance to
Flexure
Meets Initial Values (As Above)
≥ Initial Value x 0.3
Stresses
≥ 95ꢀ of each terminal should be covered
with fresh solder
No defects, <25ꢀ leaching of either end terminal
Dip device in eutectic solder at 230 5ºC
for 5.0 0.5 seconds
Solderability
Appearance
Capacitance
Variation
≤
7.5ꢀ
Dip device in eutectic solder at 260ºC for 60
seconds. Store at room temperature for 24
hours before measuring electrical properties.
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
2
Resistance to
Solder Heat
Meets Initial Values (As Above)
Meets Initial Values (As Above)
Meets Initial Values (As Above)
No visual defects
Appearance
Capacitance
Variation
Step 1: -55ºC 2º
Step 2: Room Temp
30 3 minutes
≤ 3 minutes
≤
7.5ꢀ
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
Thermal
Shock
Meets Initial Values (As Above)
Meets Initial Values (As Above)
Step 3: +125ºC 2º
Step 4: Room Temp
30 3 minutes
≤ 3 minutes
Repeat for 5 cycles and measure after
24 2 hours at room temperature
Meets Initial Values (As Above)
No visual defects
Charge device with 1.5 rated voltage (≤ 10V) in
test chamber set at 125ºC 2ºC
for 1000 hours (+48, -0)
≤
12.5ꢀ
≤ Initial Value x 2.0 (See Above)
≥ Initial Value x 0.3 (See Above)
Load Life
Remove from test chamber and stabilize
at room temperature for 24 2 hours
before measuring.
Meets Initial Values (As Above)
No visual defects
Store in a test chamber set at 85ºC 2ºC/
85ꢀ 5ꢀ relative humidity for 1000 hours
(+48, -0) with rated voltage applied.
≤
12.5ꢀ
Load
Humidity
≤ Initial Value x 2.0 (See Above)
≥ Initial Value x 0.3 (See Above)
Meets Initial Values (As Above)
Remove from chamber and stabilize at
room temperature and humidity for
24 2 hours before measuring.
127
113016
MM Series – MLCC for Medical Applications
X7R Capacitance Range
PREFERRED SIZES ARE SHADED
SIZE
0402
0603
0805
1206
1210
1808
1812
2220
WVDC 16 25 50 10 16 25 50 100 200 10 16 25 50 100 200 250 10 16 25 50 100 200 250 500 10 16 25 50 100 200 250 500 50 100 200 50 100 200 250 25 50 100
Cap 220
221
271
331
391
471
561
681
821
102
122
152
182
222
272
332
392
472
562
682
822
103
123
153
183
223
273
333
393
473
563
683
823
104
124
154
224
334
474
564
684
824
105
125
155
pf
270
330
390
470
560
680
820
1000
1200
1500
1800
2200
2700
3300
3900
4700
5600
6800
8200
cap 0.010
uf
0.012
0.015
0.018
0.022
0.027
0.033
0.039
0.047
0.056
0.068
0.082
0.10
0.12
0.15
0.22
0.33
0.47
0.56
0.68
0.82
1.0
1.2
1.5
WVDC 16 25 50 10 16 25 50 100 200 10 16 25 50 100 200 250 10 16 25 50 100 200 250 500 10 16 25 50 100 200 250 500 50 100 200 50 100 200 250 25 50 100
SIZE
0402
0603
0805
1206
1210
1808
1812
2220
128
110116
Packaging of Chip Components
Automatic Insertion Packaging
TAPE & REEL QUANTITIES
All tape and reel specifications are in compliance with RS481.
4mm
0101
4,000
8mm
12mm
1808
Paper or Embossed Carrier
Embossed Only
0612, 0508, 0805, 1206,
1210
1812, 1825
2220, 2225
Paper Only
0101, 0201, 0306, 0402, 0603
Qty. per Reel/7" Reel
1,000, 2,000, 3,000 or 4,000, 10,000, 15,000, 20,000
Contact factory for exact quantity
3,000
500, 1,000
Contact factory for exact quantity
Qty. per Reel/13" Reel
5,000, 10,000, 50,000
Contact factory for exact quantity
10,000
4,000
REEL DIMENSIONS
Tape
A
Max.
B*
Min.
D*
Min.
N
Min.
W2
Max.
C
W1
W3
(1)
Size
1.80
1.5
13.0 0.5
20.2
60.0
4.35 0.3
7.95
4mm
8mm
(7.087)
(0.059)
(0.522 0.020)
(0.795)
(2.362)
(0.171 0.011)
(0.312)
7.90 Min.
14.4
(0.567)
8.40 -+01..05
(0.311)
10.9 Max.
(0.429)
(0.331 -+00..0059
)
)
13.0 +-00..2500
330
(12.992)
1.5
(0.059)
20.2
(0.795)
50.0
(1.969)
(0.512+-00..000280
)
11.9 Min.
(0.469)
15.4 Max.
(0.607)
12.4 -+02..00
18.4
(0.724)
12mm
(0.488 -+00..0079
Metric dimensions will govern.
English measurements rounded and for reference only.
(1) For tape sizes 16mm and 24mm (used with chip size 3640) consult EIA RS-481 latest revision.
129
REV 01
Embossed Carrier Configuration
4, 8 & 12mm Tape Only
Chip Orientation
4, 8 & 12mm Embossed Tape
Metric Dimensions Will Govern
CONSTANT DIMENSIONS
Tape Size
D0
E1
P0
2.0 0.04
P2
S1 Min.
1.075
(0.042)
0.60
T Max.
0.26
(0.010)
0.60
T1 Max.
0.80 0.04
0.90 0.05
1.00 0.02
0.06
(0.002)
0.10
4mm
(0.031 0.001) (0.035 0.001) (0.078 0.001) (0.039 0.0007)
1.50 -+00..010
8mm
& 12mm
1.75 0.10
4.0 0.10
2.0 0.05
(0.059 -+00..0004
)
(0.069 0.004) (0.157 0.004) (0.079 0.002)
(0.024)
(0.024)
(0.004)
VARIABLE DIMENSIONS
Tape Size
B1
Max.
D1
Min.
E2
Min.
F
P1
R
T2
W
Max.
A0 B0 K0
Min.
See Note 5 See Note 2
4.35
1.00
6.25
3.50 0.05
4.00 0.10
25.0
2.50 Max.
(0.098)
8.30
8mm
See Note 1
See Note 1
See Note 1
See Note 1
(0.171)
(0.039)
(0.246) (0.138 0.002) (0.157 0.004)
(0.984)
(0.327)
8.20
(0.323)
1.50
(0.059)
10.25
5.50 0.05
4.00 0.10
30.0
(1.181)
6.50 Max.
(0.256)
12.3
(0.484)
12mm
(0.404) (0.217 0.002) (0.157 0.004)
8mm
1/2 Pitch
4.35
(0.171)
1.00
(0.039)
6.25
3.50 0.05
2.00 0.10
25.0
(0.984)
2.50 Max.
(0.098)
8.30
(0.327)
(0.246) (0.138 0.002) (0.079 0.004)
12mm
Double
Pitch
8.20
(0.323)
1.50
(0.059)
10.25
5.50 0.05
8.00 0.10
30.0
(1.181)
6.50 Max.
(0.256)
12.3
(0.484)
(0.404) (0.217 0.002) (0.315 0.004)
NOTES:
2. Tape with or without components shall pass around radius “R” without damage.
1. The cavity defined by A0, B0, and K0 shall be configured to provide the following:
Surround the component with sufficient clearance such that:
3. Bar code labeling (if required) shall be on the side of the reel opposite the round sprocket holes.
Refer to EIA-556.
a) the component does not protrude beyond the sealing plane of the cover tape.
b) the component can be removed from the cavity in a vertical direction without mechanical
restriction, after the cover tape has been removed.
4. B1 dimension is a reference dimension for tape feeder clearance only.
5. If P1 = 2.0mm, the tape may not properly index in all tape feeders.
c) rotation of the component is limited to 20º maximum (see Sketches D & E).
d) lateral movement of the component is restricted to 0.5mm maximum (see Sketch F).
REV 01
130
Paper Carrier Configuration
8 & 12mm Tape Only
8 & 12mm Paper Tape
Metric Dimensions Will Govern
CONSTANT DIMENSIONS
Tape Size
D0
E
P0
P2
T1
G. Min.
R Min.
1.50 -+00..010
8mm
and
12mm
1.75 0.10
4.00 0.10
2.00 0.05
0.10
(0.004)
Max.
0.75
(0.030)
Min.
25.0 (0.984)
See Note 2
Min.
(0.059 -+00..0004
)
(0.069 0.004) (0.157 0.004) (0.079 0.002)
VARIABLE DIMENSIONS
P1
Tape Size
E2 Min.
F
W
A0 B0
See Note 1
T
See Note 4
8.00 -+00..1300
8mm
4.00 0.10
(0.157 0.004)
6.25
(0.246)
3.50 0.05
(0.138 0.002)
(0.315 +-00..000142
)
1.10mm
(0.043) Max.
for Paper Base
Tape and
4.00 0.10
(0.157 0.004)
10.25
(0.404)
5.50 0.05
(0.217 0.002) (0.472 0.012)
12.0 0.30
12mm
1.60mm
(0.063) Max.
for Non-Paper
Base Compositions
8.00 -+00..1300
8mm
1/2 Pitch
2.00 0.05
(0.079 0.002)
6.25
(0.246)
3.50 0.05
(0.138 0.002)
(0.315 +-00..000142
)
12mm
Double
Pitch
8.00 0.10
(0.315 0.004)
10.25
(0.404)
5.50 0.05
12.0 0.30
(0.217 0.002) (0.472 0.012)
NOTES:
2. Tape with or without components shall pass around radius “R” without damage.
1. The cavity defined by A0, B0, and T shall be configured to provide sufficient clearance
surrounding the component so that:
3. Bar code labeling (if required) shall be on the side of the reel opposite the sprocket
holes. Refer to EIA-556.
a) the component does not protrude beyond either surface of the carrier tape;
b) the component can be removed from the cavity in a vertical direction without
mechanical restriction after the top cover tape has been removed;
c) rotation of the component is limited to 20º maximum (see Sketches A & B);
d) lateral movement of the component is restricted to 0.5mm maximum
(see Sketch C).
4. If P1 = 2.0mm, the tape may not properly index in all tape feeders.
Bar Code Labeling Standard
AVX bar code labeling is available and follows latest version of EIA-556
REV 01
131
Basic Capacitor Formulas
I. Capacitance (farads)
XI. Equivalent Series Resistance (ohms)
.224 K A
E.S.R. = (D.F.) (Xc) = (D.F.) / (2 π fC)
English: C =
TD
XII. Power Loss (watts)
.0884 K A
Power Loss = (2 π fCV2) (D.F.)
Metric: C =
TD
XIII. KVA (Kilowatts)
II. Energy stored in capacitors (Joules, watt - sec)
KVA = 2 π fCV2 x 10-3
1
E = ⁄
2
CV2
XIV. Temperature Characteristic (ppm/°C)
III. Linear charge of a capacitor (Amperes)
Ct – C25
C25 (Tt – 25)
T.C. =
x 106
dV
dt
I = C
XV. Cap Drift (%)
C1 – C2
IV. Total Impedance of a capacitor (ohms)
Z = R2S + (X - X )2
C.D. =
x 100
C
L
C1
V. Capacitive Reactance (ohms)
XVI. Reliability of Ceramic Capacitors
1
x =
c
L0
Vt
X
Tt
Y
2 π fC
=
( ) (T )
Lt
Vo
VI. Inductive Reactance (ohms)
o
xL = 2 π fL
XVII. Capacitors in Series (current the same)
VII. Phase Angles:
Any Number:
1
1
1
1
---
Ideal Capacitors: Current leads voltage 90°
Ideal Inductors: Current lags voltage 90°
Ideal Resistors: Current in phase with voltage
=
+
C
C1
C2
C
T
N
C1 C2
VIII. Dissipation Factor (%)
Two: C =
T
C1 + C2
E.S.R.
D.F.= tan (loss angle) =
= (2 πfC) (E.S.R.)
XVIII. Capacitors in Parallel (voltage the same)
X
c
C = C1 + C2 --- + C
T
N
IX. Power Factor (%)
XIX. Aging Rate
P.F. = Sine (loss angle) = Cos (phase angle)
P.F. = (when less than 10%) = DF
f
A.R. = %D C/decade of time
XX. Decibels
db = 20 log
X. Quality Factor (dimensionless)
V1
V2
1
Q = Cotan (loss angle) =
D.F.
METRIC PREFIXES SYMBOLS
Pico
Nano
Micro
Milli
Deci
Deca
Kilo
Mega
Giga
Tera
X 10-12
X 10-9
X 10-6
X 10-3
X 10-1
X 10+1
X 10+3
X 10+6
X 10+9
X 10+12
K
A
= Dielectric Constant
= Area
f
= frequency
= Inductance
= Loss angle
= Phase angle
Lt
= Test life
L
␦
Vt
Vo
Tt
= Test voltage
TD = Dielectric thickness
= Operating voltage
= Test temperature
= Operating temperature
V
t
= Voltage
f
= time
X & Y = exponent effect of voltage and temp.
To
R
= Series Resistance
Lo
= Operating life
s
132
General Description
Basic Construction – A multilayer ceramic (MLC)
capacitor is a monolithic block of ceramic containing two
sets of offset, interleaved planar electrodes that extend to
two opposite surfaces of the ceramic dielectric. This simple
structure requires a considerable amount of sophistication,
both in material and manufacture, to produce it in the quality
and quantities needed in today’s electronic equipment.
Electrode
Ceramic Layer
End Terminations
Terminated
Edge
Terminated
Edge
Margin
Electrodes
Multilayer Ceramic Capacitor
Figure 1
Formulations – Multilayer ceramic capacitors are available
in both Class 1 and Class 2 formulations. Temperature
compensating formulation are Class 1 and temperature
stable and general application formulations are classified
as Class 2.
Class 2 – EIA Class 2 capacitors typically are based on the
chemistry of barium titanate and provide a wide range of
capacitance values and temperature stability. The most
commonly used Class 2 dielectrics are X7R and Y5V. The
X7R provides intermediate capacitance values which vary
only 15ꢀ over the temperature range of -55°C to 125°C. It
finds applications where stability over a wide temperature
range is required.
Class 1 – Class 1 capacitors or temperature compensating
capacitors are usually made from mixtures of titanates
where barium titanate is normally not a major part of the
mix. They have predictable temperature coefficients and
in general, do not have an aging characteristic. Thus they
are the most stable capacitor available. The most popular
Class 1 multilayer ceramic capacitors are C0G (NP0)
temperature compensating capacitors (negative-positive
0 ppm/°C).
The Y5V provides the highest capacitance values and is
used in applications where limited temperature changes are
expected. The capacitance value for Y5V can vary from
22ꢀ to -82ꢀ over the -30°C to 85°C temperature range.
All Class 2 capacitors vary in capacitance value under the
influence of temperature, operating voltage (both AC and
DC), and frequency. For additional information on
performance changes with operating conditions, consult
AVX’s software, SpiCap.
133
General Description
Effects of Voltage – Variations in voltage have little effect
on Class 1 dielectric but does affect the capacitance and
dissipation factor of Class 2 dielectrics. The application of DC
voltage reduces both the capacitance and dissipation factor
while the application of an AC voltage within a reasonable
range tends to increase both capacitance and dissipation
|factor readings. If a high enough AC voltage is applied,
eventually it will reduce capacitance just as a DC voltage will.
Figure 2 shows the effects of AC voltage.
Table 1: EIA and MIL Temperature Stable and General
Application Codes
EIA CODE
Percent Capacity Change Over Temperature Range
RS198
Temperature Range
X7
X6
X5
Y5
Z5
-55°C to +125°C
-55°C to +105°C
-55°C to +85°C
-30°C to +85°C
+10°C to +85°C
Cap. Change vs. A.C. Volts
X7R
Code
Percent Capacity Change
D
E
F
P
R
S
T
3ꢀ3ꢁ
4ꢀ7ꢁ
7ꢀ5ꢁ
10ꢁ
15ꢁ
22ꢁ
+22ꢁ, -33ꢁ
+22ꢁ, - 56ꢁ
+22ꢁ, -82ꢁ
U
V
EXAMPLE – A capacitor is desired with the capacitance value at 25°C to
increase no more than 7ꢀ5ꢁ or decrease no more than 7ꢀ5ꢁ from
-30°C to +85°Cꢀ EIA Code will be Y5Fꢀ
Figure 2
Capacitor specifications specify the AC voltage at which to
measure (normally 0.5 or 1 VAC) and application of the wrong
voltage can cause spurious readings. Figure 3 gives the volt-
age coefficient of dissipation factor for various AC voltages at
1 kilohertz. Applications of different frequencies will affect the
percentage changes versus voltages.
MIL CODE
Symbol
Temperature Range
A
B
C
-55°C to +85°C
-55°C to +125°C
-55°C to +150°C
D.F. vs. A.C. Measurement Volts
X7R
Cap. Change
Zero Volts
Cap. Change
Rated Volts
Symbol
R
S
W
X
Y
Z
+15ꢁ, -15ꢁ
+22ꢁ, -22ꢁ
+22ꢁ, -56ꢁ
+15ꢁ, -15ꢁ
+30ꢁ, -70ꢁ
+20ꢁ, -20ꢁ
+15ꢁ, -40ꢁ
+22ꢁ, -56ꢁ
+22ꢁ, -66ꢁ
+15ꢁ, -25ꢁ
+30ꢁ, -80ꢁ
+20ꢁ, -30ꢁ
Temperature characteristic is specified by combining range and change
symbols, for example BR or AWꢀ Specification slash sheets indicate the
characteristic applicable to a given style of capacitorꢀ
In specifying capacitance change with temperature for Class
2 materials, EIA expresses the capacitance change over an
operating temperature range by a 3 symbol code. The first
symbol represents the cold temperature end of the tempera-
ture range, the second represents the upper limit of the
operating temperature range and the third symbol represents
the capacitance change allowed over the operating temper-
ature range. Table 1 provides a detailed explanation of the EIA
system.
Figure 3
Typical effect of the application of DC voltage is shown in
Figure 4. The voltage coefficient is more pronounced for
higher K dielectrics. These figures are shown for room tem-
perature conditions. The combination characteristic known as
voltage temperature limits which shows the effects of rated
voltage over the operating temperature range is shown in
Figure 5 for the military BX characteristic.
134
General Description
capacitors and is why re-reading of capacitance after 12 or
24 hours is allowed in military specifications after dielectric
strength tests have been performed.
Typical Cap. Change vs. D.C. Volts
X7R
5
0
Typical Curve of Aging Rate
X7R
+1.5
0
-5
-10
-15
-20
-1.5
25%
50%
75%
100%
-3.0
-4.5
Percent Rated Volts
Figure 4
Typical Cap. Change vs. Temperature
X7R
-6.0
-7.5
1
10
100 1000 10,000 100,000
Hours
Characteristic Max. Aging Rate %/Decade
None
2
7
C0G (NP0)
X7R, X5R
Y5V
Figure 6
Effects of Frequency – Frequency affects capacitance
and impedance characteristics of capacitors. This effect is
much more pronounced in high dielectric constant ceramic
formulation than in low K formulations. AVX’s SpiCap
software generates impedance, ESR, series inductance,
series resonant frequency and capacitance all as functions
of frequency, temperature and DC bias for standard chip
sizes and styles. It is available free from AVX and can be
downloaded for free from AVX website: www.avx.com.
Figure 5
Effects of Time – Class 2 ceramic capacitors change
capacitance and dissipation factor with time as well as
temperature, voltage and frequency. This change with time is
known as aging. Aging is caused by a gradual re-alignment
of the crystalline structure of the ceramic and produces an
exponential loss in capacitance and decrease in dissipation
factor versus time. A typical curve of aging rate for
semistable ceramics is shown in Figure 6.
If a Class 2 ceramic capacitor that has been sitting on the
shelf for a period of time, is heated above its curie point,
1
(125°C for 4 hours or 150°C for ⁄
2
hour will suffice) the part will
de-age and return to its initial capacitance and dissi-pation
factor readings. Because the capacitance changes
rapidly, immediately after de-aging, the basic capacitance
measurements are normally referred to a time period
sometime after the de-aging process. Various manufacturers
use different time bases but the most popular one is one day
or twenty-four hours after “last heat.” Change in the aging
curve can be caused by the application of voltage and
other stresses. The possible changes in capacitance due to
de-aging by heating the unit explain why capacitance changes
are allowed after test, such as temperature cycling, moisture
resistance, etc., in MIL specs. The application of high voltages
such as dielectric withstanding voltages also tends to de-age
135
General Description
Effects of Mechanical Stress – High “K” dielectric ceramic
capacitors exhibit some low level piezoelectric reactions
under mechanical stress. As a general statement, the piezo-
electric output is higher, the higher the dielectric constant of
the ceramic. It is desirable to investigate this effect before
using high “K” dielectrics as coupling capacitors in extremely
low level applications.
Energy Stored – The energy which can be stored in a
capacitor is given by the formula:
E = 1⁄ CV2
2
E = energy in joules (watts-sec)
V = applied voltage
C = capacitance in farads
Reliability – Historically ceramic capacitors have been one
of the most reliable types of capacitors in use today.
The approximate formula for the reliability of a ceramic
capacitor is:
Potential Change – A capacitor is a reactive component
which reacts against a change in potential across it. This is
shown by the equation for the linear charge of a capacitor:
Lo
Lt
Vt
X
Tt
To
Y
=
͑ ͑
͑ ͑
Vo
dV
dt
Iideal
=
C
where
Lo = operating life
Lt = test life
Vt = test voltage
Tt = test temperature and
To = operating temperature
in °C
where
I = Current
C = Capacitance
Vo = operating voltage
X,Y = see text
dV/dt = Slope of voltage transition across capacitor
Thus an infinite current would be required to instantly change
the potential across a capacitor. The amount of current a
capacitor can “sink” is determined by the above equation.
Historically for ceramic capacitors exponent X has been
considered as 3. The exponent Y for temperature effects
typically tends to run about 8.
Equivalent Circuit – A capacitor, as a practical device,
exhibits not only capacitance but also resistance and
inductance. A simplified schematic for the equivalent circuit
is:
A capacitor is a component which is capable of storing
electrical energy. It consists of two conductive plates (elec-
trodes) separated by insulating material which is called the
dielectric. A typical formula for determining capacitance is:
C = Capacitance
Rs = Series Resistance
L = Inductance
Rp = Parallel Resistance
.224 KA
C =
t
C = capacitance (picofarads)
K = dielectric constant (Vacuum = 1)
A = area in square inches
t = separation between the plates in inches
(thickness of dielectric)
.224 = conversion constant
Reactance – Since the insulation resistance (Rp) is nor-
mally very high, the total impedance of a capacitor is:
(.0884 for metric system in cm)
Capacitance – The standard unit of capacitance is the
farad. A capacitor has a capacitance of 1 farad when 1
coulomb charges it to 1 volt. One farad is a very large unit
and most capacitors have values in the micro (10-6), nano
(10-9) or pico (10-12) farad level.
Z = R2+ (XC - XL )2
S
ͱ
where
Z = Total Impedance
R = Series Resistance
XCs = Capacitive Reactance =
1
Dielectric Constant – In the formula for capacitance given
above the dielectric constant of a vacuum is arbitrarily chosen
as the number 1. Dielectric constants of other materials are
then compared to the dielectric constant of a vacuum.
2 π fC
XL = Inductive Reactance = 2 π fL
The variation of a capacitor’s impedance with frequency
determines its effectiveness in many applications.
Dielectric Thickness – Capacitance is indirectly proportional
to the separation between electrodes. Lower voltage require-
ments mean thinner dielectrics and greater capacitance per
volume.
Phase Angle – Power Factor and Dissipation Factor are
often confused since they are both measures of the loss in
a capacitor under AC application and are often almost
identical in value. In a “perfect” capacitor the current in the
capacitor will lead the voltage by 90°.
Area – Capacitance is directly proportional to the area of the
electrodes. Since the other variables in the equation are
usually set by the performance desired, area is the easiest
parameter to modify to obtain a specific capacitance within
a material group.
136
General Description
di
dt
The
seen in current microprocessors can be as high as
0.3 A/ns, and up to 10A/ns. At 0.3 A/ns, 100pH of parasitic
inductance can cause a voltage spike of 30mV. While this
does not sound very drastic, with the Vcc for
microprocessors decreasing at the current rate, this can be
a fairly large percentage.
Another important, often overlooked, reason for knowing
the parasitic inductance is the calculation of the resonant
frequency. This can be important for high frequency, by-
pass capacitors, as the resonant point will give the most
signal attenuation. The resonant frequency is calculated
from the simple equation:
In practice the current leads the voltage by some other phase
angle due to the series resistance RS. The complement of this
angle is called the loss angle and:
fres =
1
ͱ
2 LC
Insulation Resistance – Insulation Resistance is the
resistance measured across the terminals of a capacitor
and consists principally of the parallel resistance RP shown
in the equivalent circuit. As capacitance values and hence
the area of dielectric increases, the I.R. decreases and
hence the product (C x IR or RC) is often specified in ohm
farads or more commonly megohm-microfarads. Leakage
current is determined by dividing the rated voltage by IR
(Ohm’s Law).
Power Factor (P.F.) = Cos or Sine ␦
f
Dissipation Factor (D.F.) = tan ␦
for small values of ␦ the tan and sine are essentially equal
which has led to the common interchangeability of the two
terms in the industry.
Equivalent Series Resistance – The term E.S.R. or
Equivalent Series Resistance combines all losses both
series and parallel in a capacitor at a given frequency so
that the equivalent circuit is reduced to a simple R-C series
connection.
Dielectric Strength – Dielectric Strength is an expression
of the ability of a material to withstand an electrical stress.
Although dielectric strength is ordinarily expressed in volts, it
is actually dependent on the thickness of the dielectric and
thus is also more generically a function of volts/mil.
Dielectric Absorption – A capacitor does not discharge
instantaneously upon application of a short circuit, but
drains gradually after the capacitance proper has been
discharged. It is common practice to measure the dielectric
absorption by determining the “reappearing voltage” which
appears across a capacitor at some point in time after it has
been fully discharged under short circuit conditions.
Dissipation Factor – The DF/PF of a capacitor tells what
percent of the apparent power input will turn to heat in the
capacitor.
Corona – Corona is the ionization of air or other vapors
which causes them to conduct current. It is especially
prevalent in high voltage units but can occur with low voltages
as well where high voltage gradients occur. The energy
discharged degrades the performance of the capacitor and
can in time cause catastrophic failures.
E.S.R.
XC
Dissipation Factor =
= (2 π fC) (E.S.R.)
The watts loss are:
Watts loss = (2 π fCV2) (D.F.)
Very low values of dissipation factor are expressed as their
reciprocal for convenience. These are called the “Q” or
Quality factor of capacitors.
Parasitic Inductance – The parasitic inductance of
capacitors is becoming more and more important in the
decoupling of today’s high speed digital systems. The
relationship between the inductance and the ripple voltage
induced on the DC voltage line can be seen from the simple
inductance equation:
di
dt
V = L
137
Surface Mounting Guide
MLC Chip Capacitors
REFLOW SOLDERING
Case Size
0201
0402
0603
0805
1206
1210
1808
1812
1825
2220
2225
D1
D2
D3
D4
D5
0.85 (0.033)
1.70 (0.067)
2.30 (0.091)
3.00 (0.118)
4.00 (0.157)
4.00 (0.157)
5.60 (0.220)
5.60 (0.220)
5.60 (0.220)
6.60 (0.260)
6.60 (0.260)
0.30 (0.012)
0.60 (0.024)
0.80 (0.031)
1.00 (0.039)
1.00 (0.039)
1.00 (0.039)
1.00 (0.039)
1.00 (0.039)
1.00 (0.039)
1.00 (0.039)
1.00 (0.039)
0.25 (0.010)
0.50 (0.020)
0.70 (0.028)
1.00 (0.039)
2.00 (0.079)
2.00 (0.079)
3.60 (0.142)
3.60 (0.142)
3.60 (0.142)
4.60 (0.181)
4.60 (0.181)
0.30 (0.012)
0.60 (0.024)
0.80 (0.031)
1.00 (0.039)
1.00 (0.039)
1.00 (0.039)
1.00 (0.039)
1.00 (0.039)
1.00 (0.039)
1.00 (0.039)
1.00 (0.039)
0.35 (0.014)
0.50 (0.020)
0.75 (0.030)
1.25 (0.049)
1.60 (0.063)
2.50 (0.098)
2.00 (0.079)
3.00 (0.118)
6.35 (0.250)
5.00 (0.197)
6.35 (0.250)
Dimensions in millimeters (inches)
Component Pad Design
Component pads should be designed to achieve good
solder filets and minimize component movement during
reflow soldering. Pad designs are given below for the most
common sizes of multilayer ceramic capacitors for both
wave and reflow soldering. The basis of these designs is:
• Pad width equal to component width. It is permissible to
decrease this to as low as 85ꢀ of component width but it
is not advisable to go below this.
• Pad overlap 0.5mm beneath component.
• Pad extension 0.5mm beyond components for reflow and
1.0mm for wave soldering.
WAVE SOLDERING
Case Size
0603
D1
D2
D3
D4
D5
3.10 (0.12)
4.00 (0.15)
5.00 (0.19)
1.20 (0.05)
1.50 (0.06)
1.50 (0.06)
0.70 (0.03)
1.00 (0.04)
2.00 (0.09)
1.20 (0.05)
1.50 (0.06)
1.50 (0.06)
0.75 (0.03)
1.25 (0.05)
1.60 (0.06)
0805
1206
Dimensions in millimeters (inches)
Component Spacing
Preheat & Soldering
For wave soldering components, must be spaced sufficiently
far apart to avoid bridging or shadowing (inability of solder
to penetrate properly into small spaces). This is less
important for reflow soldering but sufficient space must be
allowed to enable rework should it be required.
The rate of preheat should not exceed 4°C/second to
prevent thermal shock. A better maximum figure is about
2°C/second.
For capacitors size 1206 and below, with a maximum
thickness of 1.25mm, it is generally permissible to allow a
temperature differential from preheat to soldering of 150°C.
In all other cases this differential should not exceed 100°C.
For further specific application or process advice, please
consult AVX.
Cleaning
Care should be taken to ensure that the capacitors are
thoroughly cleaned of flux residues especially the space
beneath the capacitor. Such residues may otherwise
become conductive and effectively offer a low resistance
bypass to the capacitor.
Ultrasonic cleaning is permissible, the recommended
conditions being 8 Watts/litre at 20-45 kHz, with a process
cycle of 2 minutes vapor rinse, 2 minutes immersion in the
ultrasonic solvent bath and finally 2 minutes vapor rinse.
138
Surface Mounting Guide
Recommended Soldering Profiles
Recommended Reflow Profiles
Pb Free Recommended
REFLOW SOLDER PROFILES
AVX RoHS compliant products utilize termination
finishes (e.g.Sn or SnAg) that are compatible
275
250
Pb Free Max with care
Sn Pb Recommended
225
with all Pb-Free soldering systems and are fully
200
reverse compatible with SnPb soldering systems.
A recommended SnPb profile is shown for
comparison; for Pb-Free soldering, IPC/JEDECJ-
STD-020C may be referenced. The upper line in
175
150
125
100
the chart shows the maximum envelope to which
products are qualified (typically 3x reflow cycles
75
at 260ºC max). The center line gives the
50
recommended profile for optimum wettability and
soldering in Pb-Free Systems.
25
0
20
40
60
80 100 120 140 160 180 200 220 240 260 280 300 320 340 360 380 400 420
Time / secs
Preheat:
The pre-heat stabilizes the part and reduces the
temperature differential prior to reflow. The initial ramp to
125ºC may be rapid, but from that point (2-3)ºC/sec is
recommended to allow ceramic parts to heat uniformly and
plastic encapsulated parts to stabilize through the glass
transition temperature of the body (~ 180ºC).
Wetting Force at 2nd Sec. (higher is better)
0.40
0.30
0.20
SnPb - Sn60Pb40
Sn - Sn60Pb40
0.10
0.00
Sn-Sn3.5Ag0.7Cu
Sn-Sn2.5Ag1Bi0.5Cu
Sn-Sn0.7Cu
-0.10
-0.20
-0.30
-0.40
Reflow:
In the reflow phase, the maximum recommended time
> 230ºC is 40secs. Time at peak reflow is 10secs max.;
optimum reflow is achieved at 250ºC, (see wetting balance
chart opposite) but products are qualified to 260ºC max.
Please reference individual product datasheets for
maximum limits
200
210
220
230
240
250
260
270
Temperature of Solder [C]
IMPORTANT NOTE: Typical Pb-Free reflow solders have a
more dull and grainy appearance compared to traditional
SnPb. Elevating the reflow temperature will not change this,
but extending the cool down can help improve the visual
appearance of the joint.
Cool Down:
Cool down should not be forced and 6ºC/sec is
recommended. A slow cool down will result in a finer grain
structure of the reflow solder in the solder fillet.
WAVE SOLDER PROFILES
For wave solder, there is no change in the recommended
wave profile; all standard Pb-Free (SnCu/SnCuAg) systems
operate at the same 260ºC max recommended for SnPb
systems.
Recommended Soldering Profiles
275
225
175
Preheat:
This is more important for wave solder; a higher
temperature preheat will reduce the thermal shock to SMD
parts that are immersed (please consult individual product
data sheets for SMD parts that are suited to wave solder).
SMD parts should ideally be heated from the bottom-Side
prior to wave. PTH (Pin through hole) parts on the topside
should not be separately heated.
125
Wave
75
Preheat
Cool Down
Wave:
25
250ºC – 260ºC recommended for optimum solderability.
0
50
100
150
200
250
300
350
400
Cool Down:
Time / seconds
As with reflow solder, cool down should not be forced and
6ºC/sec is recommended. Any air knives at the end of the
2nd wave should be heated.
139
Surface Mounting Guide
MLC Chip Capacitors
handling should ensure that abrasion and mechanical shock
are minimized. Taped and reeled components provides the
ideal medium for direct presentation to the placement
machine. Any mechanical shock should be minimized during
handling chip multilayer ceramic capacitors.
APPLICATION NOTES
Storage
The components should be stored in their “as received
packaging” where possible. If the components are removed
from their original packaging then they should be stored in
an airtight container (e.g. a heat sealed plastic bag) with
desiccant (e.g. silica gel). Storage area temperature should
be kept between +5 degrees C and +30 degrees C with
humidity < 70ꢀ RH. Storage atmosphere must be free of
gas containing sulfur and chlorine. Avoid exposing the
product to saline moisture or to temperature changes that
might result in the formation of condensation. To assure
good solderability performance we recommend that the
product be used within 6 months from our shipping date,
but can be used for up to 12 months. Chip capacitors may
crack if exposed to hydrogen (H2) gas while sealed or if
coated with silicon, which generates hydrogen gas.
Preheat
It is important to avoid the possibility of thermal shock during
soldering and carefully controlled preheat is therefore
required. The rate of preheat should not exceed 4°C/second
and a target figure 2°C/second is recommended. Although
an 80°C to 120°C temperature differential is preferred,
recent developments allow a temperature differential
between the component surface and the soldering temper-
ature of 150°C (Maximum) for capacitors of 1210 size and
below with a maximum thickness of 1.25mm. The user is
cautioned that the risk of thermal shock increases as chip
size or temperature differential increases.
Soldering
Solderability
Mildly activated rosin fluxes are preferred. The minimum
amount of solder to give a good joint should be used.
Excessive solder can lead to damage from the stresses
caused by the difference in coefficients of expansion
between solder, chip and substrate. AVX terminations are
suitable for all wave and reflow soldering systems. If hand
soldering cannot be avoided, the preferred technique is the
utilization of hot air soldering tools.
Terminations to be well soldered after immersion in a 60/40
tin/lead solder bath at 235 5°C for 2 1 seconds.
Leaching
Terminations will resist leaching for at least the immersion
times and conditions shown below.
Solder
Tin/Lead/Silver Temp. °C
60/40/0 260
Solder
Immersion Time
Seconds
Termination Type
Cooling
Nickel Barrier
5
30
1
Natural cooling in air is preferred, as this minimizes stresses
within the soldered joint. When forced air cooling is used,
cooling rate should not exceed 4°C/second. Quenching
is not recommended but if used, maximum temperature
differentials should be observed according to the preheat
conditions above.
Lead-Free Wave Soldering
The recommended peak temperature for lead-free wave
soldering is 250°C-260°C for 3-5 seconds. The other
parameters of the profile remains the same as above.
The following should be noted by customers changing from
lead based systems to the new lead free pastes.
Cleaning
a) The visual standards used for evaluation of solder joints
will need to be modified as lead free joints are not as
bright as with tin-lead pastes and the fillet may not be as
large.
Flux residues may be hygroscopic or acidic and must be
removed. AVX MLC capacitors are acceptable for use with
all of the solvents described in the specifications MIL-STD-
202 and EIA-RS-198. Alcohol based solvents are acceptable
and properly controlled water cleaning systems are also
acceptable. Many other solvents have been proven successful,
and most solvents that are acceptable to other components
on circuit assemblies are equally acceptable for use with
ceramic capacitors.
b) Lead-free solder pastes do not allow the same self
alignment as lead containing systems. Standard
mounting pads are acceptable, but machine set up may
need to be modified.
General
Prevention of Metallic Migration
Surface mounting chip multilayer ceramic capacitors
are designed for soldering to printed circuit boards or other
substrates. The construction of the components is such that
they will withstand the time/temperature profiles used in both
wave and reflow soldering methods.
Note that when components with Sn plating on the end
terminations are to be used in applications that are likely to
experience conditions of high humidity under bias voltage,
we strongly recommend that the circuit boards be
conformally coated to protect the Sn from moisture that
might lead to migration and eventual current leakage.
Handling
Chip multilayer ceramic capacitors should be handled with
care to avoid damage or contamination from perspiration
and skin oils. The use of tweezers or vacuum pick ups
is strongly recommended for individual components. Bulk
When using Capacitor Arrays we recommend that there is
no differential in applied voltage between adjacent elements.
140
Surface Mounting Guide
MLC Chip Capacitors
POST SOLDER HANDLING
Once SMP components are soldered to the board, any
bending or flexure of the PCB applies stresses to the
soldered joints of the components. For leaded devices, the
stresses are absorbed by the compliancy of the metal leads
and generally don’t result in problems unless the stress is
large enough to fracture the soldered connection.
Ceramic capacitors are more susceptible to such stress
because they don’t have compliant leads and are brittle in
nature. The most frequent failure mode is low DC resistance
or short circuit. The second failure mode is significant loss
of capacitance due to severing of contact between sets of
the internal electrodes.
Type A:
Angled crack between bottom of device to top of solder jointꢀ
Cracks caused by mechanical flexure are very easily
identified and generally take one of the following two
general forms:
Mechanical cracks are often hidden underneath the
termination and are difficult to see externally. However, if
one end termination falls off during the removal process
from PCB, this is one indication that the cause of failure was
excessive mechanical stress due to board warping.
Type B:
Fracture from top of device to bottom of deviceꢀ
141
Surface Mounting Guide
MLC Chip Capacitors
COMMON CAUSES OF
REWORKING OF MLCS
MECHANICAL CRACKING
Thermal shock is common in MLCs that are manually
attached or reworked with a soldering iron. AVX strongly
recommends that any reworking of MLCs be done with hot
air reflow rather than soldering irons. It is practically
impossible to cause any thermal shock in ceramic
capacitors when using hot air reflow.
The most common source for mechanical stress is board
depanelization equipment, such as manual breakapart, v-
cutters and shear presses. Improperly aligned or dull cutters
may cause torqueing of the PCB resulting in flex stresses
being transmitted to components near the board edge.
Another common source of flexural stress is contact during
parametric testing when test points are probed. If the PCB
is allowed to flex during the test cycle, nearby ceramic
capacitors may be broken.
However direct contact by the soldering iron tip often
causes thermal cracks that may fail at a later date. If rework
by soldering iron is absolutely necessary, it is recommended
that the wattage of the iron be less than 30 watts and the
tip temperature be <300ºC. Rework should be performed
by applying the solder iron tip to the pad and not directly
contacting any part of the ceramic capacitor.
A third common source is board to board connections at
vertical connectors where cables or other PCBs are
connected to the PCB. If the board is not supported during
the plug/unplug cycle, it may flex and cause damage to
nearby components.
Special care should also be taken when handling large (>6"
on a side) PCBs since they more easily flex or warp than
smaller boards.
Preferred Method - No Direct Part Contact
Poor Method - Direct Contact with Part
PCB BOARD DESIGN
To avoid many of the handling problems, AVX recommends that MLCs be located at least .2" away from nearest edge of board.
However when this is not possible, AVX recommends that the panel be routed along the cut line, adjacent to where the MLC is
located.
No Stress Relief for MLCs
Routed Cut Line Relieves Stress on MLC
142
AMERICAS
EUROPE
ASIA-PACIFIC
ASIA-KED
(KYOCERA Electronic Devices)
AVX Greenville, SC
Tel: 864-967-2150
AVX/Japan
Tel: +81-740-32-1250
KED Hong Kong Ltd.
Tel: +852-2305-1080/1223
AVX Limited, England
Tel: +44-1276-697000
AVX/Kyocera (S) Pte Ltd.,
Singapore
KED Hong Kong Ltd.
Shenzen
AVX S.A.S., France
Tel: +33-1-69-18-46-00
Tel: +65-6286-7555
Tel: +86-755-3398-9600
AVX GmbH, Germany
Tel: +49-0811-95949-0
AVX/Kyocera, Asia, Ltd.,
Hong Kong
KED Company Ltd.
Shanghai
Tel: +852-2363-3303
Tel: +86-21-3255-1833
AVX SRL, Italy
Tel: +39-02-614-571
AVX/Kyocera Yuhan Hoesa,
South Korea
KED Hong Kong Ltd.
Beijing
Tel: +86-10-5869-4655
AVX Czech Republic
Tel: +420-57-57-57-521
Tel: +82-2785-6504
AVX/Kyocera HK Ltd.,
Taiwan
Tel: +886-2-2656-0258
KED Taiwan Ltd.
Tel: +886-2-2950-0268
AVX/ELCO UK
Tel: +44-1638-675000
KED Korea Yuhan
ELCO Europe GmbH
Tel: +49-2741-299-0
AVX/Kyocera (M) Sdn Bhd,
Malaysia
Hoesa, South Korea
Tel: +82-2-783-3604/6126
Tel: +60-4228-1190
AVX S.A., Spain
Tel: +34-91-63-97-197
KED (S) Pte Ltd.
Singapore
Tel: +65-6509-0328
AVX/Kyocera International
Trading Co. Ltd.,
Shanghai
AVX Benelux
Tel: +31-187-489-337
Tel: +86-21-3255 1933
Kyocera Corporation
Japan
Tel: +81-75-604-3449
AVX/Kyocera Asia Ltd.,
Shenzen
Tel: +86-755-3336-0615
AVX/Kyocera International
Trading Co. Ltd.,
Beijing
Tel: +86-10-6588-3528
AVX/Kyocera India
Liaison Office
Tel: +91-80-6450-0715
Contact:
A KYOCERA GROUP COMPANY
http://www.avx.com
S-MLCC1117-C
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